EP1C3T100I7 - 2910 LE Cyclone FPGA, 100-TQFP, Industrial | Intel
Référence : EP1C3T100I7 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.8 | $2 180,00 |
| 500 | $18.4 | $9 200,00 |
| 1 000 | $15.95 | $15 950,00 |
EP1C3T100I7 Présentation
A Cyclone FPGA belongs to the field-programmable gate array (FPGA) family, a class of programmable logic devices (PLDs) that allow designers to configure digital logic, memory blocks, and I/O behavior after PCB fabrication. Within the system hierarchy, an FPGA sits between a microcontroller (fixed instruction set, software-defined behavior) and an ASIC (fully custom silicon, no post-fabrication changes). The Cyclone I family was introduced by Altera (later acquired by Intel) in 2002 as a low-cost alternative to the Stratix family, targeting consumer, industrial, and communication applications where deterministic parallel logic was preferred over software execution.
Key features include 2910 logic elements distributed across 291 LABs (Logic Array Blocks), 13 embedded M4K RAM blocks totaling 59904 bits, one PLL for clock management, and 65 user I/Os. The device supports LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards, and is configured via a serial configuration device such as the EPC2 or EPCS family. The 100-pin TQFP package provides a 1.0 mm lead pitch suitable for standard 4-layer PCB designs with no need for microvia or HDI processes.
Architecture-wise, the Cyclone I uses a 4-input look-up table (LUT) based logic fabric with embedded multiplier support for DSP operations, although the EP1C3T100I7 has a limited number of 9x9 multipliers. The device is configured from an external flash memory at power-up, after which it operates deterministically according to the loaded bitstream. The I7 industrial speed grade and -40C to +100C operating range make it suitable for factory automation, motor control, and protocol bridging in environments beyond commercial temperature ranges.
Typical applications include glue logic replacement, custom interface bridging (UART to SPI, I2C to parallel), low-density video processing, industrial sensor aggregation, and education/hobby designs. The wide Quartus II tool support and abundant reference designs make it accessible for prototyping. When designing with the EP1C3T100I7, allocate configuration flash memory (EPCS1 or larger) and respect the 1.5 V core / 3.3 V I/O supply separation. Note that this part is part of an older generation; long-term availability should be confirmed before new designs.
This page synthesizes distributor pricing, drop-in same-family alternatives (such as the EP1C3T100I7N and EP1C3T100C8N), and practical design considerations not collected on any single datasheet or distributor listing.
Alternatives de remplacement direct pour EP1C3T100I7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C3T100I7 (même facteur de forme et même empreinte) — différant par Package, Family, Speed Grade, Total RAM Bits, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C3T100I7N
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EP1C3T100C8N
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EP1C3T100C7N
✅ Remplacement direct✓ En stock
$10.6 / unité
Voir la fiche technique →EP1C3T100CN8
✅ Remplacement direct✓ En stock
$10.4 / unité
Voir la fiche technique →EP1C3T100CB
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EP1C3T100I7 Valeurs maximales et caractéristiques électriques
| Series | Cyclone I |
| Family | Cyclone FPGA Family |
| Logic Elements | 2910 LE |
| Number of LABs/CLBs | 291 LAB |
| Total RAM Bits | 59904 bit |
| Number of I/O | 65 I/O |
| Supply Voltage Core | 1.5 V |
| Process Technology | 130 nm |
| Maximum Operating Frequency | 320.1 MHz |
| Number of PLLs | 1 |
