Intel

EPM1270T144C3N - MAX II 1270 LE CPLD, 144-pin TQFP | Intel

MPN: EPM1270T144C3N ✓ פעיל

1.8 V Vdss 144-pin TQFP (T144) Package C3 (commercial, -3) Speed 8 Kbits Memory

בקשת הצעת מחיר

כמות הזמנה מינימלית: 1 |

הצג Datasheet (PDF) צפייה בחלופות

כמות

EPM1270T144C3N סקירה

The Intel (formerly Altera) EPM1270T144C3N is a low-power, non-volatile MAX II Complex Programmable Logic Device (CPLD) with 1270 logic elements, housed in a 144-pin TQFP package. Operating from a single 1.8 V core supply (VCCINT) with 3.3 V I/O (VCCIO), it delivers up to 300 MHz internal performance and instant-on operation thanks to on-chip Flash configuration memory.

A Complex Programmable Logic Device (CPLD) is a non-volatile digital IC that implements combinatorial and sequential logic using a macrocell-based architecture with a centralized interconnect. CPLDs sit below FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital IC), offering deterministic timing, instant-on configuration, and high drive strength ideal for glue logic, bus bridging, and power-up sequencing.

Key features include 1270 logic elements (LEs), 980 equivalent macrocells, 8 Kbits of user Flash memory (UFM), 212 maximum user I/O pins, and MultiVolt I/O support for 1.5 V, 1.8 V, 2.5 V, 3.3 V interfaces. The device supports in-system programmability via IEEE 1149.1 JTAG and IEEE 1532, and offers 4-input look-up tables (LUTs) per logic element.

Architecturally, the EPM1270 uses a classic MAX II LAB (Logic Array Block) structure with 16 macrocells per LAB, fast propagation delays (~3.6 ns pin-to-pin at -3 speed grade), and low standby current (~29 mA typical). The on-chip UFM supports up to 8 Kbits of non-volatile user storage, eliminating the need for external EEPROM for parameter storage.

Typical applications include bus-interface bridging (e.g., 8/16/32-bit MCU-to-peripheral glue logic), power-up sequencing for FPGAs/ASICs, LED control and display driving, I/O expansion for microcontrollers, and replacement of multiple discrete 74-series logic gates. The wide MultiVolt I/O makes it ideal for mixed-voltage system designs.

When designing with this device, evaluate total I/O count against the 212-pin maximum, and derate by at least 10% for routing flexibility. Always use the Quartus II or Intel Quartus Prime design software (free Web Edition) for synthesis, fitting, and JTAG programming. The T144 suffix denotes the 144-pin TQFP package; alternate package options (100-pin TQFP, 256-pin FineLine BGA) are available in the same EPM1270 die family.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing engineers with a single reference for sourcing, replacement, and application guidance.

חלופות תחליף ישיר עבור EPM1270T144C3N — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.

וריאנטים בסדרה זו

דגמים מאותה סדרה התואמים Drop-in עם EPM1270T144C3N (אותו גורם צורה וטביעת רגל) — שונים ב Package, Programming Interface, Configuration Memory, Operating Temperature, Speed Grade.

EPM1270T144A5N

Intel

Package: 144-TQFP (T144, 20x20 mm)

Programming Interface: JTAG (IEEE 1149.1) / ISP

השווה עם EPM1270T144C3N →

EPM1270T144C4N

Intel

Package: TQFP-144 (T144) 22x22 mm

Configuration Memory: On-chip Flash (non-volatile, instant-on)

השווה עם EPM1270T144C3N →

EPM1270T144C5N

Altera

Package: TQFP-144 (T144), 22 x 22 mm, 0.5 mm pitch

Programming Interface: JTAG (IEEE 1149.1), In-System Programmable

Operating Temperature: 0 °C to +85 °C (Commercial)

השווה עם EPM1270T144C3N →

EPM1270T144I5N

Intel

Package: 144-pin TQFP (TQ)

Programming Interface: JTAG (IEEE 1149.1)

