LCMXO3D-9400HC-6BG484C - 9400 LUT FPGA, 484-BGA | Lattice
MPN： LCMXO3D-9400HC-6BG484C ✓ 啟用中LCMXO3D-9400HC-6BG484C 概覽
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can customize post-manufacturing. The MachXO3D belongs to Lattice's ultra-low-power control-FPGA hierarchy: control FPGA -> low-density FPGA -> programmable logic -> semiconductor. It augments conventional glue-logic CPLDs with deterministic fabric and parallel processing for bridging, control, and secure-boot tasks.
Key features include up to 9400 LUTs, 73 Kbits of distributed RAM, 96 Kbits of embedded block RAM (EBR), up to 383 user I/Os supporting LVCMOS 1.2/1.5/1.8/2.5/3.3 V, dual-configuration images via on-chip flash, and integrated security engines including AES-256, HMAC-SHA-256, ECDSA-256, and a unique device identifier. The -6 speed grade targets higher system-clock Fmax while retaining the ultra-low-power characteristics of the family.
The architecture combines a non-volatile configuration memory cell on a 40 nm CMOS process, embedded PLLs, hard I2C/SPI/UART controllers, and on-chip flash configuration storage, eliminating the external boot flash required by SRAM-based FPGAs. Hardened security blocks accelerate cryptographic operations and reduce fabric utilization for crypto functions.
Typical applications include secure platform boot and Root-of-Trust, industrial control bridging (I2C/SPI to RGMII), motor control and human-machine interface (HMI) glue logic, IoT edge-device secure attach, and automotive functional-safety co-processor functions in conjunction with a host MCU.
When designing with this device, follow Lattice's recommended decoupling strategy (typically 0.1 µF and 10 µF near each power pin) and verify JTAG/SPI programming timing against the chosen configuration image size. The -6 speed grade consumes marginally more power than -5/-4 grades, so power budgets should be revalidated against the firmware image.
直接替換替代品，適用於 LCMXO3D-9400HC-6BG484C — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： LCMXO3D-9400HC-6BG484C （相同外形與佔位） — 差異在於 Configuration Memory, Mounting Type, Package Type, Speed Grade.
LCMXO3D-9400HC-5BG484C
✅ 直接替換📋 參考替代品（不在目錄中）
LCMXO3D-9400HC-6BG484I
✅ 直接替換聯絡詢價
查看資料表 →LCMXO3-9400C-6BG484C
✅ 直接替換📋 參考替代品（不在目錄中）
LCMXO3D-9400HC-6BG484C 最大額定值與電氣特性
| Family | MachXO3D |
| Number of Logic Elements / LUTs | 9400 LUTs |
| Number of User I/O | 383 |
| Total Embedded Memory (bits) | 442368 |
| Embedded Block RAM - EBR (kbits) | 96 kbits |
| Number of PLLs | 2 |
| 供應電壓 | 2.5 V / 3.3 V (core 1.2 V) |
| Speed Grade | -6 |
| 工作溫度 | Commercial (0C to +85C) |
| Package Type | LFBGA-484 (BG484) |
| 安裝類型 | Surface Mount |
| Security Engines | AES-256, HMAC-SHA-256, ECDSA-256, unique ID |
| Configuration Memory | Internal flash + dual-boot external SPI |
| RoHS 狀態 | Compliant |
LCMXO3D-9400HC-6BG484C lfbga-484 (bg484) 腳位配置指南
LCMXO3D-9400HC-6BG484C（lfbga-484 (bg484) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： LCMXO3D-9400HC-6BG484C.
請參閱 資料表 以查看完整腳位配置。
典型應用
LCMXO3D-9400HC-6BG484C 適用於 6 應用s: Hardware Root-of-Trust (RoT) for Platform Boot, Industrial I/O Bridging and Glue Logic, Motor Control and HMI Front-End, Secure IoT Edge Device Attach, Automotive Functional-Safety Co-Processor, Display Aggregation and LED Matrix Driving.
Hardware Root-of-Trust (RoT) for Platform Boot
The LCMXO3D-9400HC-6BG484C's hardened AES-256, HMAC-SHA-256, and ECDSA-256 engines plus immutable boot ROM make it ideal as a platform Root-of-Trust companion to a host application processor. Placed upstream of the host MCU/MPU reset line, the FPGA verifies signed firmware on every power-up, refuses to release RESET until a valid signature is confirmed, and supports secure firmware rollback via dual-configuration flash. Per the Lattice MachXO3D product brief, the same fabric can simultaneously enforce measured boot, sealed-key storage, and TPM-like functions without external crypto ICs.
