LCMXO3D-9400HC-6BG484C - 9400 LUT FPGA, 484-BGA | Lattice
MPN: LCMXO3D-9400HC-6BG484C ✓ פעילLCMXO3D-9400HC-6BG484C סקירה
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can customize post-manufacturing. The MachXO3D belongs to Lattice's ultra-low-power control-FPGA hierarchy: control FPGA -> low-density FPGA -> programmable logic -> semiconductor. It augments conventional glue-logic CPLDs with deterministic fabric and parallel processing for bridging, control, and secure-boot tasks.
Key features include up to 9400 LUTs, 73 Kbits of distributed RAM, 96 Kbits of embedded block RAM (EBR), up to 383 user I/Os supporting LVCMOS 1.2/1.5/1.8/2.5/3.3 V, dual-configuration images via on-chip flash, and integrated security engines including AES-256, HMAC-SHA-256, ECDSA-256, and a unique device identifier. The -6 speed grade targets higher system-clock Fmax while retaining the ultra-low-power characteristics of the family.
The architecture combines a non-volatile configuration memory cell on a 40 nm CMOS process, embedded PLLs, hard I2C/SPI/UART controllers, and on-chip flash configuration storage, eliminating the external boot flash required by SRAM-based FPGAs. Hardened security blocks accelerate cryptographic operations and reduce fabric utilization for crypto functions.
Typical applications include secure platform boot and Root-of-Trust, industrial control bridging (I2C/SPI to RGMII), motor control and human-machine interface (HMI) glue logic, IoT edge-device secure attach, and automotive functional-safety co-processor functions in conjunction with a host MCU.
When designing with this device, follow Lattice's recommended decoupling strategy (typically 0.1 µF and 10 µF near each power pin) and verify JTAG/SPI programming timing against the chosen configuration image size. The -6 speed grade consumes marginally more power than -5/-4 grades, so power budgets should be revalidated against the firmware image.
חלופות תחליף ישיר עבור LCMXO3D-9400HC-6BG484C — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם LCMXO3D-9400HC-6BG484C (אותו גורם צורה וטביעת רגל) — שונים ב Configuration Memory, Mounting Type, Package Type, Speed Grade.
LCMXO3D-9400HC-5BG484C
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
LCMXO3D-9400HC-6BG484I
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←LCMXO3-9400C-6BG484C
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
LCMXO3D-9400HC-6BG484C דירוגים מרביים ומאפיינים חשמליים
| Family | MachXO3D |
| Number of Logic Elements / LUTs | 9400 LUTs |
| Number of User I/O | 383 |
| Total Embedded Memory (bits) | 442368 |
| Embedded Block RAM - EBR (kbits) | 96 kbits |
| Number of PLLs | 2 |
| מתח אספקה | 2.5 V / 3.3 V (core 1.2 V) |
| Speed Grade | -6 |
| טמפרטורת פעולה | Commercial (0C to +85C) |
| Package Type | LFBGA-484 (BG484) |
| סוג הרכבה | Surface Mount |
| Security Engines | AES-256, HMAC-SHA-256, ECDSA-256, unique ID |
| Configuration Memory | Internal flash + dual-boot external SPI |
| סטטוס RoHS | Compliant |
מדריך תצורת פינים של LCMXO3D-9400HC-6BG484C lfbga-484 (bg484)
תצורת פינים עבור LCMXO3D-9400HC-6BG484C (מארזת lfbga-484 (bg484)). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור LCMXO3D-9400HC-6BG484C.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
LCMXO3D-9400HC-6BG484C מתאים עבור 6 יישוםs: Hardware Root-of-Trust (RoT) for Platform Boot, Industrial I/O Bridging and Glue Logic, Motor Control and HMI Front-End, Secure IoT Edge Device Attach, Automotive Functional-Safety Co-Processor, Display Aggregation and LED Matrix Driving.
Hardware Root-of-Trust (RoT) for Platform Boot
The LCMXO3D-9400HC-6BG484C's hardened AES-256, HMAC-SHA-256, and ECDSA-256 engines plus immutable boot ROM make it ideal as a platform Root-of-Trust companion to a host application processor. Placed upstream of the host MCU/MPU reset line, the FPGA verifies signed firmware on every power-up, refuses to release RESET until a valid signature is confirmed, and supports secure firmware rollback via dual-configuration flash. Per the Lattice MachXO3D product brief, the same fabric can simultaneously enforce measured boot, sealed-key storage, and TPM-like functions without external crypto ICs.
מומלץ
Industrial I/O Bridging and Glue Logic
With 383 user I/Os across multiple banks supporting 1.2/1.5/1.8/2.5/3.3 V, the LCMXO3D-9400HC-6BG484C replaces multiple CPLDs and discrete level shifters when bridging RGMII, USB, I2C, SPI, UART, and parallel LVCMOS buses. The 9400 LUT fabric absorbs custom protocol conversion (e.g., SPI-to-I2C, UART-to-parallel) and the on-chip PLLs deskew incoming clocks. Industrial PLC and gateway designs use this density to consolidate multiple bridging macros onto a single non-volatile part.