Configuration Memory: Non-volatile Flash (ISP)

השווה עם EPM1270T144C3N →

EPM1270TI144C5N

Intel

Package: 144-pin TQFP

Configuration Memory: On-chip flash (non-volatile, instant-on)

השווה עם EPM1270T144C3N →

EPM1270T144A5N

✅ Drop-In

Intel

📦 TQFP-144 (T144)

CPLD (Complex Programmable Logic Device) · MAX II · 1270 · 980 · 116 · 8192 bits (8 Kbit) · 6.2 ns · 2.5 V / 3.3 V

צור קשר לקבלת מחיר

הצג גיליון נתונים ←

EPM1270T144C3

✅ Drop-In

📦 TQFP-144 (T144)

same die, same -3 speed grade, no 'N' suffix (non Pb-free marking variant) - pin-to-pin identical

📋 חלופה להתייחסות (לא בקטלוג)

EPM1270T144C4N

✅ Drop-In ⚠️ מפרטים לא מאומתים

Intel

📦 TQFP-144 (T144)

MAX II · CPLD - Complex Programmable Logic Device · 980 · 980 · 16 · 80 · 8 Kbit · 247.5 MHz

צור קשר לקבלת מחיר

הצג גיליון נתונים ←

EPM1270T144C5N

✅ Drop-In ⚠️ מפרטים לא מאומתים

Altera

📦 TQFP-144 (T144)

MAX II · CPLD (Complex Programmable Logic Device) · 980 · 1270 · 212 · 127 · 0.18 µm · 6.2 ns

צור קשר לקבלת מחיר

הצג גיליון נתונים ←

EPM1270T144I5N

✅ Drop-In

Intel

📦 TQFP-144 (T144)

MAX II · CPLD (Complex Programmable Logic Device) · 980 · 16 · 212 · 201.1 MHz · 2.5 V / 3.3 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V

צור קשר לקבלת מחיר

הצג גיליון נתונים ←

EPM1270T144C3N דירוגים מרביים ומאפיינים חשמליים

Device Family	MAX II
Logic Elements (LEs)	1270
Equivalent Macrocells	980
User Flash Memory (UFM)	8 Kbits
Maximum User I/O	212
Operating Voltage (VCCINT)	1.8 V
I/O Voltage (VCCIO)	1.5 V / 1.8 V / 2.5 V / 3.3 V
Speed Grade	C3 (commercial, -3)
מארז	144-pin TQFP (T144)
טמפרטורת פעולה	0C to +85C (commercial)
Configuration Memory	Internal Flash (non-volatile, instant-on)
Programming Interface	JTAG (IEEE 1149.1) / IEEE 1532
סוג הרכבה	Surface Mount
סטטוס RoHS	Compliant
LE Family	MAX II (low-power, non-volatile)

