EP20K200EBC652-3N - APEX 20KE 200K FPGA, 652-BGA | Altera
MPN: EP20K200EBC652-3N ✗ Tapus ng BuhayEP20K200EBC652-3N Ulas
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing via a programmable interconnect of configurable logic blocks (CLBs), embedded memory, and I/O cells. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below ASICs in performance-per-watt. APEX 20KE devices were Altera's first-generation 'system-on-a-programmable-chip' (SOPC) platform, blending LUT and product-term logic to support both datapath-intensive and glue-logic designs in one fabric.
Key features include 832 macrocells, 277 user I/Os in one source entry, 376 programmable I/Os in another source, 652-BGA package, MultiCore™ architecture with embedded memory, LVDS I/O support, and an extended commercial operating temperature grade of 0 °C to 85 °C (TJ). The device supports in-system programming via the Altera Quartus / MAX+plus II toolchain via the IEEE 1149.1 JTAG interface and the passive serial configuration scheme.
This part is engineered for high-density glue-logic integration, telecommunications backplane glue, custom DSP pre-processing, and bus-protocol bridging where ASIC NRE costs cannot be justified. The high I/O count (376 pins) suits memory interfaces and parallel bus architectures, while the 106 Kbit embedded RAM block enables on-chip FIFOs and small lookup tables without external SRAM.
Typical applications include telecom line cards, industrial control, custom DSP pre-processing, multi-protocol bus bridges, and prototyping of ASIC-class logic at moderate unit volumes. When migrating, verify timing closure against the Quartus TimeQuest slow-corner model because the -3 speed grade is the slowest in the APEX 20KE family.
Mga alternatibo na pwedeng ilagay na EP20K200EBC652-3N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP20K200EBC652-3N (parehas na form factor at footprint) — pagkakaiba sa Package, Process Technology, Series, Operating Temperature, Family.
EP20K200EBC652-1X
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP20K200EBC652-2X
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP20K200EBC652-3
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP20K200CB652C7ES
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP20K1500EBC652-1X
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP20K200EBC652-3N Mga Pinakamataas na Rating at Electrical Characteristics
| Series | APEX 20KE (APEX-20KE®) |
| Device Family | EP20K200 |
| System Gates | 200,000 |
| Logic Elements / Cells | 8,320 |
| Logic Array Blocks (LABs) | 832 |
| Macrocells | 832 |
| Embedded RAM | 106,496 bits |
| User I/Os (DigiKey listing) | 376 |
| User I/Os (digchip listing) | 277 |
| Propagation Delay | 2.33 ns |
| Internal Frequency (max) | 189 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 1.71 V to 1.89 V (nominal 1.8 V) |
| I/O Supply (LVDS-capable) | LVDS, 2.5 V referenced (per source variant) |
| Packhaging | 652-ball BGA |
| Uri ng Pagpapasok | Surface Mount |
| Operating Temperature (TJ) | 0 °C to 85 °C (commercial) |
| Speed Grade | -3 (slowest in APEX 20KE family) |
| Configuration | JTAG (IEEE 1149.1), Passive Serial |
| Tindminan RoHS | Compliant |
Gabay sa Pin Configuration ng EP20K200EBC652-3N 652-ball bga
Pin configuration para sa EP20K200EBC652-3N (652-ball bga package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP20K200EBC652-3N.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP20K200EBC652-3N ay nararapat para sa 6 aplikasyons: Telecommunications Line-Card Glue Logic, Custom DSP Pre-Processing Front-End, Industrial Control and Factory Automation, Multi-Protocol Bus Bridge, Legacy ASIC Prototype and Emulation, Test and Measurement Instrumentation.
Telecommunications Line-Card Glue Logic
The EP20K200EBC652-3N's 200,000 system gates and 376 user I/Os are well-suited to telecom line-card glue-logic consolidation, where parallel bus bridges, framing logic, and protocol converters must coexist in a single fabric. Its LVDS-capable I/O at 2.5 V references backplane SERDES links, while the 106 Kbit embedded RAM supports per-channel FIFOs without external SRAM. The 652-BGA package provides the routing density required for high-pin-count backplane designs, and Quartus Legacy support ensures compatibility with existing APEX 20KE design flows.
Inirekomenda
Custom DSP Pre-Processing Front-End
In DSP front-end pre-processing, the EP20K200EBC652-3N's 8,320 logic elements and 189 MHz maximum frequency enable FIR filtering, sample-rate conversion, and fixed-point datapath functions ahead of a dedicated DSP or ASIC. The MultiCore™ architecture's product-term logic supports fast arithmetic carry chains, while the embedded RAM blocks implement coefficient storage. This combination gives 2.33 ns propagation delay suitable for sample-rate pipelines in audio and baseband processing subsystems.
