EP1M350F780I5 - Altera Mercury Enhanced Configuration Device, 780-pin FBGA | Intel
MPN: EP1M350F780I5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $178 | $178,000.00 |
Drop-in alternatives for EP1M350F780I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1M350F780C8
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP1M350F780C7N
✅ Drop-In✓ In Stock
$168 / Unit
View Datasheet →EP1M350F780C7
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EP1M350F780C6N
✅ Drop-In✓ In Stock
$219.4 / Unit
View Datasheet →EP1M350F780C5N
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →EP1M350F780I5 Maximum Ratings & Electrical Characteristics
| Device Family | Altera Mercury (EP1M) Enhanced Configuration Device |
| Function | FPGA configuration PROM with integrated controller |
| Storage Density Code | 350 (high-density) |
| Supported Configuration Schemes | Passive Serial, Active Serial, Fast Passive Parallel |
| Internal Architecture | Configuration controller + flash memory array |
| Programming Method | In-system programmable via Altera Quartus / JTAG |
| Package | 780-ball FineLine BGA (F780) |
| Temperature Grade (suffix "I") | Industrial |
| Speed Grade | 5 |
| Target FPGA Compatibility | Altera APEX 20K, APEX II, Mercury, Stratix-class high-density FPGAs |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| Cascade / Multi-FPGA Support | Yes, supports daisy-chained multi-FPGA boot |
| Read-Back | Yes |
EP1M350F780I5 780-ball fineline bga (f780) Pin Configuration Guide
Complete pinout information for EP1M350F780I5 (780-ball fineline bga (f780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1M350F780I5.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1M350F780I5 is suitable for 6 applications: Telecom Line-Card FPGA Boot, Military Signal-Processing Board Boot, Industrial Controller FPGA Boot, Multi-FPGA Image-Processing Board Boot, Legacy Altera Board Repair and Sustainment, Test & Measurement Instrumentation FPGA Boot.
Telecom Line-Card FPGA Boot
The EP1M350F780I5 stores the configuration bitstream of high-density Altera APEX 20K or Stratix-class FPGAs used on telecom line cards. Its 350 density code is sized for the largest bitstreams and its industrial temperature grade handles outdoor cabinet environments (-40C to +85C). Placed near the target FPGA with the FPP configuration bus, it eliminates the need for a separate boot PROM and reduces BOM. Engineers should verify cascade rules when multiple FPGAs share the same boot chain.
Recommended
Military Signal-Processing Board Boot
Defense and aerospace signal-processing boards rely on the EP1M350F780I5 to boot high-gate-count Altera FPGAs that perform radar or DSP preprocessing. The industrial temperature grade and ruggedised FineLine BGA package suit MIL-spec vibration and thermal profiles. Its on-chip configuration controller reduces board complexity in space-constrained VPX and VME designs. JTAG read-back supports in-the-field verification of the stored bitstream.
Recommended
Industrial Controller FPGA Boot
Programmable Automation Controllers (PACs) and high-end PLCs use the EP1M350F780I5 to configure Altera APEX or Mercury FPGAs that implement deterministic motion or process control loops. The fast passive parallel configuration mode minimises boot time, which is critical when the controller must come online within milliseconds of power-up. The industrial temperature grade tolerates factory-floor thermal extremes.
Recommended
Multi-FPGA Image-Processing Board Boot
High-throughput image-processing boards (medical imaging, machine vision, broadcast video) cascade multiple Altera FPGAs and use the EP1M350F780I5 as the master boot source. The 780-ball FineLine BGA exposes all cascade control signals (nSTATUS, CONF_DONE, nCONFIG) needed to orchestrate sequential FPGA configuration. The on-chip controller handles bitstream hand-shaking so the host CPU only sees a single boot transaction.
Recommended
Legacy Altera Board Repair and Sustainment
Long-lifecycle programs (military avionics, rail signalling, power-grid SCADA) must sustain fielded boards whose original EP1M350F780I5 has failed. Because the Mercury family is NRND, the EP1M350F780I5 itself is the direct replacement for these legacy sockets. Engineers should verify the original board used the I-grade part; otherwise a C-grade Mercury 780-ball variant from the same family is an acceptable drop-in for non-extreme-temperature sites.
Recommended
Test & Measurement Instrumentation FPGA Boot
High-end oscilloscopes, logic analysers, and protocol testers use the EP1M350F780I5 to boot the Altera FPGAs that perform real-time acquisition and DSP. Fast Passive Parallel configuration minimises the wait time from power-on to first valid sample, which matters in automated production-test environments where boot latency directly impacts throughput. The industrial temperature grade supports bench-to-floor thermal variation.
Recommended
Recommended Products Summary
Engineering reference data for EP1M350F780I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1M350F780C8 | EP1M350F780C7N | EP1M350F780C7 | EP1M350F780C6N | EP1M350F780C5N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-ball FineLine BGA (F780) | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same |
| Device Family | Mercury (EP1M) Enhanced Configuration Device | Mercury (EP1M) Enhanced Configuration Device | Mercury (EP1M) Enhanced Configuration Device | Mercury (EP1M) Enhanced Configuration Device | Mercury (EP1M) Enhanced Configuration Device | Mercury (EP1M) Enhanced Configuration Device |
| Density Code | 350 (high) | 350 (same) | 350 (same) | 350 (same) | 350 (same) | 350 (same) |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Speed Grade | 5 | 8 | 7 | 7 | 6 | 5 |
| Configuration Schemes | PS / AS / FPP | PS / AS / FPP | PS / AS / FPP | PS / AS / FPP | PS / AS / FPP | PS / AS / FPP |
| JTAG Support | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial temperature grade at 780-ball density (vs EP1M350F780C8)
- Fastest available speed grade in the family (vs EP1M350F780C7N)
- Single-device boot for the largest Altera FPGAs (vs EPC16 (older EPC family))
Design Notes
Estimated: The 780-ball FineLine BGA package requires a 6-or-8-layer PCB with microvia stackups and controlled-impedance routing for the Fast Passive Parallel configuration bus. Verify your PCB fabrication house supports 0.8 mm-pitch BGA assembly before committing to the EP1M350F780I5. For prototypes, consider a socketed adapter to ease rework on this NRND part.
The Fast Passive Parallel configuration bus on the EP1M350F780I5 runs at high data rates to minimise boot time. Per Altera's configuration device handbook, route DCLK and DATA[7:0] as length-matched impedance-controlled traces (typically 50 ohm microstrip or stripline), and place a 33 ohm series damping resistor near the FPGA's CONFIG_DATA pins to suppress ringing.
Estimated: The EP1M350F780I5 is a CMOS flash configuration device with low dynamic power, so thermal dissipation is not a concern under normal boot conditions. However, sustained JTAG read-back or programming cycles can elevate die temperature in confined enclosures; ensure at least 100 LFM of airflow across the BGA in sealed industrial enclosures to keep junction temperature within the -40C to +85C industrial envelope.
Place the EP1M350F780I5 as close as possible to the target FPGA to minimise the length of the configuration bus. Decouple VCCINT and VCCIO with 0.1 uF X7R ceramics placed within 5 mm of the respective BGA balls, plus a bulk 10 uF tantalum or polymer capacitor. Keep the JTAG chain (TCK, TMS, TDI, TDO) separate from the configuration bus to avoid crosstalk during in-system programming.
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not listed in the verified distributor data; all marked unknown per the data authenticity rules. EP1M350F780I5 is a programmable logic configuration device, so AEC-Q100 automotive qualification is not applicable.