| Boîtier | 100-TQFP |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Speed Grade | 7 |
| Type de montage | Surface Mount |
Configuration des broches de EP1C3T100I7
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | VCCIO1 — I/O supply voltage bank 1 (3.3 V) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | I/O — User I/O pin (bank 1) |
| Broche 22 | I/O — User I/O pin (bank 1) |
| Broche 23 | I/O — User I/O pin (bank 1) |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O pin (bank 1) |
| Broche 26 | I/O — User I/O pin (bank 1) |
| Broche 27 | VCCINT — Core supply voltage (1.5 V) |
| Broche 28 | I/O — User I/O pin (bank 1) |
| Broche 29 | I/O — User I/O pin (bank 1) |
| Broche 30 | I/O — User I/O pin (bank 1) |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | VCCIO2 — I/O supply voltage bank 2 (3.3 V) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | I/O — User I/O pin (bank 2) |
| Broche 39 | GND — Ground |
| Broche 40 | I/O — User I/O pin (bank 2) |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | I/O — User I/O pin (bank 2) |
| Broche 45 | I/O — User I/O pin (bank 2) |
| Broche 46 | I/O — User I/O pin (bank 2) |
| Broche 47 | I/O — User I/O pin (bank 2) |
| Broche 48 | VCCINT — Core supply voltage (1.5 V) |
| Broche 49 | I/O — User I/O pin (bank 2) |
| Broche 50 | I/O — User I/O pin (bank 2) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | VCCIO3 — I/O supply voltage bank 3 (3.3 V) |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | GND — Ground |
| Broche 59 | I/O — User I/O pin (bank 3) |
| Broche 60 | I/O — User I/O pin (bank 3) |
| Broche 61 | I/O — User I/O pin (bank 3) |
| Broche 62 | I/O — User I/O pin (bank 3) |
| Broche 63 | I/O — User I/O pin (bank 3) |
| Broche 64 | I/O — User I/O pin (bank 3) |
| Broche 65 | I/O — User I/O pin (bank 3) |
| Broche 66 | I/O — User I/O pin (bank 3) |
| Broche 67 | VCCINT — Core supply voltage (1.5 V) |
| Broche 68 | I/O — User I/O pin (bank 3) |
| Broche 69 | I/O — User I/O pin (bank 3) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | I/O — User I/O pin (bank 4) |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | VCCIO4 — I/O supply voltage bank 4 (3.3 V) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | I/O — User I/O pin (bank 4) |
| Broche 76 | I/O — User I/O pin (bank 4) |
| Broche 77 | I/O — User I/O pin (bank 4) |
| Broche 78 | GND — Ground |
| Broche 79 | I/O — User I/O pin (bank 4) |
| Broche 80 | I/O — User I/O pin (bank 4) |
| Broche 81 | I/O — User I/O pin (bank 4) |
| Broche 82 | I/O — User I/O pin (bank 4) |
| Broche 83 | nSTATUS — Configuration status (open-drain, pull-up required) |
| Broche 84 | DCLK — Configuration clock input |
| Broche 85 | DATA0 — Configuration data input (AS mode) |
| Broche 86 | CONF_DONE — Configuration done (open-drain, pull-up required) |
| Broche 87 | TDI — JTAG test data input |
| Broche 88 | TMS — JTAG test mode select |
| Broche 89 | TCK — JTAG test clock |
| Broche 90 | TDO — JTAG test data output |
| Broche 91 | nCONFIG — Configuration start (active-low, pull-up required) |
| Broche 92 | MSEL0 — Configuration mode select 0 |
| Broche 93 | MSEL1 — Configuration mode select 1 |
| Broche 94 | MSEL2 — Configuration mode select 2 |
| Broche 95 | GND — Ground |
| Broche 96 | I/O — User I/O pin (bank 4) |
| Broche 97 | I/O — User I/O pin (bank 4) |
| Broche 98 | I/O — User I/O pin (bank 4) |
| Broche 99 | I/O — User I/O pin (bank 4) |
| Broche 100 | I/O — User I/O pin (bank 4) |
Applications typiques
EP1C3T100I7 convient pour 6 applications: Industrial Glue Logic Replacement, Custom Interface Bridging (UART/SPI/I2C to Parallel), Low-Density Video Processing and Display Control, Motor Control and PWM Generation, Education and FPGA Learning Platforms, Sensor Aggregation and Data Pre-Processing.
