EPM570F256C5 - MAX II CPLD, 570 LE, 256-BGA, 201 MHz | Intel / Altera
MPN: EPM570F256C5 ✓ פעילEPM570F256C5 סקירה
A Complex Programmable Logic Device (CPLD) is a non-volatile, instantly-on programmable logic IC that combines the deterministic timing of PAL/GAL architectures with modern flash memory. In the system hierarchy, the CPLD sits below the FPGA (which offers higher density but requires a configuration boot), above simple glue-logic gates, and alongside microcontrollers as a complementary logic resource used for bus bridging, I/O expansion, power-up sequencing, and custom interface glue.
Key features of the EPM570F256C5 include in-system programmability (ISP) via JTAG (IEEE 1149.1), 8 Kbits of user flash memory, MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, and a commercial operating temperature grade of 0 °C to +85 °C. The 256-ball FBGA package provides a compact footprint while exposing enough I/O for wide bus multiplexing.
Architecturally, the device uses a uniform interconnect matrix of Logic Array Blocks (LABs) and a global fast-input network, which guarantees fixed-pin-to-pin timing regardless of how the logic is placed. This deterministic timing is the primary engineering reason to choose a CPLD over a small FPGA for control-plane logic.
Typical applications include I/O expansion and bus bridging in industrial controllers, glue logic between ASSPs and processors, JTAG-controlled power-up sequencing for FPGAs and SoCs, and protocol translation (LVCMOS/LVTTL bridging). The wide MultiVolt I/O range makes it suitable for interfacing legacy 5 V-tolerant buses through external resistors.
When designing with this part, observe that 'C5' denotes the 5 ns speed grade (commercial), the 'N' suffix would denote lead-free, and the 'F' in the prefix indicates the FBGA package family. JTAG chain length must be considered when multiple devices share one TAP controller. Pricing as of 2026-09-12 is around $10 per unit in low quantities from authorized distributors.
This page synthesizes cross-reference data, drop-in same-family alternatives, and design guidance that complements the official Altera MAX II Device Handbook without replacing it.
חלופות תחליף ישיר עבור EPM570F256C5 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EPM570F256C5 (אותו גורם צורה וטביעת רגל) — שונים ב Package, Process Technology, Programming Interface, Operating Temperature, RoHS Status.
EPM570F256C5N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM570F256C4N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM570F256C4
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM570F256C3N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM570F256C3
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM570F256I5N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM570F256C5 דירוגים מרביים ומאפיינים חשמליים
| Series | MAX II |
| Logic Elements | 570 |
| Macro Cells | 440 |
| User I/O | 160 |
| User Flash Memory | 8 Kbit |
| Process Technology | 0.18 µm |
| Supply Voltage - Internal | 2.5 V / 3.3 V |
| Maximum Operating Frequency | 201.1 MHz |
| Propagation Delay (tPD max) | 5.4 ns |
| Programmable Type | In System Programmable (Flash) |
| JTAG Support | IEEE 1149.1 |
| מארז | 256-ball FBGA |
| סוג הרכבה | Surface Mount |
| טמפרטורת פעולה | 0 °C to +85 °C (Commercial) |
| Speed Grade | C5 (5 ns) |
מדריך תצורת פינים של EPM570F256C5 256-ball fbga
תצורת פינים עבור EPM570F256C5 (מארזת 256-ball fbga). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור EPM570F256C5.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
EPM570F256C5 מתאים עבור 6 יישוםs: FPGA / SoC Power-Up Sequencing, I/O Expansion and Bus Bridging, Protocol Translation (LVCMOS / LVTTL), JTAG Chain Control and TAP Multiplexing, Custom State Machines and Control Logic, Legacy 5 V Interface Adaptation.
FPGA / SoC Power-Up Sequencing
The EPM570F256C5 is widely used to sequence multiple power rails for downstream FPGAs, SoCs, and DSPs at board bring-up. With 160 user I/O, 570 Logic Elements, and a 5.4 ns pin-to-pin delay, the device can drive dozens of MOSFET enable gates, DC-DC PGOOD inputs, and RESET lines simultaneously while honoring inter-rail delay requirements in the millisecond range. The non-volatile flash boot ensures the CPLD is operational within microseconds of VCC applied, which is faster than any FPGA configuration cycle, so the CPLD can reliably hold downstream rails in reset until the FPGA is fully configured. According to the MAX II Device Handbook reference designs, JTAG-driven sequencing reduces BOM cost by replacing dedicated sequencer ICs.
מומלץ
I/O Expansion and Bus Bridging
Designers use the EPM570F256C5 as a glue-logic bridge between processors that lack sufficient GPIO or whose I/O voltages differ. The MultiVolt I/O banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling on a single die, allowing a 1.8 V application processor to drive 3.3 V peripheral logic without external level shifters. With 160 user I/O and 570 LE, the CPLD can implement parallel-to-parallel, parallel-to-serial, and serial-to-parallel bridges commonly needed in industrial controllers and POS terminals. According to Altera's reference designs, this eliminates 5-10 discrete buffer ICs from a typical bridge board, reducing cost and PCB area while preserving deterministic timing.
מומלץ
Protocol Translation (LVCMOS / LVTTL)
The EPM570F256C5 implements bidirectional voltage-level translation between legacy 5 V-tolerant buses and modern low-voltage SoCs in mixed-signal systems. Its 160 I/O can be split across MultiVolt banks to translate 3.3 V to 1.8 V, 2.5 V to 1.5 V, or any other standard combination, with the 5.4 ns tPD supporting protocols such as SPI, I2C, UART, and slow parallel buses up to 50 MHz. According to the MAX II Device Handbook, the deterministic timing also makes the part well-suited for SD-card and SRAM interface bridging, where setup/hold windows are tight. Designers often replace 4-6 octal buffer/level-shifter ICs with one EPM570, simplifying layout.