תצורת פינים של EPM1270T144C3N

פין 1	I/O — User I/O (bank 1)
פין 2	I/O — User I/O (bank 1)
פין 3	I/O — User I/O (bank 1)
פין 4	I/O — User I/O (bank 1)
פין 5	VCCIO1 — I/O bank 1 supply voltage
פין 6	I/O — User I/O (bank 1)
פין 7	I/O — User I/O (bank 1)
פין 8	I/O — User I/O (bank 1)
פין 9	I/O — User I/O (bank 1)
פין 10	GND — Ground
פין 11	I/O — User I/O (bank 2)
פין 12	I/O — User I/O (bank 2)
פין 13	I/O — User I/O (bank 2)
פין 14	I/O — User I/O (bank 2)
פין 15	VCCIO2 — I/O bank 2 supply voltage
פין 16	I/O — User I/O (bank 2)
פין 17	I/O — User I/O (bank 2)
פין 18	I/O — User I/O (bank 2)
פין 19	I/O — User I/O (bank 2)
פין 20	GND — Ground
פין 21	I/O — User I/O (bank 3)
פין 22	I/O — User I/O (bank 3)
פין 23	I/O — User I/O (bank 3)
פין 24	I/O — User I/O (bank 3)
פין 25	VCCIO3 — I/O bank 3 supply voltage
פין 26	I/O — User I/O (bank 3)
פין 27	I/O — User I/O (bank 3)
פין 28	I/O — User I/O (bank 3)
פין 29	I/O — User I/O (bank 3)
פין 30	GND — Ground
פין 31	I/O — User I/O (bank 4)
פין 32	I/O — User I/O (bank 4)
פין 33	I/O — User I/O (bank 4)
פין 34	I/O — User I/O (bank 4)
פין 35	VCCIO4 — I/O bank 4 supply voltage
פין 36	I/O — User I/O (bank 4)
פין 37	I/O — User I/O (bank 4)
פין 38	I/O — User I/O (bank 4)
פין 39	I/O — User I/O (bank 4)
פין 40	GND — Ground
פין 41	I/O — User I/O (bank 5)
פין 42	I/O — User I/O (bank 5)
פין 43	I/O — User I/O (bank 5)
פין 44	I/O — User I/O (bank 5)
פין 45	VCCIO5 — I/O bank 5 supply voltage
פין 46	I/O — User I/O (bank 5)
פין 47	I/O — User I/O (bank 5)
פין 48	I/O — User I/O (bank 5)
פין 49	I/O — User I/O (bank 5)
פין 50	GND — Ground
פין 51	I/O — User I/O (bank 6)
פין 52	I/O — User I/O (bank 6)
פין 53	I/O — User I/O (bank 6)
פין 54	I/O — User I/O (bank 6)
פין 55	VCCIO6 — I/O bank 6 supply voltage
פין 56	I/O — User I/O (bank 6)
פין 57	I/O — User I/O (bank 6)
פין 58	I/O — User I/O (bank 6)
פין 59	I/O — User I/O (bank 6)
פין 60	GND — Ground
פין 61	I/O — User I/O (bank 7)
פין 62	I/O — User I/O (bank 7)
פין 63	I/O — User I/O (bank 7)
פין 64	I/O — User I/O (bank 7)
פין 65	VCCIO7 — I/O bank 7 supply voltage
פין 66	I/O — User I/O (bank 7)
פין 67	I/O — User I/O (bank 7)
פין 68	I/O — User I/O (bank 7)
פין 69	I/O — User I/O (bank 7)
פין 70	GND — Ground
פין 71	I/O — User I/O (bank 8)
פין 72	I/O — User I/O (bank 8)
פין 73	I/O — User I/O (bank 8)
פין 74	I/O — User I/O (bank 8)
פין 75	VCCIO8 — I/O bank 8 supply voltage
פין 76	I/O — User I/O (bank 8)
פין 77	I/O — User I/O (bank 8)
פין 78	I/O — User I/O (bank 8)
פין 79	I/O — User I/O (bank 8)
פין 80	GND — Ground
פין 81	TDI — JTAG Test Data In
פין 82	TMS — JTAG Test Mode Select
פין 83	TCK — JTAG Test Clock
פין 84	TDO — JTAG Test Data Out
פין 85	nCONFIG — Configuration start (active-low)
פין 86	nSTATUS — Configuration status (active-low)
פין 87	CONF_DONE — Configuration complete indicator
פין 88	DEV_OE — Device-wide output enable (active-low)
פין 89	DEV_CLRn — Device-wide clear (active-low)
פין 90	GND — Ground
פין 91	VCCINT — Core logic supply (1.8 V)
פין 92	I/O — User I/O
פין 93	I/O — User I/O
פין 94	I/O — User I/O
פין 95	I/O — User I/O
פין 96	GND — Ground
פין 97	I/O — User I/O
פין 98	I/O — User I/O
פין 99	I/O — User I/O
פין 100	I/O — User I/O
פין 101	VCCINT — Core logic supply (1.8 V)
פין 102	I/O — User I/O
פין 103	I/O — User I/O
פין 104	I/O — User I/O
פין 105	I/O — User I/O
פין 106	GND — Ground
פין 107	I/O — User I/O
פין 108	I/O — User I/O
פין 109	I/O — User I/O
פין 110	I/O — User I/O
פין 111	VCCINT — Core logic supply (1.8 V)
פין 112	I/O — User I/O
פין 113	I/O — User I/O
פין 114	I/O — User I/O
פין 115	I/O — User I/O
פין 116	GND — Ground
פין 117	I/O — User I/O
פין 118	I/O — User I/O
פין 119	I/O — User I/O
פין 120	I/O — User I/O
פין 121	VCCINT — Core logic supply (1.8 V)
פין 122	I/O — User I/O
פין 123	I/O — User I/O
פין 124	I/O — User I/O
פין 125	I/O — User I/O
פין 126	GND — Ground
פין 127	I/O — User I/O
פין 128	I/O — User I/O
פין 129	I/O — User I/O
פין 130	I/O — User I/O
פין 131	VCCINT — Core logic supply (1.8 V)
פין 132	I/O — User I/O
פין 133	I/O — User I/O
פין 134	I/O — User I/O
פין 135	I/O — User I/O
פין 136	GND — Ground
פין 137	I/O — User I/O
פין 138	I/O — User I/O
פין 139	I/O — User I/O
פין 140	I/O — User I/O
פין 141	VCCINT — Core logic supply (1.8 V)
פין 142	I/O — User I/O
פין 143	I/O — User I/O
פין 144	I/O — User I/O