Industrial Glue Logic Replacement
The EP1C3T100I7 replaces multiple discrete 74-series logic ICs with a single programmable device, reducing PCB area and BOM cost. Its 2910 logic elements across 291 LABs provide sufficient capacity to absorb 20-30 SSI/MSI logic functions in a typical industrial glue-logic design: address decoding, bus arbitration, pulse generation, and watchdog timing. The 100-TQFP package fits the same footprint as a legacy 100-pin QFP, allowing drop-in substitution on existing boards. The -40C to +100C industrial temperature range ensures reliable operation in factory-floor cabinets and outdoor enclosures. Designers configure the device once via JTAG or EPCS serial flash and it boots deterministically at every power-up - critical for machinery that cannot tolerate configuration latency.
Recommandé
Custom Interface Bridging (UART/SPI/I2C to Parallel)
The EP1C3T100I7 excels at protocol conversion between asynchronous serial buses and parallel interfaces - a frequent requirement when interfacing legacy MCUs to modern sensors or display controllers. Its 65 user I/Os handle typical bridge configurations: 16-32 data lines, 4-8 handshake signals, and dedicated clock outputs. The single onboard PLL generates the precise clock required for UART oversampling or SPI timing generation. At 320.1 MHz fabric speed, the device can sustain 50+ MHz parallel data throughput with deterministic latency, outperforming software-based bridging on small MCUs. Designers can swap bridge personalities (UART-to-SPI, I2C-to-parallel, etc.) by re-flashing the configuration bitstream without any PCB change.
Recommandé
Low-Density Video Processing and Display Control
The EP1C3T100I7 can drive small TFT LCD panels and perform basic video processing (color space conversion, frame buffering, deinterlacing) for industrial HMIs and POS terminals. The 59904 bits of embedded RAM provide enough line buffers for QVGA (320x240) or small VGA (640x480) frame handling. The 65 user I/Os include sufficient LVTTL/LVCMOS pairs for RGB888 data plus sync signals. Designers typically pair the FPGA with an external SDRAM for larger framebuffers; the EPCS configuration flash stores the bitstream while the application firmware handles pixel timing. The -40C to +100C operation suits outdoor kiosk and automotive infotainment applications.
Recommandé
Motor Control and PWM Generation
Industrial motor drives benefit from the EP1C3T100I7's deterministic PWM generation and Hall-sensor decoding. The single PLL multiplies a low-frequency crystal reference up to the switching frequency (typically 10-50 kHz for servo motors, up to 200 kHz for high-speed spindles). The fabric's parallel logic enables advanced control algorithms (field-oriented control, space-vector modulation) at sub-microsecond loop times. The 65 user I/Os support 3-phase gate drivers, encoder feedback (QEP), and CAN/Modbus communication. The -40C to +100C industrial temperature range and 130 nm process resilience to electrical noise make the device suitable for the harsh switching environment of variable-frequency drives.
Recommandé
Education and FPGA Learning Platforms
The EP1C3T100I7 is widely used in university digital logic courses and hobbyist learning kits due to its low cost (under 30 USD unit), sufficient logic capacity for textbook projects (ALUs, FIFOs, simple CPUs), and excellent Quartus II tool support with free Web Edition licensing. Students can implement complete RISC processors, VGA controllers, and audio processors within the 2910 LE budget. The 100-TQFP package is breadboard-compatible via adapter PCBs and provides enough I/Os for typical lab exercises (7-segment displays, switches, LEDs). Reference designs from Altera/Intel and the open-source community (OpenCores, GitHub) make this part a cornerstone of FPGA education.
