XC3S50-4VQ100I - 50K Gate Spartan-3 FPGA | AMD
MPN: XC3S50-4VQ100I ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
XC3S50-4VQ100I Overview
An FPGA is a programmable semiconductor in the semiconductor and digital-logic hierarchy. Its configurable logic blocks, programmable interconnect, block RAM, and I/O resources let engineers implement parallel data paths, control logic, signal processing, and system interfaces in one device. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed during development and field updates when the architecture permits it.
The XC3S50 provides 1,728 logic cells and 50,000 system gates, making it suited to compact control, interface, communications, instrumentation, and embedded-logic designs. Its 63 user I/Os provide connections for digital control, status, clocks, data buses, and serial peripherals. A 1.2 V core operating voltage reduces system power requirements, while the listed 2.5 V and 3.3 V supplies support associated I/O requirements where those supply rails are applicable to the selected configuration.
The Spartan-3 architecture is intended for cost-sensitive designs that require programmable hardware without the resource level of a larger FPGA. The supplied data reports 90 nm process technology and a 630 MHz device figure, but achievable system timing remains design-dependent. External memory interfaces, clocking, constraints, I/O standards, routing congestion, and timing closure determine actual system performance rather than a single advertised device frequency.
Typical uses include industrial automation, test and measurement, consumer electronics, communications control, embedded instrumentation, and general-purpose digital signal processing. Because this is an older FPGA family, engineers should confirm tool support, stock, lifecycle status, configuration-device support, and the exact pinout before beginning a new production design. The verified data does not establish whether it is currently active or discontinued.
PCB design must preserve the 100-pin package footprint and exact I/O assignments. Decoupling, configuration startup, clock routing, I/O standards, and signal-integrity constraints should follow the relevant Xilinx or AMD device documentation. Do not treat the conflicting package descriptions in secondary listings as authoritative; the target is identified as a 100-pin TQFP/VTQFP device.
This page combines verified distributor specifications, cross-reference findings, practical design guidance, and candid limitations. It distinguishes confirmed values from missing technical data so procurement and engineering teams can evaluate the FPGA without conflating package variants or assuming compatibility that the supplied evidence does not establish.
Drop-in alternatives for XC3S50-4VQ100I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC3S50-4VQ100I (same form factor and footprint) — differing in Device Type, Logic Cells, Package, System Gates, Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC3S50-4VQG100I
✅ Drop-In📋 Reference alternative (not in catalog)
XC3S50-4VQG100C
✅ Drop-In📋 Reference alternative (not in catalog)
XC3S50A-4VQ100I
✅ Drop-In📋 Reference alternative (not in catalog)
XC3S50-4VQ100I Maximum Ratings & Electrical Characteristics
| Device Type | Spartan-3 Field Programmable Gate Array (FPGA) |
| System Gates | 50,000 |
| Logic Cells | 1,728 |
| User I/O | 63 |
| Package | 100-pin TQFP/VTQFP |
| Core Supply Voltage | 1.2 V |
| I/O or Associated Supply Voltage | 2.5 V and 3.3 V listed |
| Speed Grade | -4 |
| Temperature Grade | Industrial grade, I suffix |
| Maximum Frequency | 630 MHz |
| Process Technology | 90 nm |
| Device Family | Spartan-3 |
| Mounting Type | Surface mount |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
XC3S50-4VQ100I 100-pin tqfp/vtqfp Pin Configuration Guide
Pin configuration for XC3S50-4VQ100I (100-pin tqfp/vtqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC3S50-4VQ100I.
Refer to the datasheet for full pin configuration.
Typical Applications
XC3S50-4VQ100I is suitable for 6 applications: Industrial Automation Controller, Test and Measurement Instrumentation, Communications Interface and Protocol Bridge, Embedded Instrumentation and Data Logging, Consumer and Embedded Digital Logic, Digital Signal Processing Front End.
Industrial Automation Controller
The XC3S50-4VQ100I fits compact industrial automation logic where programmable control, status monitoring, and multiple digital interfaces are useful. Its 50,000 system gates and 1,728 logic cells provide a stated resource baseline, while 63 user I/Os support sensors, actuators, interlocks, and machine-control signals. The I suffix indicates an industrial-oriented ordering option, although the exact numeric temperature limits are not supplied. Designers should verify supply rails, input thresholds, output standards, clocking, and configuration behavior against the official device documentation before using it as a safety or production controller.
Recommended
Test and Measurement Instrumentation
The XC3S50 can implement acquisition control, timing, sequencing, and data-transfer logic in an instrument when the design needs programmable digital behavior rather than a fixed-function controller. The 63 user I/Os can support parallel measurement interfaces, trigger signals, status LEDs, and control lines, while the reported 630 MHz device figure provides a useful starting point for timing analysis. Actual instrument bandwidth depends on I/O standards, routing, clock quality, and the selected clocking architecture. Use careful grounding, controlled impedance, and isolated or protected external interfaces when connecting the FPGA to sensitive analog circuitry.