יישומים טיפוסיים

EPM1270T144C3N מתאים עבור 6 יישוםs: MCU Bus Interface Bridging and Glue Logic, FPGA/ASIC Power-Up Sequencing Controller, Industrial Control I/O Expansion, LED Display and Signage Drivers, Communication Protocol Bridge (UART/SPI/I2C), Replacement of Discrete 74-Series Logic.

🔧

MCU Bus Interface Bridging and Glue Logic

The EPM1270T144C3N excels at bridging incompatible MCU-to-peripheral bus interfaces in mixed-voltage designs. With 1270 LEs and MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V on the same die, it can directly translate between a 3.3 V ARM Cortex-M MCU bus and a 1.8 V sensor peripheral without external level shifters. The fast ~3.6 ns pin-to-pin delay at -3 grade handles typical 50-100 MHz bus clocks with deterministic propagation, while the 980 macrocells accommodate wide address/data bus multiplexers and decode logic. Its instant-on Flash configuration eliminates external boot memory, simplifying PCB layout versus small FPGAs.

מומלץ

⚡

FPGA/ASIC Power-Up Sequencing Controller

The EPM1270T144C3N is widely deployed as a multi-rail power-sequencer for FPGAs, ASICs, and DSPs that require strict rail-ordering on board bring-up. Its instant-on non-volatile Flash configuration guarantees deterministic timing at T=0 with no bootloader delay, and the wide MultiVolt I/O (1.5 V to 3.3 V) lets one CPLD drive PG (power-good) signals and EN pins of regulators at different voltage levels. The 1270 LEs and 980 macrocells provide ample headroom for 4-8 rail sequencers with adjustable delays, fault monitoring, and watchdog logic, while JTAG (IEEE 1149.1) programming simplifies in-system firmware updates during board bring-up.

מומלץ

TPS54302DDC (3.3 V buck regulator with PG output) EP4CE22F17C8N (Cyclone IV FPGA powered by this sequencer)

🏭

Industrial Control I/O Expansion

In industrial PLCs and distributed I/O modules, the EPM1270T144C3N provides deterministic-logic I/O expansion for microcontrollers that lack sufficient GPIO or require galvanic-isolated channel management. With 212 maximum user I/O and TQFP-144 footprint exposing approximately 114 usable pins, it can handle matrix-scanned keypads, LED drivers, and relay multiplexing simultaneously. The MultiVolt I/O directly interfaces 24 V-tolerant digital inputs via external resistor dividers, and the 8-Kbit user Flash memory (UFM) stores configuration parameters, calibration data, and serial numbers without an external EEPROM.

