EP20K200EBC652-3N - APEX 20KE 200K FPGA, 652-BGA | Altera
MPN: EP20K200EBC652-3N ✗ סוף ייצורEP20K200EBC652-3N סקירה
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing via a programmable interconnect of configurable logic blocks (CLBs), embedded memory, and I/O cells. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below ASICs in performance-per-watt. APEX 20KE devices were Altera's first-generation 'system-on-a-programmable-chip' (SOPC) platform, blending LUT and product-term logic to support both datapath-intensive and glue-logic designs in one fabric.
Key features include 832 macrocells, 277 user I/Os in one source entry, 376 programmable I/Os in another source, 652-BGA package, MultiCore™ architecture with embedded memory, LVDS I/O support, and an extended commercial operating temperature grade of 0 °C to 85 °C (TJ). The device supports in-system programming via the Altera Quartus / MAX+plus II toolchain via the IEEE 1149.1 JTAG interface and the passive serial configuration scheme.
This part is engineered for high-density glue-logic integration, telecommunications backplane glue, custom DSP pre-processing, and bus-protocol bridging where ASIC NRE costs cannot be justified. The high I/O count (376 pins) suits memory interfaces and parallel bus architectures, while the 106 Kbit embedded RAM block enables on-chip FIFOs and small lookup tables without external SRAM.
Typical applications include telecom line cards, industrial control, custom DSP pre-processing, multi-protocol bus bridges, and prototyping of ASIC-class logic at moderate unit volumes. When migrating, verify timing closure against the Quartus TimeQuest slow-corner model because the -3 speed grade is the slowest in the APEX 20KE family.
חלופות תחליף ישיר עבור EP20K200EBC652-3N — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EP20K200EBC652-3N (אותו גורם צורה וטביעת רגל) — שונים ב Package, Process Technology, Series, Operating Temperature, Family.
EP20K200EBC652-1X
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K200EBC652-2X
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K200EBC652-3
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K200CB652C7ES
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K1500EBC652-1X
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP20K200EBC652-3N דירוגים מרביים ומאפיינים חשמליים
| Series | APEX 20KE (APEX-20KE®) |
| Device Family | EP20K200 |
| System Gates | 200,000 |
| Logic Elements / Cells | 8,320 |
| Logic Array Blocks (LABs) | 832 |
| Macrocells | 832 |
| Embedded RAM | 106,496 bits |
| User I/Os (DigiKey listing) | 376 |
| User I/Os (digchip listing) | 277 |
| Propagation Delay | 2.33 ns |
| Internal Frequency (max) | 189 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 1.71 V to 1.89 V (nominal 1.8 V) |
| I/O Supply (LVDS-capable) | LVDS, 2.5 V referenced (per source variant) |
| מארז | 652-ball BGA |
| סוג הרכבה | Surface Mount |
| Operating Temperature (TJ) | 0 °C to 85 °C (commercial) |
| Speed Grade | -3 (slowest in APEX 20KE family) |
| Configuration | JTAG (IEEE 1149.1), Passive Serial |
| סטטוס RoHS | Compliant |
מדריך תצורת פינים של EP20K200EBC652-3N 652-ball bga
תצורת פינים עבור EP20K200EBC652-3N (מארזת 652-ball bga). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור EP20K200EBC652-3N.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
EP20K200EBC652-3N מתאים עבור 6 יישוםs: Telecommunications Line-Card Glue Logic, Custom DSP Pre-Processing Front-End, Industrial Control and Factory Automation, Multi-Protocol Bus Bridge, Legacy ASIC Prototype and Emulation, Test and Measurement Instrumentation.
Telecommunications Line-Card Glue Logic
The EP20K200EBC652-3N's 200,000 system gates and 376 user I/Os are well-suited to telecom line-card glue-logic consolidation, where parallel bus bridges, framing logic, and protocol converters must coexist in a single fabric. Its LVDS-capable I/O at 2.5 V references backplane SERDES links, while the 106 Kbit embedded RAM supports per-channel FIFOs without external SRAM. The 652-BGA package provides the routing density required for high-pin-count backplane designs, and Quartus Legacy support ensures compatibility with existing APEX 20KE design flows.
מומלץ
Custom DSP Pre-Processing Front-End
In DSP front-end pre-processing, the EP20K200EBC652-3N's 8,320 logic elements and 189 MHz maximum frequency enable FIR filtering, sample-rate conversion, and fixed-point datapath functions ahead of a dedicated DSP or ASIC. The MultiCore™ architecture's product-term logic supports fast arithmetic carry chains, while the embedded RAM blocks implement coefficient storage. This combination gives 2.33 ns propagation delay suitable for sample-rate pipelines in audio and baseband processing subsystems.
