Altera

EP20K200EBC652-3N - APEX 20KE 200K FPGA, 652-BGA | Altera

MPN: EP20K200EBC652-3N ✗ Cuối đời
1.71 V to 1.89 V (nominal 1.8 V) Vdss 652-ball BGA Package 189 MHz Speed
MOQ: 1 |

EP20K200EBC652-3N Tóm tắt

The Altera EP20K200EBC652-3N is a high-density APEX 20KE-series Field Programmable Gate Array (FPGA) in the 652-ball BGA package, featuring 200,000 system gates, 8,320 logic elements, and 376 user I/O pins. It is built on a 0.22 µm CMOS process with a 1.8 V nominal core supply (operating range 1.71 V to 1.89 V) and operates at up to 189 MHz internal frequency with a 2.33 ns propagation delay. The device integrates 106,496 bits of embedded RAM and 832 logic array blocks in Altera's MultiCore™ architecture combining look-up table logic, product-term logic, and embedded memory in a single fabric.

A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing via a programmable interconnect of configurable logic blocks (CLBs), embedded memory, and I/O cells. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below ASICs in performance-per-watt. APEX 20KE devices were Altera's first-generation 'system-on-a-programmable-chip' (SOPC) platform, blending LUT and product-term logic to support both datapath-intensive and glue-logic designs in one fabric.

Key features include 832 macrocells, 277 user I/Os in one source entry, 376 programmable I/Os in another source, 652-BGA package, MultiCore™ architecture with embedded memory, LVDS I/O support, and an extended commercial operating temperature grade of 0 °C to 85 °C (TJ). The device supports in-system programming via the Altera Quartus / MAX+plus II toolchain via the IEEE 1149.1 JTAG interface and the passive serial configuration scheme.

This part is engineered for high-density glue-logic integration, telecommunications backplane glue, custom DSP pre-processing, and bus-protocol bridging where ASIC NRE costs cannot be justified. The high I/O count (376 pins) suits memory interfaces and parallel bus architectures, while the 106 Kbit embedded RAM block enables on-chip FIFOs and small lookup tables without external SRAM.

Typical applications include telecom line cards, industrial control, custom DSP pre-processing, multi-protocol bus bridges, and prototyping of ASIC-class logic at moderate unit volumes. When migrating, verify timing closure against the Quartus TimeQuest slow-corner model because the -3 speed grade is the slowest in the APEX 20KE family.

Bộ thay thế dễ dàng lắp đặt cho EP20K200EBC652-3N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP20K200EBC652-3N (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Series, Operating Temperature, Family.

Altera
Package: 652-ball BGA (FCBGA / PBGA652)
Operating Temperature: 0 °C to +85 °C (commercial)
Family: APEX 20KE
So sánh với EP20K200EBC652-3N →
Altera
Package: 652-BGA
Family: APEX 20K
So sánh với EP20K200EBC652-3N →
Altera
Package: 652-BGA (45x45 mm)
Process Technology: 0.18 µm CMOS
Series: APEX-20KE
So sánh với EP20K200EBC652-3N →
Altera
Package: 652-BGA
Process Technology: 0.18 um CMOS
Series: APEX-20KE®
So sánh với EP20K200EBC652-3N →
Intel
Package: 652-ball FineLine BGA (top-side, 1.27 mm pitch)
Operating Temperature: 0C to +85C (EBC - Enhanced Commercial)
Family: APEX-20KE
So sánh với EP20K200EBC652-3N →
Intel
Package: 208-BFQFP / PQFP208 (Plastic Quad Flat Pack, gull-wing)
Series: APEX 20K (enhanced "E" variant)
Family: APEX 20KE
So sánh với EP20K200EBC652-3N →
Altera
Process Technology: 0.22 um CMOS
Series: APEX 20KE
So sánh với EP20K200EBC652-3N →
Altera
Series: APEX 20KE
Operating Temperature: 0 C to +85 C
So sánh với EP20K200EBC652-3N →
Intel
Package: 652-ball PBGA (BGA-652)
Process Technology: 0.15-um all-layer copper
Operating Temperature: 0 C to 85 C (commercial)
So sánh với EP20K200EBC652-3N →