Recommended
Communications Interface and Protocol Bridge
The XC3S50 is suitable for low-to-moderate complexity communications interfaces, including serial-to-parallel conversion, packet framing, test patterns, and protocol bridging. The 63 user I/Os provide a useful budget for parallel data, control, clock, and chip-select signals, while the programmable fabric allows timing and framing logic to be changed during development. The supplied data does not specify transceivers, supported I/O standards, maximum serial rate, or block-RAM capacity, so those constraints must be established before selecting the device. External PHY or transceiver selection remains application-dependent.
Recommended
Embedded Instrumentation and Data Logging
The FPGA can serve as a programmable timing, buffering, and control element in embedded data-logging equipment. Its stated 50,000 system gates and 1,728 logic cells allow parallel datapaths and control state machines to be placed in one programmable device, while 63 I/Os support sensors, memory interfaces, status, and host communication. Actual memory depth and sustained data rate are not present in the verified data, so designers must confirm block RAM, external-memory interfaces, and clocking requirements. Consider configuration integrity, brownout behavior, and safe data retention when deploying in unattended equipment.
Recommended
Consumer and Embedded Digital Logic
The XC3S50 can implement compact consumer, appliance, or embedded control functions that benefit from reconfigurable logic, including keypad scanning, display sequencing, motor-step control, and programmable timing. The 63 user I/Os offer connectivity for human-interface and control signals, while the 1.2 V core supply is identified in the supplied data. The product’s age makes software-tool support, lifecycle status, and supply continuity especially important for new consumer designs. Verify all package pins, I/O voltage domains, configuration startup, and production programming requirements before committing to a board revision.
Recommended
Digital Signal Processing Front End
The XC3S50 may be useful for digital filtering, sampling control, waveform generation, and fixed-point signal-processing front ends when the required data paths fit its stated logic resources. Its reported 630 MHz maximum figure can inform initial timing targets, but actual throughput depends on arithmetic mapping, pipeline depth, clocking, memory inference, and I/O timing closure. The supplied material does not confirm DSP blocks, multipliers, or block-RAM capacity, so engineers should not infer those features without consulting the official datasheet. Use synchronous design practices and verify timing under worst-case process, voltage, and temperature assumptions.
Recommended
Recommended Products Summary
Engineering reference data for XC3S50-4VQ100I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3S50-4VQG100I | XC3S50-4VQG100C | XC3S50A-4VQ100I |
|---|---|---|---|---|
| Package | 100-pin TQFP/VTQFP | 100-pin VTQFP/VQFP candidate | 100-pin VTQFP/VQFP candidate | 100-pin TQFP/VTQFP candidate |
| Brand | AMD | AMD | AMD | AMD |
| Temperature Suffix | I industrial suffix | I industrial suffix | C commercial suffix | I industrial suffix |
Key Differentiators
- Exact 50,000-system-gate Spartan-3 resource class (vs XC3S50A-4VQ100I)
- Industrial temperature suffix (vs XC3S50-4VQG100C)
- 63 user I/O in the identified target package (vs XC3S100E-5VQG100C)
Design Notes
Do not release the PCB from catalog snippets alone. The verified distributor data identifies a 100-pin TQFP/VTQFP package, while one secondary result incorrectly labels a different package. Confirm the official package drawing and complete pin table for XC3S50-4VQ100I, especially power, ground, configuration, clock, and user-I/O assignments. Preserve the exact footprint, pin-1 orientation, pad dimensions, solder-mask clearance, and land pattern; a package-name mismatch can create an unmanufacturable or electrically incorrect board.
The verified data lists a 1.2 V core supply and 2.5 V and 3.3 V associated supplies, but it provides no current limits or power-consumption table. Confirm every supply rail, sequencing requirement, tolerance, sequencing margin, and current budget in the official electrical documentation. Estimated power cannot be responsibly calculated without configuration state and activity assumptions. Use measured or tool-generated worst-case estimates for regulator sizing, plane current, startup current, and thermal design, and account for configuration-pin pull states during reset.
Keep clocks and high-speed interfaces away from noisy power-regulator switches and noisy digital return paths. Use a defined clock topology, controlled-impedance routing where applicable, solid return-plane continuity, and termination values supported by the actual I/O standard. The supplied data does not identify supported I/O standards or maximum interface rates, so do not select termination or drive strength from memory. Validate eye timing, skew, crosstalk, and board-level power integrity in the intended tool and measurement environment.
Do not confuse the reported 630 MHz device figure with guaranteed application throughput. Timing depends on clock definition, logic depth, routing congestion, I/O timing, constraints, and the exact device speed grade. Also avoid treating a related MPN as a replacement merely because it has the same family name or a similar package listing. Verify bitstream compatibility, configuration memory, tool support, package drawing, I/O standards, temperature limits, and lifecycle status. The supplied data contains conflicting secondary package descriptions and no authoritative pin table.
Compliance Information
The supplied verified data does not establish RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-mineralals status. The I suffix identifies an industrial-temperature ordering option, but it does not by itself establish automotive qualification.
