XC7K420T-2FFG1156I - Kintex-7 FPGA 416K Cells | AMD
Référence : XC7K420T-2FFG1156I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3990.35 | $3 990,35 |
| 10 | $3720 | $37 200,00 |
| 100 | $3450 | $345 000,00 |
| 500 | $3200 | $1 600 000,00 |
| 1 000 | $3087.54 | $3 087 540,00 |
XC7K420T-2FFG1156I Présentation
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, configurable I/O, and routing resources that can be programmed to implement any digital logic function. The Kintex-7 family sits between the cost-optimized Artix-7 and the high-end Virtex-7 in the Xilinx 7-series hierarchy, offering an optimal balance of performance, power, and price for mid-range to high-end applications.
Key features of the XC7K420T-2FFG1156I include 32,575 Configurable Logic Blocks (CLBs), 30,781,440 bits of block RAM, and 400 user I/O pins. The -2 speed grade provides fast performance, while the I suffix indicates an industrial temperature range of -40°C to +100°C (TJ). The device supports a wide range of I/O standards including LVCMOS, LVDS, and HSTL, and includes hardened memory controllers, DSP48E1 slices, and high-speed serial transceivers.
Architecturally, the Kintex-7 family integrates a 6-input look-up table (LUT) fabric, dedicated carry logic, and distributed RAM. The device includes 1,680 DSP48E1 slices for high-throughput signal processing, and up to 16 high-speed GTX transceivers (depending on package variant) supporting data rates up to 12.5 Gb/s. The 28nm process technology enables high logic density with lower power consumption compared to previous generations.
Typical applications include high-performance computing, aerospace and defense signal processing, medical imaging, wired and wireless communications, and video processing. The 400 I/Os and large block RAM make it suitable for memory-intensive designs, while the DSP resources handle complex algorithms. The industrial temperature range extends usability to harsh environments.
When designing with this device, careful attention to power supply decoupling and thermal management is essential. The 1.0V core supply requires a robust power delivery network, and the FC-BGA package needs adequate PCB layout for signal integrity at high speeds.
Alternatives de remplacement direct pour XC7K420T-2FFG1156I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7K420T-2FFG1156I (même facteur de forme et même empreinte) — différant par Speed Grade, Mounting Type, Core Supply Voltage, Logic Cells, Maximum Clock Frequency.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7K420T-2FFG1156C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7K420T-1FFG1156C
✅ Remplacement direct✓ En stock
$990 / unité
Voir la fiche technique →XC7K420T-L2FFG1156I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7K480T-1FFG1156C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7K480T-2FFG1156I
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4500 / unité
Voir la fiche technique →XC7K420T-2FFG1156I Valeurs maximales et caractéristiques électriques
| Family | Kintex-7 |
| Number of Logic Elements/Cells | 416960 |
| Number of LABs/CLBs | 32575 |
| Total RAM Bits | 30781440 |
| Number of I/O | 400 |
| Boîtier / Format | 1156-FCBGA (35x35 mm) |
| Type de montage | SMD (SMT) |
| Température de fonctionnement | -40°C to 100°C (TJ) |
| Tension d'alimentation | 1V (nominal) |
| Process Technology | 28nm |
| Speed Grade | -2 |
| Number of Terminals | 1156 |
| Package Code | BGA |
| Package Shape | SQUARE |
| Statut RoHS | Compliant |
| Lead-Free Status | Lead Free |
Configuration des broches de XC7K420T-2FFG1156I
| Broche A1 | IO_L1P_T0 — User I/O Bank 0, differential pair P |
| Broche A2 | IO_L1N_T0 — User I/O Bank 0, differential pair N |
| Broche B1 | VCCINT — Internal core supply 1.0V |
| Broche B2 | GND — Ground |
| Broche C1 | IO_L2P_T0 — User I/O Bank 0, differential pair P |
| Broche C2 | IO_L2N_T0 — User I/O Bank 0, differential pair N |
| Broche D1 | VCCAUX — Auxiliary supply 1.8V |
| Broche D2 | GND — Ground |
| Broche E1 | IO_L3P_T0 — User I/O Bank 0, differential pair P |
| Broche E2 | IO_L3N_T0 — User I/O Bank 0, differential pair N |
| Broche F1 | VCCIO_0 — I/O Bank 0 supply |
| Broche F2 | GND — Ground |
Applications typiques
XC7K420T-2FFG1156I convient pour 6 applications: High-Performance Computing, Aerospace and Defense Signal Processing, Medical Imaging, Wired and Wireless Communications, Video Processing, Industrial Automation.
High-Performance Computing
The XC7K420T-2FFG1156I excels in high-performance computing applications such as data acceleration and network processing. With 416,960 logic cells and 400 I/Os, it can implement complex parallel processing architectures. The 28nm process and -2 speed grade provide high clock rates, while the 30.7 Mb of block RAM supports large data buffers. Its 1.0V core supply reduces power consumption compared to older FPGAs, making it suitable for power-constrained data centers. The industrial temperature range ensures reliable operation in demanding environments.
