EP1M350F780C7 - Mercury FPGA 350K Gates 486 I/O BGA-780 | Intel
MPN: EP1M350F780C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $252 | $2,520.00 |
| 100 | $218 | $21,800.00 |
| 500 | $188 | $94,000.00 |
| 1,000 | $162 | $162,000.00 |
Drop-in alternatives for EP1M350F780C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1M350F780C7N
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$168 / Unit
View Datasheet →EP1M350F780C6N
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View Datasheet →EP1M350F780C6
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View Datasheet →EP1M350F780C5N
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View Datasheet →EP1M350F780C5
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View Datasheet →EP1M350F780C7 Maximum Ratings & Electrical Characteristics
| Family | Mercury (PLD) |
| Logic Array Blocks (LABs) | 1440 |
| System Gates | 350,000 |
| Maximum User I/Os | 486 |
| Package | 780-ball FineLine BGA (F780) |
| Package Type | FINE LINE BGA-780 |
| Supply Voltage (Core) | 1.8 V |
| Logic Family | CMOS |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Mounting Type | Surface Mount |
| Transceivers / CDR Support | Up to 1.25 Gbps with CDR |
| Configuration Method | JTAG / Quartus II |
| Process Technology | CMOS SRAM-based |
EP1M350F780C7 fine line bga-780 Pin Configuration Guide
Complete pinout information for EP1M350F780C7 (fine line bga-780 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1M350F780C7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1M350F780C7 is suitable for 6 applications: Telecom Line-Card Glue Logic, Serial Backplane Aggregation, Industrial Control Bridge, Prototype ASIC Replacement, Medical Imaging Front-End, Test and Measurement Instrumentation.
Telecom Line-Card Glue Logic
The EP1M350F780C7 fits telecom line-card glue logic because its 1.25 Gbps CDR transceivers and 486 user I/Os bridge backplane SERDES to parallel framer/mapper ASICs without external SERDES components. Per the Altera Mercury datasheet, the 1.8V core supply and 1440 LABs provide ample density for Utopia/Pos-PHY bus adaptation and clock-domain crossing. The 780-ball FineLine BGA enables dense PCB placement behind high-density backplane connectors used in central-office line cards.
Recommended
Serial Backplane Aggregation
The EP1M350F780C7 is well-suited for serial backplane aggregation because its integrated 1.25 Gbps CDR transceivers consolidate multi-channel serial links into a single device, replacing two-chip SERDES+FPGA designs. According to the Mercury datasheet, the 350,000 system gates and 1440 LABs handle protocol multiplexing, CRC insertion, and link-layer state machines. The 486 user I/Os support wide parallel side-buses to switch-fabric ASICs on the same card.
Recommended
Industrial Control Bridge
The EP1M350F780C7 serves as a robust industrial control bridge, converting fieldbus protocols (Profibus, CAN, RS-485) to Ethernet while providing deterministic timing. Per Altera Mercury datasheet, the 1.8V core, 1440 LABs, and 486 I/Os support multiple protocol cores simultaneously. The commercial 0-85C temperature grade suits factory-floor enclosures; designers needing -40C to +100C should select the EP1M350F780I7 industrial variant from the Mercury family.
Recommended
Prototype ASIC Replacement
The EP1M350F780C7 functions as a prototype ASIC replacement, allowing designers to validate functionality in silicon before committing to a mask set. According to the Mercury datasheet, the SRAM-based configuration supports unlimited reprogramming cycles, and Quartus II's DesignWare libraries enable quick migration from synthesis to in-system validation. The 780-ball FineLine BGA package with 486 I/Os matches typical mid-complexity ASIC footprint requirements for prototype characterization.
Recommended
Medical Imaging Front-End
The EP1M350F780C7 fits medical imaging front-end boards where 1.25 Gbps transceivers carry digitized ultrasound or CT-detector data and 486 I/Os parallel-route to FPGA-based beamformers. Per the Mercury datasheet, the 1.8V core and CMOS SRAM process deliver low-power operation suitable for portable cart-mounted imaging systems. The 0-85C commercial range covers most clinical environments, while the 1440 LABs handle real-time pixel-rate processing algorithms.
Recommended
Test and Measurement Instrumentation
The EP1M350F780C7 is ideal for high-end test and measurement instrumentation such as logic analyzers, protocol testers, and BERT platforms. The integrated 1.25 Gbps CDR transceivers handle multi-standard serial decode without external PHY chips, while 486 user I/Os capture wide parallel data buses. According to the Altera Mercury datasheet, the 350K system gates and 1440 LABs provide the logic density for deep trace buffers and pattern generators used in automated test equipment (ATE).