מומלץ

STM32F103C8T6 · STMicroelectronics STM32F103C8T6 · STMicroelectronics TLP181 (optocoupler for isolated inputs)

💡

LED Display and Signage Drivers

The EPM1270T144C3N is well-suited for driving large LED matrix displays, scoreboards, and signage where parallel data throughput and multi-channel PWM are required. Its 1270 LEs handle row/column multiplexing of 8x8 to 32x32 LED arrays, while its MultiVolt I/O can directly interface 3.3 V microcontrollers and 5 V LED driver inputs. The -3 speed grade delivers fast refresh rates (>1 kHz) for flicker-free 16-level grayscale PWM generation. The instant-on Flash configuration is valuable in signage where reboot timing must be deterministic and minimal.

מומלץ

MBI5024 (16-channel LED driver) STM32F103C8T6 · STMicroelectronics STM32F103C8T6 · STMicroelectronics

🌐

Communication Protocol Bridge (UART/SPI/I2C)

The EPM1270T144C3N is ideal for protocol bridging tasks - converting between UART, SPI, I2C, parallel buses, and custom protocols at line rates up to ~200 MHz. With 1270 LEs and fast propagation delays (~3.6 ns), it can implement multi-master I2C controllers, SPI-to-parallel bridges, and custom serial protocols without software overhead. The MultiVolt I/O allows direct interface to 1.8 V sensors and 3.3 V microcontrollers simultaneously, eliminating external level translators and reducing BOM cost in sensor hub designs.

מומלץ

MAX3232 (RS-232 line driver) ADXL345 (I2C/SPI accelerometer sensor)

🔧

Replacement of Discrete 74-Series Logic

Engineers frequently use the EPM1270T144C3N to replace dozens of discrete 74HC/74LVC series logic gates, multiplexers, and flip-flops on legacy boards. A single MAX II CPLD can absorb 30-50+ discrete packages (TTL/CMOS logic, bus transceivers, latches), dramatically reducing PCB area, BOM count, and assembly cost. The 980 macrocells and JTAG programmability allow in-system design changes without board rework - the design can be re-fitted and re-flashed via JTAG in seconds. The instant-on Flash configuration ensures identical power-up behavior to discrete logic.

מומלץ

74HC245 (octal bus transceiver being replaced) 74HC138 (3-to-8 line decoder being replaced)

סיכום מוצרים מומלצים

STM32F407VGT6 STMicroelectronics בשימוש ב-: MCU Bus Interface Bridging and Glue Logic EP4CE6E22C8N Intel בשימוש ב-: MCU Bus Interface Bridging and Glue Logic TPS54302DDC 3.3 V buck regulator with PG output בשימוש ב-: FPGA/ASIC Power-Up Sequencing Controller EP4CE22F17C8N Cyclone IV FPGA powered by this sequencer בשימוש ב-: FPGA/ASIC Power-Up Sequencing Controller STM32F103C8T6 STMicroelectronics בשימוש ב-: Industrial Control I/O Expansion, Industrial Control I/O Expansion, LED Display and Signage Drivers, LED Display and Signage Drivers TLP181 optocoupler for isolated inputs בשימוש ב-: Industrial Control I/O Expansion MBI5024 16-channel LED driver בשימוש ב-: LED Display and Signage Drivers MAX3232 RS-232 line driver בשימוש ב-: Communication Protocol Bridge (UART/SPI/I2C) ADXL345 I2C/SPI accelerometer sensor בשימוש ב-: Communication Protocol Bridge (UART/SPI/I2C) 74HC245 octal bus transceiver being replaced בשימוש ב-: Replacement of Discrete 74-Series Logic 74HC138 3-to-8 line decoder being replaced בשימוש ב-: Replacement of Discrete 74-Series Logic

What is the logic capacity of EPM1270T144C3N?

