EP1M350F780I5 - Altera Mercury Enhanced Configuration Device, 780-pin FBGA | Intel
MPN: EP1M350F780I5 ✗ סוף ייצורEP1M350F780I5 סקירה
An enhanced configuration device (sometimes called a "configuration PROM" or "EPC") is a non-volatile memory IC that stores the FPGA configuration bitstream and serialises it to the target FPGA at power-up via Altera's passive serial, active serial, or fast passive parallel configuration scheme. The Mercury EP1M family sits above the older EPC8/EPC16 line in density and supports fast parallel configuration, eliminating the need for a separate boot PROM on multi-FPGA boards. Configuration devices operate above the FPGA in the boot hierarchy and are invisible to the application software after configuration completes.
The defining feature of the EP1M350F780I5 is its large flash storage density, indicated by the "350" code, which is sufficient to hold the bitstream of a high-gate-count Altera FPGA in a single device. It integrates the configuration controller logic on-chip, so no external glue is required. Programming is typically performed in-system through Altera's Quartus programmer, and the device supports in-system programmability and read-back. The 780-pin FineLine BGA package exposes the configuration, JTAG, and power pins needed for both standalone and cascaded multi-FPGA boot topologies.
Architecturally, the EP1M350 is composed of a configuration controller block and a flash memory array, with the controller handling the FPGA hand-shaking (nSTATUS, CONF_DONE, nCONFIG, DCLK) and the flash providing the serial or parallel data stream. Because it is a memory-plus-controller device, designers should consult the Mercury configuration device handbook for supported FPGAs, cascade rules, and JTAG chain ordering.
Typical applications include booting Altera APEX 20K, APEX II, Mercury, Stratix-class, and similar high-density FPGAs on telecom line cards, military signal-processing boards, and industrial controllers where a single, large, reliable boot source is needed. The industrial-grade "I" temperature grade makes the EP1M350F780I5 suitable for harsh-environment deployments.
When designing with this device, confirm that the target FPGA density does not exceed the EP1M350 storage capacity and verify the configuration scheme (passive serial vs. fast passive parallel) against the target FPGA's datasheet. JTAG chain order matters when multiple FPGAs share the same boundary-scan bus. For pinout and ball-map details, refer to the Altera (Intel) configuration device handbook rather than guessing ball assignments from generic BGA diagrams.
This page synthesizes distributor pricing, lifecycle status, and design notes for the EP1M350F780I5 that go beyond the manufacturer datasheet, helping engineers rapidly assess sourcing risk, recommended drop-in alternatives, and PCB-level integration considerations.
חלופות תחליף ישיר עבור EP1M350F780I5 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EP1M350F780I5 (אותו גורם צורה וטביעת רגל) — שונים ב Package, Operating Temperature, Family, Speed Grade, Architecture.
EP1M350F780C8
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1M350F780C7N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1M350F780C7
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1M350F780C6N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1M350F780C5N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1M350F780I5 דירוגים מרביים ומאפיינים חשמליים
| Device Family | Altera Mercury (EP1M) Enhanced Configuration Device |
| פונקציה | FPGA configuration PROM with integrated controller |
| Storage Density Code | 350 (high-density) |
| Supported Configuration Schemes | Passive Serial, Active Serial, Fast Passive Parallel |
| Internal Architecture | Configuration controller + flash memory array |
| Programming Method | In-system programmable via Altera Quartus / JTAG |
| מארז | 780-ball FineLine BGA (F780) |
| Temperature Grade (suffix "I") | Industrial |
| Speed Grade | 5 |
| Target FPGA Compatibility | Altera APEX 20K, APEX II, Mercury, Stratix-class high-density FPGAs |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| Cascade / Multi-FPGA Support | Yes, supports daisy-chained multi-FPGA boot |
| Read-Back | Yes |
מדריך תצורת פינים של EP1M350F780I5 780-ball fineline bga (f780)
תצורת פינים עבור EP1M350F780I5 (מארזת 780-ball fineline bga (f780)). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור EP1M350F780I5.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
EP1M350F780I5 מתאים עבור 6 יישוםs: Telecom Line-Card FPGA Boot, Military Signal-Processing Board Boot, Industrial Controller FPGA Boot, Multi-FPGA Image-Processing Board Boot, Legacy Altera Board Repair and Sustainment, Test & Measurement Instrumentation FPGA Boot.
Telecom Line-Card FPGA Boot
The EP1M350F780I5 stores the configuration bitstream of high-density Altera APEX 20K or Stratix-class FPGAs used on telecom line cards. Its 350 density code is sized for the largest bitstreams and its industrial temperature grade handles outdoor cabinet environments (-40C to +85C). Placed near the target FPGA with the FPP configuration bus, it eliminates the need for a separate boot PROM and reduces BOM. Engineers should verify cascade rules when multiple FPGAs share the same boot chain.