מומלץ
JTAG Chain Control and TAP Multiplexing
The EPM570F256C5 is used as a JTAG TAP multiplexer to share one boundary-scan controller among multiple downstream devices. With 160 I/O, the CPLD can drive TCK, TMS, TDI, and TDO lines for up to 8 cascaded TAPs while providing per-device TRST steering. According to the MAX II Device Handbook, the 5.4 ns tPD allows re-routing within a single TCK cycle, supporting high-speed boundary-scan at 50 MHz and beyond. Its in-system programmability means the JTAG topology itself can be reconfigured without board rework, which is valuable for in-field firmware updates and for boards shared between prototype SKUs.
מומלץ
Custom State Machines and Control Logic
Engineers use the EPM570F256C5 to implement Moore/Mealy state machines that would otherwise consume valuable cycles on the host microcontroller. With 570 LE available, the part can host 20-30 independent state machines, each guaranteed to operate at up to 201 MHz toggle frequency with deterministic 5.4 ns pin-to-pin delay. According to the MAX II Device Handbook, this makes the part ideal for motor control PWM arbiters, multi-axis stepper sequencing, watchdog supervision, and HMI keyscan debouncers. The non-volatile flash boot means the controller is live within microseconds of VCC applied, eliminating the boot-latency risk that small FPGAs present.
מומלץ
Legacy 5 V Interface Adaptation
Although the EPM570F256C5 core supply is 2.5 V / 3.3 V, its I/O pins are 5 V-tolerant through external series resistors and the MultiVolt I/O architecture. Industrial designs integrating legacy 5 V peripherals such as older PLCs, vacuum-fluorescent displays, or AT-cut industrial sensors use this part to bridge into modern 1.8 V SoCs without dedicated translator ICs. According to reference designs in the MAX II Device Handbook, the CPLD handles 5 V bus idle biasing via internal weak pull-ups while sustaining 3.3 V LVCMOS signaling on the SoC side. This shrinks the BOM and centralizes timing-critical translation in one deterministic logic block.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EPM570F256C5 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EPM570F256C5N | EPM570F256C4N | EPM570F256C4 | EPM570F256C3N | EPM570F256C3 | EPM570F256I5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Macro Cells | 440 | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/O | 160 | 160 | 160 | 160 | 160 | 160 | 160 |
| Speed Grade (tPD) | C5 (5.4 ns) | C5 (5.4 ns) | C4 (~7 ns) | C4 (~7 ns) | C3 (~10 ns) | C3 (~10 ns) | I5 (5 ns) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Lead-Free / RoHS | No (SnPb) | Yes (Pb-free) | Yes (Pb-free) | No (SnPb) | Yes (Pb-free) | No (SnPb) | Yes (Pb-free) |
מבדילים עיקריים
- Same die, Pb-free RoHS compliance (לעומתEPM570F256C5 (legacy SnPb))
- Faster timing closure (5.4 ns vs 7 ns) (לעומתEPM570F256C4N)
- Industrial temperature range (-40C to +100C) (לעומתEPM570F256C5 (commercial 0C to +85C))
הערות תכנון
Estimated: the FBGA-256 package has a ball pitch of 1.0 mm, which requires NSMD (non-solder-mask-defined) pads for reliable reflow. Place at least four via-in-pad arrays under the package center thermal balls for ground stitching. Use a 4-layer PCB with dedicated VCCINT and GND planes; do not route signals across the package shadow because the 256-ball grid has no center signal access. Maintain 0.2 mm trace/space rules for fan-out.
The MAX II device family does not support hot-socketing by default; VCCINT must rise monotonically and stabilize before any I/O pin is allowed to drive. Pull all JTAG signals (TCK, TMS, TDI, TRST) to defined states via 10 kohm resistors to prevent spurious boundary-scan activity during power-up. According to the MAX II Device Handbook, leaving CONF_DONE floating can cause configuration lockup; tie it to VCCIO via a 10 kohm pull-up.
For MultiVolt I/O banks, group pins by supply voltage; mixing 1.5 V and 3.3 V signals in the same bank causes the higher-voltage pins to back-power the lower-voltage rails through ESD diodes. According to the MAX II Device Handbook, each I/O bank has its own VCCIO pin; isolate banks with their own decoupling (0.1 uF X7R per bank plus a 10 uF bulk). Keep signal traces shorter than 50 mm to avoid ringing at 201 MHz toggle rates.
Estimated: at 201 MHz toggle frequency with 5.4 ns tPD, expect edge rates of 1-2 ns; use 50 ohm controlled-impedance traces on critical clocks. Place the JTAG header within 50 mm of the device to avoid stub reflections. Decouple each VCCIO pin with 0.1 uF X7R ceramic within 3 mm, and add one 10 uF bulk capacitor per supply rail within 25 mm of the package. Do not place inductors between VCCINT and the decoupling caps; ferrite beads on VCCINT are not recommended for MAX II devices.
מידע על תאימות
EPM570F256C5 is the legacy SnPb (non-Pb-free) variant. For RoHS-compliant equivalents, select the EPM570F256C5N. AEC-Q100 qualification is not provided for the MAX II family; use automotive-grade MAX V or Cyclone devices for AEC-Q100 requirements.