EP20K200EBC652-1X

✅ Drop-In ⚠️ Thông số chưa được xác minh
Altera
📦 652-BGA
APEX 20KE · APEX-20KE · 8320 · 832 · 106496 · 376 · 1.8 V (1.71 V to 1.89 V) · 1.71 V to 1.89 V

Liên hệ để biết giá

Xem tài liệu →

EP20K200EBC652-2X

✅ Drop-In ⚠️ Thông số chưa được xác minh
Altera
📦 652-BGA
APEX-20KE® · APEX-20KE · 8,320 · 832 · 106,496 · 376 · 200,000 (typical) · 1.71 V to 1.89 V (1.8 V nominal)

Liên hệ để biết giá

Xem tài liệu →

EP20K200EBC652-3

✅ Drop-In
Intel
📦 652-BGA
APEX-20KE · 8,320 · 832 · 106,496 · 376 · Yes (dual-port RAM / ROM / CAM) · 4 · 652-ball FineLine BGA (top-side, 1.27 mm pitch)

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Xem tài liệu →

EP20K200CB652C7ES

✅ Drop-In ⚠️ Thông số chưa được xác minh
Altera
📦 652-BGA
APEX 20K · 8,320 · 106,496 bits · 1.8 V · 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) · -7 · 0 °C to +85 °C

Liên hệ để biết giá

Xem tài liệu →

EP20K1500EBC652-1X

✅ Drop-In
Altera
📦 652-BGA
APEX 20KE · 51840 · 1.5 M · 3456 · 442368 · 488 · 1.84 ns

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Xem tài liệu →

EP20K200EBC652-3N Tỷ lệ tối đa & tính chất điện

Series APEX 20KE (APEX-20KE®)
Device Family EP20K200
System Gates 200,000
Logic Elements / Cells 8,320
Logic Array Blocks (LABs) 832
Macrocells 832
Embedded RAM 106,496 bits
User I/Os (DigiKey listing) 376
User I/Os (digchip listing) 277
Propagation Delay 2.33 ns
Internal Frequency (max) 189 MHz
Process Technology 0.22 µm CMOS
Core Supply Voltage 1.71 V to 1.89 V (nominal 1.8 V)
I/O Supply (LVDS-capable) LVDS, 2.5 V referenced (per source variant)
Hộp 652-ball BGA
Kiểu lắp đặt Surface Mount
Operating Temperature (TJ) 0 °C to 85 °C (commercial)
Speed Grade -3 (slowest in APEX 20KE family)
Configuration JTAG (IEEE 1149.1), Passive Serial
Trạng thái RoHS Compliant

Hướng dẫn cấu hình chân EP20K200EBC652-3N 652-ball bga

Cấu hình chân cho EP20K200EBC652-3N (652-ball bga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.

Bảng cấu hình chân 652-ball bga cho EP20K200EBC652-3N

Không có dữ liệu chân cụ thể sẵn có cho EP20K200EBC652-3N.

Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.

Ứng dụng tiêu biểu

EP20K200EBC652-3N phù hợp cho 6 Áp dụngs: Telecommunications Line-Card Glue Logic, Custom DSP Pre-Processing Front-End, Industrial Control and Factory Automation, Multi-Protocol Bus Bridge, Legacy ASIC Prototype and Emulation, Test and Measurement Instrumentation.

🌐

Telecommunications Line-Card Glue Logic

The EP20K200EBC652-3N's 200,000 system gates and 376 user I/Os are well-suited to telecom line-card glue-logic consolidation, where parallel bus bridges, framing logic, and protocol converters must coexist in a single fabric. Its LVDS-capable I/O at 2.5 V references backplane SERDES links, while the 106 Kbit embedded RAM supports per-channel FIFOs without external SRAM. The 652-BGA package provides the routing density required for high-pin-count backplane designs, and Quartus Legacy support ensures compatibility with existing APEX 20KE design flows.

🎧

Custom DSP Pre-Processing Front-End

In DSP front-end pre-processing, the EP20K200EBC652-3N's 8,320 logic elements and 189 MHz maximum frequency enable FIR filtering, sample-rate conversion, and fixed-point datapath functions ahead of a dedicated DSP or ASIC. The MultiCore™ architecture's product-term logic supports fast arithmetic carry chains, while the embedded RAM blocks implement coefficient storage. This combination gives 2.33 ns propagation delay suitable for sample-rate pipelines in audio and baseband processing subsystems.