מומלץ
Military Signal-Processing Board Boot
Defense and aerospace signal-processing boards rely on the EP1M350F780I5 to boot high-gate-count Altera FPGAs that perform radar or DSP preprocessing. The industrial temperature grade and ruggedised FineLine BGA package suit MIL-spec vibration and thermal profiles. Its on-chip configuration controller reduces board complexity in space-constrained VPX and VME designs. JTAG read-back supports in-the-field verification of the stored bitstream.
מומלץ
Industrial Controller FPGA Boot
Programmable Automation Controllers (PACs) and high-end PLCs use the EP1M350F780I5 to configure Altera APEX or Mercury FPGAs that implement deterministic motion or process control loops. The fast passive parallel configuration mode minimises boot time, which is critical when the controller must come online within milliseconds of power-up. The industrial temperature grade tolerates factory-floor thermal extremes.
מומלץ
Multi-FPGA Image-Processing Board Boot
High-throughput image-processing boards (medical imaging, machine vision, broadcast video) cascade multiple Altera FPGAs and use the EP1M350F780I5 as the master boot source. The 780-ball FineLine BGA exposes all cascade control signals (nSTATUS, CONF_DONE, nCONFIG) needed to orchestrate sequential FPGA configuration. The on-chip controller handles bitstream hand-shaking so the host CPU only sees a single boot transaction.
מומלץ
Legacy Altera Board Repair and Sustainment
Long-lifecycle programs (military avionics, rail signalling, power-grid SCADA) must sustain fielded boards whose original EP1M350F780I5 has failed. Because the Mercury family is NRND, the EP1M350F780I5 itself is the direct replacement for these legacy sockets. Engineers should verify the original board used the I-grade part; otherwise a C-grade Mercury 780-ball variant from the same family is an acceptable drop-in for non-extreme-temperature sites.
מומלץ
Test & Measurement Instrumentation FPGA Boot
High-end oscilloscopes, logic analysers, and protocol testers use the EP1M350F780I5 to boot the Altera FPGAs that perform real-time acquisition and DSP. Fast Passive Parallel configuration minimises the wait time from power-on to first valid sample, which matters in automated production-test environments where boot latency directly impacts throughput. The industrial temperature grade supports bench-to-floor thermal variation.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EP1M350F780I5 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EP1M350F780C8 | EP1M350F780C7N | EP1M350F780C7 | EP1M350F780C6N | EP1M350F780C5N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-ball FineLine BGA (F780) | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same |
| Device Family | Mercury (EP1M) Enhanced Configuration Device | Mercury (EP1M) Enhanced Configuration Device | Mercury (EP1M) Enhanced Configuration Device | Mercury (EP1M) Enhanced Configuration Device | Mercury (EP1M) Enhanced Configuration Device | Mercury (EP1M) Enhanced Configuration Device |
| Density Code | 350 (high) | 350 (same) | 350 (same) | 350 (same) | 350 (same) | 350 (same) |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Speed Grade | 5 | 8 | 7 | 7 | 6 | 5 |
| Configuration Schemes | PS / AS / FPP | PS / AS / FPP | PS / AS / FPP | PS / AS / FPP | PS / AS / FPP | PS / AS / FPP |
| JTAG Support | Yes | Yes | Yes | Yes | Yes | Yes |
מבדילים עיקריים
- Industrial temperature grade at 780-ball density (לעומתEP1M350F780C8)
- Fastest available speed grade in the family (לעומתEP1M350F780C7N)
- Single-device boot for the largest Altera FPGAs (לעומתEPC16 (older EPC family))
הערות תכנון
Estimated: The 780-ball FineLine BGA package requires a 6-or-8-layer PCB with microvia stackups and controlled-impedance routing for the Fast Passive Parallel configuration bus. Verify your PCB fabrication house supports 0.8 mm-pitch BGA assembly before committing to the EP1M350F780I5. For prototypes, consider a socketed adapter to ease rework on this NRND part.
The Fast Passive Parallel configuration bus on the EP1M350F780I5 runs at high data rates to minimise boot time. Per Altera's configuration device handbook, route DCLK and DATA[7:0] as length-matched impedance-controlled traces (typically 50 ohm microstrip or stripline), and place a 33 ohm series damping resistor near the FPGA's CONFIG_DATA pins to suppress ringing.
Estimated: The EP1M350F780I5 is a CMOS flash configuration device with low dynamic power, so thermal dissipation is not a concern under normal boot conditions. However, sustained JTAG read-back or programming cycles can elevate die temperature in confined enclosures; ensure at least 100 LFM of airflow across the BGA in sealed industrial enclosures to keep junction temperature within the -40C to +85C industrial envelope.
Place the EP1M350F780I5 as close as possible to the target FPGA to minimise the length of the configuration bus. Decouple VCCINT and VCCIO with 0.1 uF X7R ceramics placed within 5 mm of the respective BGA balls, plus a bulk 10 uF tantalum or polymer capacitor. Keep the JTAG chain (TCK, TMS, TDI, TDO) separate from the configuration bus to avoid crosstalk during in-system programming.
מידע על תאימות
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not listed in the verified distributor data; all marked unknown per the data authenticity rules. EP1M350F780I5 is a programmable logic configuration device, so AEC-Q100 automotive qualification is not applicable.