מומלץ
Motor Control and HMI Front-End
The 9400 LUT fabric and dual on-chip PLLs make the LCMXO3D-9400HC-6BG484C well suited as the front-end for field-oriented control (FOC) motor drives and HMI panels. The FPGA generates PWM/encoder timers, performs sigma-delta ADC interfacing, and drives RGB LCD/LED matrices with deterministic latency. Its instant-on non-volatile configuration boots in microseconds, eliminating the long FPGA-init delay that complicates safety-critical motor-start sequences.
מומלץ
Secure IoT Edge Device Attach
IoT edge gateways leverage the LCMXO3D-9400HC-6BG484C for secure attach between a low-power MPU and cloud radios (LTE-M, NB-IoT, LoRa, Wi-Fi 6 modules). The FPGA handles authenticated provisioning (HMAC-SHA-256 device identity), key injection, and OTA-decryption offload, reducing MPU wake-time and energy budget. Because configuration lives in on-chip flash, the device survives brown-outs without bricking - critical for battery-powered edge nodes.
מומלץ
Automotive Functional-Safety Co-Processor
For ISO 262ASIL-B and ASIL-D subsystems, the LCMXO3D-9400HC-6BG484C acts as a watchdog and safety co-processor supervising a host MCU through duplicated input sampling and Heartbeat/Safety-IO expansion. Automotive-grade MachXO3D members carry AEC-Q100 qualification; the commercial-temperature device shown here can be substituted by an equivalent automotive-grade MPN when targeting vehicle ECUs.
מומלץ
Display Aggregation and LED Matrix Driving
The 383 user I/Os of the LCMXO3D-9400HC-6BG484C are sufficient to drive multi-panel RGB LED walls, LVDS display bridges, and HDMI-to-parallel aggregator boards. The fabric pipelines pixel data from one high-speed LVDS/HDMI input to multiple 24-bit parallel outputs at low latency, while the hardware crypto engines authenticate firmware updates to the LED-controller subsystem.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור LCMXO3D-9400HC-6BG484C — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | LCMXO3D-9400HC-5BG484C | LCMXO3D-9400HC-6BG484I | LCMXO3-9400C-6BG484C | LCMXO3D-6900HC-6BG400C |
|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | LFBGA-484 | LFBGA-484 - same | LFBGA-484 - same | LFBGA-484 - same | LFBGA-400 - different (smaller BGA) |
| LUTs | 9400 | 9400 | 9400 | 9400 | 6900 (-27%) |
| User I/O | 383 | 383 | 383 | 383 | 335 |
| Embedded Memory (kbits) | 442 | 442 | 442 | 442 | 320 |
| Speed Grade | -6 (highest Fmax) | -5 (lower Fmax) | -6 | -6 | -6 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Commercial | Commercial |
| Security Engines (AES/HMAC/ECDSA) | Yes (hardware) | Yes | Yes | No (MachXO3 lacks RoT) | Yes |
| On-chip Flash Configuration | Dual-boot | Dual-boot | Dual-boot | Single image | Dual-boot |
מבדילים עיקריים
- Hardened hardware Root-of-Trust with AES-256 / HMAC / ECDSA (לעומתLCMXO3-9400C-6BG484C)
- Dual-boot on-chip flash configuration (לעומתLCMXO3-9400C-6BG484C)
- Instant-on non-volatile fabric boots in microseconds (לעומתSRAM-based FPGAs (e.g., Xilinx XC7A-series))
הערות תכנון
Estimated: the MachXO3D core draws roughly 1.2 V and each VCCIO bank can be set independently to 1.2-3.3 V. Decouple each supply pin with a 0.1 µF X7R ceramic placed within 5 mm of the ball, plus a bulk 10 µF per supply rail near the device. Unused VCCIO banks should still be tied to a valid rail, not floated, to avoid I/O behavior drift on power-up.
Estimated: the LFBGA-484 has 0.8 mm ball pitch on a 19 mm x 19 mm body. Use at least 4 PCB layers with one solid ground plane directly under the FPGA. Matched-length routing (within 150 mil) is required for high-speed LVDS pairs used in display bridges, and all JTAG/SPI programming pins should be brought out to test points to enable post-assembly firmware loading.
Estimated: when using the FPGA as an I2C/SPI/UART aggregator, enable the internal weak pull-ups only when no external pull-ups exist; mixing internal and external pull-ups can stretch rise times and break protocol compliance. Series-terminate clock lines running faster than 50 MHz with 33 Ω resistors placed close to the driver.
Estimated: never leave dual-boot SPI flash chip-select (SPID[7:0]) floating; the configuration controller requires deterministic logic levels at boot. During JTAG programming, ensure MSEL pins are in the JTAG mode (01) before powering up, or the part may attempt SPI boot and ignore the JTAG chain.
מידע על תאימות
RoHS/REACH compliant per Lattice materials declaration. Commercial temperature grade only - this part is not AEC-Q100. Pick the MachXO3D-9400HC automotive-grade equivalent for vehicle designs.