Inirekomenda
Industrial Control and Factory Automation
For industrial control applications, the EP20K200EBC652-3N offers 376 I/Os to interface with parallel PLC backplanes, encoder channels, and discrete I/O modules. Its commercial 0 °C to 85 °C temperature range suits factory-floor enclosures with moderate thermal management. The CMOS 1.8 V core supply reduces power versus legacy 5 V FPGAs, while LVDS I/O ensures noise immunity in electrically noisy industrial environments. The 832 LABs support custom state machines for deterministic machine control.
Inirekomenda
Multi-Protocol Bus Bridge
Bus-bridging designs (PCI-to-local bus, VME-to-PCI, proprietary protocol converters) benefit from the EP20K200EBC652-3N's combination of high I/O count and embedded memory. The 376 programmable I/Os map to multi-bus interfaces without external transceivers, while the 106 Kbit of RAM implements FIFOs, lookup tables, and protocol state buffers. JTAG configuration via IEEE 1149.1 enables in-field firmware updates for installed bridges, critical for industrial and defense applications.
Inirekomenda
Legacy ASIC Prototype and Emulation
The EP20K200EBC652-3N is well-suited as a prototype vehicle for ASIC-class designs where NRE cannot yet be justified. Engineers can drop full pre-silicon RTL into the 8,320 logic elements and 106 Kbit RAM to validate architecture before committing to ASIC tape-out. The Quartus Legacy tool flow provides synthesis and timing closure. The -3 speed grade's relaxed timing is actually advantageous at the prototype stage, giving margin against unexpected RTL changes.
Inirekomenda
Test and Measurement Instrumentation
Test and measurement platforms require custom timing generators, protocol analyzers, and stimulus engines, all of which fit the EP20K200EBC652-3N's fabric. Its 376 I/Os drive parallel stimulus buses, while the embedded RAM captures deep trace buffers. The 189 MHz internal frequency enables high-rate pattern generation. The 652-BGA package's thermal performance suits instruments with moderate cooling, and the 1.8 V core keeps power dissipation manageable in dense PXI/VXI-style modules.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP20K200EBC652-3N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP20K200EBC652-1X | EP20K200EBC652-2X | EP20K200EBC652-3 | EP20K1500EBC652-1X |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 652-BGA | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 1,500,000 |
| Speed Grade | -3 (slowest) | -1 (fastest) | -2 (mid) | -3 | -1 |
| Core Voltage | 1.8 V (1.71-1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Pangunahing mga Pagkakaiba
- Highest density in the APEX 20KE family with 652-BGA option (kumpara saEP20K100EBC652-2X)
- Commercial temperature grade with MultiCore™ architecture (kumpara saEP20K200CF484I9N)
- Embedded RAM enables bus-bridge designs without external SRAM (kumpara saEP20K200BC356-3)
Talaan ng Disenyo
Estimated: With 1.8 V core, 376 I/Os at 2.5 V LVDS, and 100% toggle utilization, total power draw can reach 2-3 W for the EP20K200EBC652-3N. Provide a low-noise LDO (e.g., TPS7A4701) for the 1.8 V rail with 10 µF X7R ceramic decoupling at each supply ball and 0.1 µF bypass caps within 5 mm of every power pin. The 652-BGA package's 25 mm × 25 mm footprint requires at least 4-layer PCB with a continuous ground plane beneath the device.
Estimated: The 652-BGA package's θJA is approximately 18 °C/W with a 4-layer JEDEC test board. At 2.5 W dissipation, junction temperature rises 45 °C above ambient, putting the -3 commercial part (rated to 85 °C TJ) at risk in enclosed industrial enclosures above 40 °C ambient. Either derate I/O toggle rate, add heatsinking via thermal via arrays under the exposed die pad, or migrate to the -1 speed grade in an industrial-temperature member.
BGA breakout requires via-in-pad or microvia technology on the 652-BGA's 1.27 mm pitch. Route all 376 user I/Os on inner signal layers with matched-length groups for LVDS pairs (≤ 0.5 mm intra-pair skew). Reference the APEX 20KE hardware design guide for the recommended decoupling capacitor placement and BGA land-pattern dimensions. X-ray inspection is mandatory for solder-joint verification on BGA.
Do not confuse the EP20K200EBC652-3N with the EP20K200EBC652-3 (no 'N' suffix) - both are functionally identical silicon, but the 'N' suffix typically denotes lead-free / RoHS-compliant terminal finish. Also note that two source listings report different user I/O counts (376 vs 277); the 376-Ball BGA silicon supports up to 376 user I/Os, but pinout files may show fewer active I/Os depending on configuration mode. Always trust the Quartus pinout file over generic distributor listings.
Impormasyon ng Pagsunod sa Kautusan
Lead-free per 'N' suffix in MPN. RoHS compliance confirmed by DigiKey listing. REACH, halogen-free, and conflict-minerals status not stated by Altera on legacy APEX 20KE family documentation.