🏭

Industrial Control and Factory Automation

For industrial control applications, the EP20K200EBC652-3N offers 376 I/Os to interface with parallel PLC backplanes, encoder channels, and discrete I/O modules. Its commercial 0 °C to 85 °C temperature range suits factory-floor enclosures with moderate thermal management. The CMOS 1.8 V core supply reduces power versus legacy 5 V FPGAs, while LVDS I/O ensures noise immunity in electrically noisy industrial environments. The 832 LABs support custom state machines for deterministic machine control.

🖥️

Multi-Protocol Bus Bridge

Bus-bridging designs (PCI-to-local bus, VME-to-PCI, proprietary protocol converters) benefit from the EP20K200EBC652-3N's combination of high I/O count and embedded memory. The 376 programmable I/Os map to multi-bus interfaces without external transceivers, while the 106 Kbit of RAM implements FIFOs, lookup tables, and protocol state buffers. JTAG configuration via IEEE 1149.1 enables in-field firmware updates for installed bridges, critical for industrial and defense applications.

🔧

Legacy ASIC Prototype and Emulation

The EP20K200EBC652-3N is well-suited as a prototype vehicle for ASIC-class designs where NRE cannot yet be justified. Engineers can drop full pre-silicon RTL into the 8,320 logic elements and 106 Kbit RAM to validate architecture before committing to ASIC tape-out. The Quartus Legacy tool flow provides synthesis and timing closure. The -3 speed grade's relaxed timing is actually advantageous at the prototype stage, giving margin against unexpected RTL changes.

📺

Test and Measurement Instrumentation

Test and measurement platforms require custom timing generators, protocol analyzers, and stimulus engines, all of which fit the EP20K200EBC652-3N's fabric. Its 376 I/Os drive parallel stimulus buses, while the embedded RAM captures deep trace buffers. The 189 MHz internal frequency enables high-rate pattern generation. The 652-BGA package's thermal performance suits instruments with moderate cooling, and the 1.8 V core keeps power dissipation manageable in dense PXI/VXI-style modules.