Recommandé
Sensor Aggregation and Data Pre-Processing
In distributed industrial sensor networks, the EP1C3T100I7 serves as an edge aggregator that interfaces multiple SPI/I2C sensors, performs local filtering, and forwards processed data over a single high-speed uplink. The 2910 LE budget supports 8-16 sensor interfaces simultaneously with simple FIR or moving-average filters implemented in fabric. The 59904 bits of RAM provide temporary buffering for time-correlated sensor reads. The single PLL synchronizes all sensor sample clocks to a common reference, eliminating drift in multi-sensor measurement systems. The -40C to +100C industrial range suits factory and outdoor deployment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C3T100I7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C3T100I7N | EP1C3T100C8N | EP1C3T100C7N | EP1C3T100CN8 | EP1C3T100CB |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same |
| Logic Elements | 2910 LE | 2910 LE | 2910 LE | 2910 LE | 2910 LE | 2910 LE |
| Total RAM Bits | 59904 bit | 59904 bit | 59904 bit | 59904 bit | 59904 bit | 59904 bit |
| User I/O Count | 65 | 65 | 65 | 65 | 65 | 65 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Speed Grade | 7 | 7 | 8 (faster) | 7 | 8 (faster) | 7 |
| Lead-Free (RoHS) | No (legacy SnPb) | Yes (RoHS) | Yes (RoHS) | Yes (RoHS) | Yes (RoHS) | Yes (RoHS) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Industrial temperature grade with same silicon as commercial variant (vs EP1C3T100C7N)
- Same-die RoHS compliant alternative available (vs EP1C3T100I7N)
- Faster speed grade available in same package (vs EP1C3T100C8N)
Notes de conception
The EP1C3T100I7 requires three separate supply rails: VCCINT (1.5 V core), VCCIO per bank (3.3 V typical for LVTTL/LVCMOS), and the configuration flash supply. Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 5 mm of the pin, and add a 10 uF bulk capacitor near the regulator. For VCCIO, place a 0.1 uF + 10 uF pair per bank. Sequence VCCINT before VCCIO by at least 1 ms to prevent I/O latch-up during power-up; many designs use a power-good signal from the 1.5 V regulator to gate the 3.3 V regulator enable.
At maximum toggle rates with 65 I/Os at 100 MHz, the EP1C3T100I7 dissipates approximately 0.5-1.0 W (estimated: I/O power plus core dynamic power). The 100-TQFP package has a theta_JA around 35-40 C/W in still air, yielding a 35-40 C temperature rise above ambient. For industrial applications at +85C ambient, the junction reaches approximately 120-125 C - within the 100 C maximum but with limited margin. Use thermal vias under the exposed die pad if present, or assign all unused I/Os as outputs driving low to reduce switching current.
Route configuration signals (DCLK, DATA0, nSTATUS, CONF_DONE, nCONFIG) with controlled impedance and length-matching within 50 mils of each other. Place the EPCS configuration flash within 50 mm of the FPGA to keep signal integrity margins high. JTAG signals (TCK, TMS, TDI, TDO) should be guarded from adjacent switching signals. For high-speed clock inputs, place the crystal/oscillator within 5 mm of the CLK pin and guard the trace with ground pour to prevent crosstalk into the PLL.
Do not leave nSTATUS, CONF_DONE, or nCONFIG floating - they require external pull-up resistors (typically 10 kOhm to VCCIO). MSEL[2:0] must be tied to fixed logic levels corresponding to the desired configuration mode (00 = AS, 01 = PS, 10 = fast AS, 11 = JTAG-only). A common mistake is connecting I/O pins to 5 V signals without level translation - the EP1C3T100I7 I/Os are NOT 5 V tolerant and will be damaged. Use a level translator such as the 74LVC4245A for any 5 V interface.
When using LVDS or SSTL I/O standards, match trace lengths within 100 mils per differential pair and maintain 100 ohm differential impedance. Use AC-coupling capacitors on LVDS receive paths as required by the protocol. For SSTL-2 Class II memory interfaces, route address, clock, and command signals on a controlled-impedance layer with reference plane, and place series termination resistors at the driver end. Use the Quartus II TimeQuest timing analyzer with proper SDC constraints to close timing on critical paths.
Informations de conformité
EP1C3T100I7 is the legacy SnPb (leaded) variant of the Cyclone I family. The RoHS-compliant equivalent is EP1C3T100I7N (same silicon, lead-free). Not AEC-Q100 qualified - this part targets industrial not automotive applications.