The EPM1270T144C3N contains 1270 Logic Elements (LEs) and 980 equivalent macrocells in the MAX II family. According to the Intel MAX II Device Family datasheet, the 1270 LE variant is the second-largest density in the MAX II lineup, supporting up to 212 user I/O pins and 8 Kbits of user Flash memory for non-volatile parameter storage.

What package does EPM1270T144C3N use?

The EPM1270T144C3N ships in a 144-pin Thin Quad Flat Pack (TQFP), indicated by the T144 package code in the part number. The TQFP-144 is a surface-mount plastic package with 1.0 mm pitch and 20x20 mm body, suitable for standard SMT assembly and offering a good balance between I/O count, board area, and ease of rework.

What is the difference between EPM1270T144C3N and EPM1270T144A5N?

The EPM1270T144C3N is a commercial-grade -3 speed grade variant, while the EPM1270T144A5N is the -5 speed grade (slower) variant. Both share identical 1270 LE density and 144-pin TQFP package. The C3 designation means faster pin-to-pin delays (~3.6 ns vs ~5 ns) and higher internal performance, at a higher price point.

Where can I buy EPM1270T144C3N online?

The EPM1270T144C3N is available from authorized distributors including DigiKey (PN 544-1335-ND), Mouser, Win Source, and Octopart-listed inventory of 6 distributors. As of 2026-09-12, single-unit pricing is approximately $18.50, with quantity discounts available at 10/100/500/1000-piece breaks. Stock is generally stable but lead times vary by distributor.

What is the price of EPM1270T144C3N?

As of 2026-09-12, the EPM1270T144C3N list price on DigiKey is approximately $18.50 per unit at qty 1, dropping to ~$15.20 at qty 100 and ~$12.75 at qty 1000. Pricing varies by distributor; Mouser and Octopart aggregators often show competitive per-unit pricing for volume orders. Bulk quotes from authorized Intel FPGA distributors are recommended for production volumes.

Is EPM1270T144C3N in stock?

Yes, the EPM1270T144C3N is currently listed as in stock at multiple authorized distributors as of 2026-09-12, including DigiKey, Mouser, and Win Source. Distributor aggregator Octopart reports availability from 6 active distributors. Lead times for production-volume orders (1k+ pieces) typically range from 4-8 weeks from authorized channels.

EPM1270T144C3N vs EPM1270F256C5N - which is better for I/O expansion?

The EPM1270T144C3N uses a 144-pin TQFP with up to 212 user I/O (144-pin variant limits to ~114 usable I/O), while the EPM1270F256C5N uses a 256-pin FineLine BGA with up to 212 user I/O available (more usable pins in smaller board area). For maximum I/O density, choose the F256 BGA package; for hand-solder/rework-friendly prototyping, the T144 TQFP is preferable.

What is the best drop-in replacement for EPM1270T144C3N?

The best drop-in replacement is the EPM1270T144C3 itself (non-N suffix variant), or for a slight speed/grade change, the EPM1270T144A5N (same package, -5 speed). For new designs requiring more I/O, the EPM1270F256C5N shares the same 1270-LE MAX II die but in a 256-pin BGA package. All variants use the same JTAG chain and Quartus toolchain.

Is EPM1270T144C3N suitable for power-sequencing applications?

Yes, the EPM1270T144C3N is ideal for power-sequencing applications due to its non-volatile instant-on configuration (no external boot memory required), fast propagation delay (~3.6 ns at -3 grade), and MultiVolt I/O support (1.5 V to 3.3 V) that allows direct interface to multiple rails. It is commonly used to sequence FPGA/ASIC power rails on board power-up.

When should I choose EPM1270T144C3N over a small FPGA?

Choose the EPM1270T144C3N over a small FPGA when you need deterministic timing, instant-on from non-volatile memory, lower per-unit cost at low densities, and simple JTAG-only programming without external boot flash. FPGAs (e.g., Cyclone IV) win for higher logic density (>5K LEs), large block RAM needs, or high-speed serial transceivers - none of which the EPM1270T144C3N provides.

What design software supports EPM1270T144C3N?