Recommandé
Aerospace and Defense Signal Processing
In aerospace and defense, the XC7K420T-2FFG1156I is used for radar, electronic warfare, and secure communications. Its industrial temperature range (-40°C to +100°C) meets military environmental requirements. The 400 I/Os interface with high-speed ADCs and DACs, while the 28nm technology provides radiation-tolerant performance for space applications. The large logic capacity enables complex beamforming and signal processing algorithms. The FC-BGA package offers excellent thermal performance for high-reliability systems.
Recommandé
Medical Imaging
The XC7K420T-2FFG1156I is ideal for medical imaging systems like CT scanners and MRI machines. Its 416,960 logic cells handle real-time image reconstruction and filtering. The 400 I/Os connect to high-resolution sensors and display interfaces. The 30.7 Mb block RAM stores image frames for processing. The -2 speed grade enables high-throughput data pipelines, while the industrial temperature range supports the thermal environment of medical equipment. The 28nm process ensures low power for portable devices.
Recommandé
Wired and Wireless Communications
For communications infrastructure, the XC7K420T-2FFG1156I provides the logic density for baseband processing in 5G and LTE systems. Its 400 I/Os interface with high-speed transceivers and network processors. The 28nm technology supports low-latency packet processing. The large block RAM enables deep FIFOs for data buffering. The -2 speed grade handles high data rates, while the industrial temperature range suits outdoor base station environments. The FC-BGA package supports high-density PCB designs.
Recommandé
Video Processing
The XC7K420T-2FFG1156I is well-suited for video processing in broadcast and surveillance systems. Its 416,960 logic cells implement video codecs, scaling, and enhancement algorithms. The 400 I/Os connect to HDMI, SDI, and camera interfaces. The 30.7 Mb block RAM stores video lines and frames. The -2 speed grade supports 4K and 8K video processing at real-time rates. The industrial temperature range allows deployment in outdoor surveillance cameras. The 28nm process balances performance and power for continuous operation.
Recommandé
Industrial Automation
In industrial automation, the XC7K420T-2FFG1156I enables advanced motor control, robotics, and machine vision. Its 400 I/Os interface with sensors, actuators, and industrial networks. The 28nm technology provides high reliability for 24/7 operation. The large logic capacity implements complex control algorithms and safety functions. The -2 speed grade ensures fast response times, while the industrial temperature range (-40°C to +100°C) suits factory environments. The FC-BGA package offers robust mechanical stability.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7K420T-2FFG1156I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7K420T-2FFG1156C | XC7K420T-1FFG1156C | XC7K420T-L2FFG1156I | XC7K480T-1FFG1156C |
|---|---|---|---|---|---|
| Package | 1156-FCBGA | 1156-FCBGA | 1156-FCBGA | 1156-FCBGA | 1156-FCBGA |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 416960 | 416960 | 416960 | 416960 | 477760 |
| Number of I/O | 400 | 400 | 400 | 400 | 400 |
| RAM Bits | 30781440 | 30781440 | 30781440 | 30781440 | 38338560 |
| Speed Grade | -2 | -2 | -1 | -2L | -1 |
| Temperature Range | -40°C to +100°C | 0°C to +85°C | 0°C to +85°C | -40°C to +100°C | 0°C to +85°C |
| Supply Voltage | 1V | 1V | 1V | 1V | 1V |
Principaux différenciateurs
- Industrial temperature range (vs XC7K420T-2FFG1156C)
- Higher speed grade (vs XC7K420T-1FFG1156C)
- Standard power vs low-power (vs XC7K420T-L2FFG1156I)
Notes de conception
The XC7K420T-2FFG1156I requires a robust power delivery network for its 1.0V core supply. Use multiple low-ESR ceramic capacitors (0.1uF and 1uF) placed close to the VCCINT pins, and a bulk capacitor (10uF) per power pin group. The VCCAUX supply (1.8V) also needs adequate decoupling. Refer to the AMD Kintex-7 power management application note for detailed recommendations.
With a 1156-FCBGA package and industrial temperature range, thermal management is critical. The device can dissipate significant power at high utilization. Use a heatsink or active cooling for designs exceeding 10W dissipation. Ensure adequate airflow and consider the thermal resistance of the PCB. The junction temperature must not exceed 100°C for reliable operation.
For high-speed signals, maintain controlled impedance traces (50 ohm single-ended, 100 ohm differential) and minimize via stubs. The FC-BGA package requires a multi-layer PCB with dedicated power and ground planes. Follow AMD's PCB design guidelines for the FFG1156 package to ensure signal integrity and manufacturability.
Informations de conformité
RoHS compliant and lead-free per distributor data. AEC-Q100 not applicable for FPGA devices.