Recommended
Recommended Products Summary
Engineering reference data for EP1M350F780C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1M350F780C7N | EP1M350F780C6N | EP1M350F780C6 | EP1M350F780C5N | EP1M350F780C5 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FineLine BGA (F780) | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same |
| Family | Mercury | Mercury | Mercury | Mercury | Mercury | Mercury |
| Speed Grade | -7 (C7) | -7 (C7) | -6 (C6) | -6 (C6) | -5 (C5) | -5 (C5) |
| Logic Array Blocks (LABs) | 1440 | 1440 | 1440 | 1440 | 1440 | 1440 |
| System Gates | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 |
| Maximum User I/Os | 486 | 486 | 486 | 486 | 486 | 486 |
| Core Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Transceiver / CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR |
| Lead-Free / RoHS | [DATA_NEEDED: rohs status] | Yes (N suffix indicates lead-free) | Yes (N suffix indicates lead-free) | [DATA_NEEDED] | Yes (N suffix indicates lead-free) | [DATA_NEEDED] |
Key Differentiators
- Faster speed grade with -7 timing model (vs EP1M350F780C6N)
- All 5 alternatives share the same F780 BGA footprint (vs EP1M350F780C6 / EP1M350F780C5 / N-suffix variants)
- Lead-free option available for RoHS-compliant builds (vs EP1M350F780C7 (non-N suffix))
Design Notes
Estimated: at 1.8V core supply, an FPGA with 350K system gates and 486 user I/Os switching simultaneously at 100 MHz can dissipate 2-4 W depending on toggle rate. The 780-ball FineLine BGA package has a typical theta_JA of 12-18 C/W with 4-layer JEDEC PCB and adequate thermal vias under the central ball array. For full-die activity at elevated ambient, follow Altera's recommended thermal-via pattern (at least 9 thermal vias per cm^2 under the die shadow) to maintain junction temperature below 100 C.
The 780-ball FineLine BGA (F780) requires 0.8 mm ball pitch with non-solder-mask-defined (NSMD) land pads for reliable assembly. Per Altera Mercury datasheet guidelines, route signal escapes on the top layer with microvia-in-pad (if using HDI) or dog-bone fanout (if using through-via). Decouple VCCINT (1.8V core) with one 0.1 uF X7R ceramic per power pin, plus bulk 47 uF tantalum per supply rail. Separate VCC_PLL analog supply must be filtered with ferrite bead and 10 uF + 0.1 uF decoupling.
Quartus II 9.1 is the last officially-supported toolchain for the Mercury family; Quartus Prime (10.0+) does NOT support EP1M350F780C7. Per Altera legacy documentation, do not migrate design files forward without preserving the legacy toolchain license and IP libraries. Also note that the C7 vs C6 vs C5 speed grade is a parametric differentiation within the SAME die - replacing C7 with C5 on the PCB requires re-running timing closure with the new speed-grade timing model in Quartus II 9.1.
The 1.25 Gbps CDR transceivers on EP1M350F780C7 require 100-ohm differential impedance on the SERDES pairs (per Altera Mercury datasheet, chapter on high-speed I/O). Use controlled-impedance routing with continuous reference plane, length matching within 5 mils across P/N pairs, and AC-coupling capacitors (0.01 uF X7R) at the transmitter side. Avoid right-angle bends on serial traces; use 45-degree bends or smooth curves. Maintain at least 3W spacing from other high-speed signals to minimize crosstalk.
Configuration scheme selection: EP1M350F780C7 supports JTAG, passive serial (PS), and active serial (AS) modes. For prototype boards, JTAG via Altera USB-Blaster allows fastest iteration. For production, AS mode with EPC2 or EPC4 configuration device is recommended. Per the Mercury datasheet, ensure nCONFIG, nSTATUS, and CONF_DONE pull-up resistors are correctly sized (10 kohm typical) and that DCLK is noise-free, as it is the most configuration-sensitive signal.
Compliance Information
RoHS and lead-free status of EP1M350F780C7 (non-N suffix) is not confirmed in the verified web data; the N-suffix variants (e.g. EP1M350F780C7N) are typically the lead-free RoHS-compliant versions per Altera legacy datasheet convention. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC. Conflict-mineral compliance status unknown from verified web data.