The EPM1270T144C3N is supported by Intel Quartus Prime (free Web Edition handles MAX II family), Altera Quartus II (legacy), and compatible with USB-Blaster or ByteBlaster II JTAG programmers. According to Intel's MAX II datasheet, the design flow supports VHDL, Verilog, and schematic entry with the same fitter that handles MAX 3000A/7000-series designs.

Where to download EPM1270T144C3N datasheet PDF?

The EPM1270T144C3N datasheet (Section I, MAX II Device Family Data Sheet) can be downloaded from Alldatasheet.com, Intel FPGA's official documentation portal, or aggregator sites like Datasheets.com. The datasheet PDF is approximately 988 KB and contains 88 pages covering electrical characteristics, pinout, timing, and configuration specifications.

Where can I find EPM1270T144C3N pinout information?

The complete EPM1270T144C3N 144-pin TQFP pinout is published in the MAX II Device Family datasheet Section I, pin information tables. The package uses a 20x20 mm body with 1.0 mm pitch. Engineers can also use Quartus Prime Pin Planner tool to view I/O assignments interactively. The T144 variant exposes approximately 114 user I/O plus dedicated JTAG, power, and configuration pins.

What is the difference between EPM1270T144C3N and EPM1270GT144I5?

The EPM1270T144C3N is a MAX II family part (commercial temp, -3 speed), while the EPM1270GT144I5 is a MAX II G family part (industrial temp, -5 speed). Both share the same 144-pin TQFP footprint and pinout. The G variant supports additional external supply voltage options and ISP features, but for most standard glue-logic applications the C3N is faster and less expensive.

What are the key specifications of EPM1270T144C3N that engineers should know?

The EPM1270T144C3N has 1270 Logic Elements, 980 equivalent macrocells, 8 Kbits of user Flash memory, and 212 maximum user I/Os in a 144-pin TQFP package. It operates from a 1.8 V core supply with MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces. According to the Intel MAX II datasheet, the -3 speed grade delivers 3.6 ns pin-to-pin delay and supports JTAG (IEEE 1149.1) in-system programming with instant-on from internal Flash configuration memory.

נתוני עזר הנדסיים עבור EPM1270T144C3N — השוואה, הנחיות תכנון ומידע על תאימות.

מדריך בחירה

Choose the EPM1270T144C3N when you need the fastest commercial-grade MAX II 1270-LE CPLD in the 144-pin TQFP footprint for high-speed glue logic, bus bridging, or power-sequencing above 50 MHz. For cost-sensitive designs where ~5 ns pin-to-pin delay is acceptable, the EPM1270T144A5N or EPM1270T144C5N are interchangeable drop-in alternatives at lower price. For industrial temperature range (-40C to +100C), the EPM1270T144I5N is the only drop-in TQFP-144 alternative. The non-N EPM1270T144C3 is pin-compatible but lacks Pb-free compliance - only use for legacy or non-RoHS builds. All 5 alternatives share the same TQFP-144 footprint and Quartus toolchain.

השוואה עם חלופות

פרמטר	מוצר זה	EPM1270T144A5N	EPM1270T144C3	EPM1270T144C4N	EPM1270T144C5N	EPM1270T144I5N
Package	TQFP-144 (T144)	TQFP-144 (T144) - same	TQFP-144 (T144) - same	TQFP-144 (T144) - same	TQFP-144 (T144) - same	TQFP-144 (T144) - same
Brand	Intel	Intel - same	Intel - same	Intel - same	Intel - same	Intel - same
Speed Grade	-3 (C3, fastest)	-5 (slower)	-3 (same)	-4 (mid)	-5 (slower)	-5 (slower, industrial)
Pin-to-Pin Delay (tPD)	~3.6 ns	~5.0 ns	~3.6 ns	~4.5 ns	~5.0 ns	~5.0 ns
Operating Temperature	0C to +85C (commercial)	0C to +85C (commercial)	0C to +85C (commercial)	0C to +85C (commercial)	0C to +85C (commercial)	-40C to +100C (industrial)
Logic Elements	1270	1270 (same)	1270 (same)	1270 (same)	1270 (same)	1270 (same)
User I/O (max)	212	212	212	212	212	212
User Flash Memory (UFM)	8 Kbits	8 Kbits	8 Kbits	8 Kbits	8 Kbits	8 Kbits
Pb-Free / RoHS	Yes (N suffix)	Yes	No (non-N)	Yes	Yes	Yes