What is the logic capacity of EP20K200EBC652-3N?
The EP20K200EBC652-3N provides 200,000 system gates, 8,320 logic elements, 832 macrocells, and 832 logic array blocks (LABs). According to the Altera APEX 20KE datasheet, the device also includes 106,496 bits of embedded RAM, making it one of the highest-density members of the APEX 20KE family and well suited for glue-logic integration and bus-bridging designs where ASIC NRE cannot be justified.
What is the core supply voltage of EP20K200EBC652-3N?
The EP20K200EBC652-3N operates from a 1.71 V to 1.89 V core supply with a nominal value of 1.8 V, as confirmed in Microchip USA's listing. The I/O bank supports LVDS signaling at a referenced 2.5 V supply per the APEX 20KE device family documentation. Designers must provide a tightly regulated 1.8 V rail with ±5% tolerance and adequate decoupling to ensure timing closure.
What is the maximum internal frequency of EP20K200EBC652-3N?
The EP20K200EBC652-3N supports a maximum internal operating frequency of 189 MHz at the -3 speed grade, with a worst-case propagation delay of 2.33 ns. According to Altera, this speed grade is the slowest in the APEX 20KE family; designers targeting higher performance should select -1 or -2 variants, which require tighter Quartus TimeQuest timing constraints.
How many user I/Os does EP20K200EBC652-3N have?
User I/O count varies by source: DigiKey's Rochester Electronics listing specifies 376 user I/Os, while an older digchip entry lists 277. The actual silicon implements up to 376 programmable I/O pins in the 652-BGA package, so the 376-pin figure is authoritative for PCB layout. Engineers should consult the Quartus pinout file for the precise per-pin mapping.
What package does EP20K200EBC652-3N use?
The EP20K200EBC652-3N is housed in a 652-ball fine-pitch BGA package suitable for surface mounting on multilayer PCBs. The 'BC652' suffix in the MPN denotes this 652-BGA package option. BGA assembly requires X-ray or endoscopic inspection for solder-joint verification, and PCB land patterns must follow the Altera-recommended footprint per the APEX 20KE handbook.
Is EP20K200EBC652-3N still in production?
No. The EP20K200EBC652-3N is listed as obsolete on distributor channels, with remaining stock available through Rochester Electronics and a small set of authorized brokers. Engineers designing new products should target Cyclone IV/V or MAX 10 instead. For maintenance of legacy equipment, Rochester Electronics is the primary franchised source for new-old-stock APEX 20KE silicon.
Where can I download the EP20K200EBC652-3N datasheet?
The official APEX 20KE device family datasheet is hosted at https://www.altera.com/literature/ds/apex_20ke.pdf and contains the full EP20K200EBC652-3N specification, including DC characteristics, timing models, and pin assignments. The Quatus pinout file is referenced through the Altera legacy documentation index at altera.com. We also recommend cross-checking against Rochester Electronics' product listing for any errata.
What is the pinout of EP20K200EBC652-3N?
The EP20K200EBC652-3N pinout is defined by the 652-ball BGA ball-map in the APEX 20KE datasheet. Because BGA pinouts are matrix-defined rather than sequential, the authoritative source is the Quartus pinout file (.pin) shipped with the Quartus design tool, which lists every ball and its bank assignment. Engineers should never assume BGA pin numbering follows a simple linear order.
Where to buy EP20K200EBC652-3N online?
EP20K200EBC652-3N is available through Rochester Electronics (franchised), Microchip USA, Veswin Electronics, and selected authorized brokers such as Jotrin. As of 2026-09-07, distributor pricing was reported on Octopart across 3 vendors. XAIPART can also source this part on a quote basis given its obsolete lifecycle status and limited remaining stock.
What is the price of EP20K200EBC652-3N?
Pricing as of 2026-09-07 ranges from approximately $220 (qty 500) to $285 (qty 1) on the open market, reflecting the obsolete status of the APEX 20KE family. Volume discounts bring unit pricing down toward $220 at 500-piece quantities. Expect lead times of 4-12 weeks for new orders because remaining stock is limited.
What is the lead time for EP20K200EBC652-3N?
Lead time as of 2026-09-07 is typically 4-12 weeks for distributor-channel stock of the EP20K200EBC652-3N, owing to its obsolete lifecycle and limited remaining inventory. Rochester Electronics generally quotes shorter lead times for franchised N-stock. Engineers are advised to qualify a Cyclone or MAX 10 replacement in parallel to avoid future obsolescence risk.
What is a drop-in replacement for EP20K200EBC652-3N?
The closest pin-compatible drop-in replacement for EP20K200EBC652-3N is the EP20K200EBC652-1X (speed-grade -1) or EP20K200EBC652-2X (speed-grade -2), both in the identical 652-BGA package. These variants share the same 200K gates, 8,320 logic elements, and I/O count, differing only in internal frequency. For modern designs, consider the Cyclone IV EP4CE115F29 as a functional modernization path.
EP20K200EBC652-3N vs EP20K200EBC652-1X - which is better for high-speed designs?
The EP20K200EBC652-1X is faster than the -3N: it operates at a higher internal frequency with tighter propagation delay because -1 is the highest speed grade in the APEX 20KE family. The -3N is the slowest grade. For timing-critical paths, choose the -1X; the -3N suits cost-sensitive legacy builds where 189 MHz is sufficient. Both share the same 652-BGA package and are drop-in interchangeable.
Can EP20K200EBC652-3N be used for new product designs?
No, the EP20K200EBC652-3N should not be used for new product designs in 2026. It is obsolete, unsupported by the Quartus Prime toolchain beyond legacy compatibility mode, and has a shrinking authorized stock base. For new designs, use Cyclone IV/V, MAX 10, or Lattice ECP5. The -3N is best reserved for maintenance of legacy equipment where a verified design already exists.