מומלץ
Industrial Control and Factory Automation
For industrial control applications, the EP20K200EBC652-3N offers 376 I/Os to interface with parallel PLC backplanes, encoder channels, and discrete I/O modules. Its commercial 0 °C to 85 °C temperature range suits factory-floor enclosures with moderate thermal management. The CMOS 1.8 V core supply reduces power versus legacy 5 V FPGAs, while LVDS I/O ensures noise immunity in electrically noisy industrial environments. The 832 LABs support custom state machines for deterministic machine control.
מומלץ
Multi-Protocol Bus Bridge
Bus-bridging designs (PCI-to-local bus, VME-to-PCI, proprietary protocol converters) benefit from the EP20K200EBC652-3N's combination of high I/O count and embedded memory. The 376 programmable I/Os map to multi-bus interfaces without external transceivers, while the 106 Kbit of RAM implements FIFOs, lookup tables, and protocol state buffers. JTAG configuration via IEEE 1149.1 enables in-field firmware updates for installed bridges, critical for industrial and defense applications.
מומלץ
Legacy ASIC Prototype and Emulation
The EP20K200EBC652-3N is well-suited as a prototype vehicle for ASIC-class designs where NRE cannot yet be justified. Engineers can drop full pre-silicon RTL into the 8,320 logic elements and 106 Kbit RAM to validate architecture before committing to ASIC tape-out. The Quartus Legacy tool flow provides synthesis and timing closure. The -3 speed grade's relaxed timing is actually advantageous at the prototype stage, giving margin against unexpected RTL changes.
מומלץ
Test and Measurement Instrumentation
Test and measurement platforms require custom timing generators, protocol analyzers, and stimulus engines, all of which fit the EP20K200EBC652-3N's fabric. Its 376 I/Os drive parallel stimulus buses, while the embedded RAM captures deep trace buffers. The 189 MHz internal frequency enables high-rate pattern generation. The 652-BGA package's thermal performance suits instruments with moderate cooling, and the 1.8 V core keeps power dissipation manageable in dense PXI/VXI-style modules.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EP20K200EBC652-3N — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EP20K200EBC652-1X | EP20K200EBC652-2X | EP20K200EBC652-3 | EP20K1500EBC652-1X |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 652-BGA | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 1,500,000 |
| Speed Grade | -3 (slowest) | -1 (fastest) | -2 (mid) | -3 | -1 |
| Core Voltage | 1.8 V (1.71-1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
מבדילים עיקריים
- Highest density in the APEX 20KE family with 652-BGA option (לעומתEP20K100EBC652-2X)
- Commercial temperature grade with MultiCore™ architecture (לעומתEP20K200CF484I9N)
- Embedded RAM enables bus-bridge designs without external SRAM (לעומתEP20K200BC356-3)
הערות תכנון
Estimated: With 1.8 V core, 376 I/Os at 2.5 V LVDS, and 100% toggle utilization, total power draw can reach 2-3 W for the EP20K200EBC652-3N. Provide a low-noise LDO (e.g., TPS7A4701) for the 1.8 V rail with 10 µF X7R ceramic decoupling at each supply ball and 0.1 µF bypass caps within 5 mm of every power pin. The 652-BGA package's 25 mm × 25 mm footprint requires at least 4-layer PCB with a continuous ground plane beneath the device.
Estimated: The 652-BGA package's θJA is approximately 18 °C/W with a 4-layer JEDEC test board. At 2.5 W dissipation, junction temperature rises 45 °C above ambient, putting the -3 commercial part (rated to 85 °C TJ) at risk in enclosed industrial enclosures above 40 °C ambient. Either derate I/O toggle rate, add heatsinking via thermal via arrays under the exposed die pad, or migrate to the -1 speed grade in an industrial-temperature member.
BGA breakout requires via-in-pad or microvia technology on the 652-BGA's 1.27 mm pitch. Route all 376 user I/Os on inner signal layers with matched-length groups for LVDS pairs (≤ 0.5 mm intra-pair skew). Reference the APEX 20KE hardware design guide for the recommended decoupling capacitor placement and BGA land-pattern dimensions. X-ray inspection is mandatory for solder-joint verification on BGA.
Do not confuse the EP20K200EBC652-3N with the EP20K200EBC652-3 (no 'N' suffix) - both are functionally identical silicon, but the 'N' suffix typically denotes lead-free / RoHS-compliant terminal finish. Also note that two source listings report different user I/O counts (376 vs 277); the 376-Ball BGA silicon supports up to 376 user I/Os, but pinout files may show fewer active I/Os depending on configuration mode. Always trust the Quartus pinout file over generic distributor listings.
מידע על תאימות
Lead-free per 'N' suffix in MPN. RoHS compliance confirmed by DigiKey listing. REACH, halogen-free, and conflict-minerals status not stated by Altera on legacy APEX 20KE family documentation.