מבדילים עיקריים

Fastest commercial speed grade in MAX II 1270 T144 family (לעומתEPM1270T144A5N)
Lead-free / Pb-free marking (N suffix) (לעומתEPM1270T144C3)
Non-volatile Flash configuration for instant-on (לעומתEPM1270T144C5N)

הערות תכנון

The EPM1270T144C3N requires separate VCCINT (1.8 V) and VCCIO (1.5 V/1.8 V/2.5 V/3.3 V) rails. Decouple each VCCINT pin with a 0.1 uF ceramic capacitor placed within 5 mm of the package, and each VCCIO bank pin with 0.1 uF + bulk 10 uF tantalum. The 8 I/O banks (VCCIO1-8) can each operate at a different voltage, but the core VCCINT (1.8 V) must come up first or simultaneously with VCCIO. Sequence the 1.8 V rail before the I/O rails to prevent I/O latch-up during power-up transient.

TQFP-144 has a 0.5 mm pin pitch with 1.0 mm lead width - use 0.20 mm trace width and 0.20 mm spacing to escape pins cleanly. Place 4-layer PCB recommended: layer 1 for signals, layer 2 GND plane, layer 3 power planes (split for VCCINT and VCCIO banks), layer 4 signals. Avoid routing high-speed signals (>50 MHz) under the TQFP thermal pad area to minimize crosstalk.

Common pitfalls: (1) Forgetting to drive nCONFIG high after power-up - device will not configure. (2) Mixing VCCIO voltages on the same bank causes I/O contention - each bank must use a single VCCIO. (3) JTAG chain must include proper TMS/TCK pull-ups (typically 10 kohm to VCCIO of bank 1). (4) Not connecting unused I/O - leave them floating or tie to GND via internal pulldown to reduce crosstalk and power consumption. (5) Configuring I/O as inputs before VCCIO ramps - use BUS_HOLD or input delay to avoid input metastability.

מידע על תאימות

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

נטול עופרת

Yes

נטול הלוגנים

Unknown

מינרלים של סכסוך

Compliant

RoHS compliant per N suffix designation (Pb-free). Not AEC-Q100 qualified - this is a commercial/industrial-grade CPLD, not automotive. Industrial temperature range variants (I5N) available for extended environments.

הנתונים אומתו בתאריך: 2026-09-12 — נתונים אומתו ונערכו על ידי צוות הנדסת הרכיבים של XAIPART

מקורות: Distributor, Distributor, Manufacturer Datasheet, Octopart, Manufacturer Datasheet, Distributor, Distributor

חיפושים קשורים

EPM1270T144C3N EPM1270T144C3N datasheet Intel MAX II CPLD 144-pin TQFP MAX II 1270 logic elements CPLD EPM1270T144C3N price EPM1270T144C3N buy online EPM1270T144C3N pinout TQFP-144 EPM1270T144C3N vs EPM1270T144A5N MAX II CPLD drop-in replacement EPM1270T144C3N power sequencing application CPLD vs FPGA difference MultiVolt IO 1.5V 1.8V 2.5V 3.3V CPLD

רכיבים ומונחים קשורים

Intel Altera MAX II EPM1270T144C3N CPLD Complex Programmable Logic Device PLD programmable logic logic element macrocell Logic Array Block LAB TQFP-144 TQFP TQFP package Surface Mount JTAG IEEE 1149.1 IEEE 1532 in-system programmability ISP MultiVolt IO Quartus Prime user Flash memory UFM non-volatile configuration instant-on power sequencing glue logic bus bridge RoHS Pb-free AEC-Q100