Dữ liệu tham khảo kỹ thuật cho EP20K200EBC652-3N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the EP20K200EBC652-3N when you need a high-density (200K gates) APEX 20KE FPGA in the 652-BGA package at the lowest speed grade for cost-sensitive legacy maintenance. Choose EP20K200EBC652-1X if you need the fastest timing closure in the same footprint; choose -2X for a balanced speed/cost compromise. For modern new designs, migrate to Altera Cyclone IV (EP4CE115) or Lattice ECP5 (LFE5UM-85) for active lifecycle support and current toolchains. The EP20K200EBC652-3N is best reserved for legacy equipment repair and cost-sensitive maintenance where verified designs already exist.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này EP20K200EBC652-1X EP20K200EBC652-2X EP20K200EBC652-3 EP20K1500EBC652-1X
Brand Altera Altera Altera Altera Altera
Package 652-BGA 652-BGA - same 652-BGA - same 652-BGA - same 652-BGA - same
System Gates 200,000 200,000 200,000 200,000 1,500,000
Speed Grade -3 (slowest) -1 (fastest) -2 (mid) -3 -1
Core Voltage 1.8 V (1.71-1.89 V) 1.8 V 1.8 V 1.8 V 1.8 V
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete

Bảo phân biệt quan trọng

  • Highest density in the APEX 20KE family with 652-BGA option (vsEP20K100EBC652-2X)
  • Commercial temperature grade with MultiCore™ architecture (vsEP20K200CF484I9N)
  • Embedded RAM enables bus-bridge designs without external SRAM (vsEP20K200BC356-3)

Ghi chú thiết kế

Estimated: With 1.8 V core, 376 I/Os at 2.5 V LVDS, and 100% toggle utilization, total power draw can reach 2-3 W for the EP20K200EBC652-3N. Provide a low-noise LDO (e.g., TPS7A4701) for the 1.8 V rail with 10 µF X7R ceramic decoupling at each supply ball and 0.1 µF bypass caps within 5 mm of every power pin. The 652-BGA package's 25 mm × 25 mm footprint requires at least 4-layer PCB with a continuous ground plane beneath the device.

Estimated: The 652-BGA package's θJA is approximately 18 °C/W with a 4-layer JEDEC test board. At 2.5 W dissipation, junction temperature rises 45 °C above ambient, putting the -3 commercial part (rated to 85 °C TJ) at risk in enclosed industrial enclosures above 40 °C ambient. Either derate I/O toggle rate, add heatsinking via thermal via arrays under the exposed die pad, or migrate to the -1 speed grade in an industrial-temperature member.

BGA breakout requires via-in-pad or microvia technology on the 652-BGA's 1.27 mm pitch. Route all 376 user I/Os on inner signal layers with matched-length groups for LVDS pairs (≤ 0.5 mm intra-pair skew). Reference the APEX 20KE hardware design guide for the recommended decoupling capacitor placement and BGA land-pattern dimensions. X-ray inspection is mandatory for solder-joint verification on BGA.

Do not confuse the EP20K200EBC652-3N with the EP20K200EBC652-3 (no 'N' suffix) - both are functionally identical silicon, but the 'N' suffix typically denotes lead-free / RoHS-compliant terminal finish. Also note that two source listings report different user I/O counts (376 vs 277); the 376-Ball BGA silicon supports up to 376 user I/Os, but pinout files may show fewer active I/Os depending on configuration mode. Always trust the Quartus pinout file over generic distributor listings.

Thông tin tuân thủ

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Không chì
Yes
Không halogen
Unknown
Khoáng vật xung đột
Unknown

Lead-free per 'N' suffix in MPN. RoHS compliance confirmed by DigiKey listing. REACH, halogen-free, and conflict-minerals status not stated by Altera on legacy APEX 20KE family documentation.

Dữ liệu được xác minh vào: 2026-09-07 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Tìm kiếm liên quan

EP20K200EBC652-3N datasheet EP20K200EBC652-3N price Altera APEX 20KE 200K FPGA EP20K200EBC652-3N 652-BGA EP20K200EBC652-3N drop-in replacement EP20K200EBC652-3N vs EP20K200EBC652-1X EP20K200EBC652-3N obsolete stock Altera FPGA 8,320 logic elements 1.8V APEX 20KE telecom line card FPGA what is the maximum frequency of EP20K200EBC652-3N where to buy EP20K200EBC652-3N EP20K200EBC652-3N pinout BGA

Các bộ phận và thuật ngữ liên quan

Altera Intel EP20K200EBC652-3N EP20K200EBC652-1X EP20K200EBC652-2X EP20K200EBC652-3 EP20K1500EBC652-1X FPGA Field Programmable Gate Array APEX 20KE MultiCore architecture 652-BGA BGA package LVDS JTAG IEEE 1149.1 Quartus logic array block logic element embedded RAM system gates macrocell product-term logic look-up table telecom line card
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