推薦
Industrial I/O Bridging and Glue Logic
With 383 user I/Os across multiple banks supporting 1.2/1.5/1.8/2.5/3.3 V, the LCMXO3D-9400HC-6BG484C replaces multiple CPLDs and discrete level shifters when bridging RGMII, USB, I2C, SPI, UART, and parallel LVCMOS buses. The 9400 LUT fabric absorbs custom protocol conversion (e.g., SPI-to-I2C, UART-to-parallel) and the on-chip PLLs deskew incoming clocks. Industrial PLC and gateway designs use this density to consolidate multiple bridging macros onto a single non-volatile part.
推薦
Motor Control and HMI Front-End
The 9400 LUT fabric and dual on-chip PLLs make the LCMXO3D-9400HC-6BG484C well suited as the front-end for field-oriented control (FOC) motor drives and HMI panels. The FPGA generates PWM/encoder timers, performs sigma-delta ADC interfacing, and drives RGB LCD/LED matrices with deterministic latency. Its instant-on non-volatile configuration boots in microseconds, eliminating the long FPGA-init delay that complicates safety-critical motor-start sequences.
推薦
Secure IoT Edge Device Attach
IoT edge gateways leverage the LCMXO3D-9400HC-6BG484C for secure attach between a low-power MPU and cloud radios (LTE-M, NB-IoT, LoRa, Wi-Fi 6 modules). The FPGA handles authenticated provisioning (HMAC-SHA-256 device identity), key injection, and OTA-decryption offload, reducing MPU wake-time and energy budget. Because configuration lives in on-chip flash, the device survives brown-outs without bricking - critical for battery-powered edge nodes.
推薦
Automotive Functional-Safety Co-Processor
For ISO 262ASIL-B and ASIL-D subsystems, the LCMXO3D-9400HC-6BG484C acts as a watchdog and safety co-processor supervising a host MCU through duplicated input sampling and Heartbeat/Safety-IO expansion. Automotive-grade MachXO3D members carry AEC-Q100 qualification; the commercial-temperature device shown here can be substituted by an equivalent automotive-grade MPN when targeting vehicle ECUs.
推薦
Display Aggregation and LED Matrix Driving
The 383 user I/Os of the LCMXO3D-9400HC-6BG484C are sufficient to drive multi-panel RGB LED walls, LVDS display bridges, and HDMI-to-parallel aggregator boards. The fabric pipelines pixel data from one high-speed LVDS/HDMI input to multiple 24-bit parallel outputs at low latency, while the hardware crypto engines authenticate firmware updates to the LED-controller subsystem.
推薦
推薦產品摘要
工程參考資料，適用於 LCMXO3D-9400HC-6BG484C — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | LCMXO3D-9400HC-5BG484C | LCMXO3D-9400HC-6BG484I | LCMXO3-9400C-6BG484C | LCMXO3D-6900HC-6BG400C |
|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | LFBGA-484 | LFBGA-484 - same | LFBGA-484 - same | LFBGA-484 - same | LFBGA-400 - different (smaller BGA) |
| LUTs | 9400 | 9400 | 9400 | 9400 | 6900 (-27%) |
| User I/O | 383 | 383 | 383 | 383 | 335 |
| Embedded Memory (kbits) | 442 | 442 | 442 | 442 | 320 |
| Speed Grade | -6 (highest Fmax) | -5 (lower Fmax) | -6 | -6 | -6 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Commercial | Commercial |
| Security Engines (AES/HMAC/ECDSA) | Yes (hardware) | Yes | Yes | No (MachXO3 lacks RoT) | Yes |
| On-chip Flash Configuration | Dual-boot | Dual-boot | Dual-boot | Single image | Dual-boot |
主要差異化特點
- Hardened hardware Root-of-Trust with AES-256 / HMAC / ECDSA (對比LCMXO3-9400C-6BG484C)
- Dual-boot on-chip flash configuration (對比LCMXO3-9400C-6BG484C)
- Instant-on non-volatile fabric boots in microseconds (對比SRAM-based FPGAs (e.g., Xilinx XC7A-series))
設計說明
Estimated: the MachXO3D core draws roughly 1.2 V and each VCCIO bank can be set independently to 1.2-3.3 V. Decouple each supply pin with a 0.1 µF X7R ceramic placed within 5 mm of the ball, plus a bulk 10 µF per supply rail near the device. Unused VCCIO banks should still be tied to a valid rail, not floated, to avoid I/O behavior drift on power-up.
Estimated: the LFBGA-484 has 0.8 mm ball pitch on a 19 mm x 19 mm body. Use at least 4 PCB layers with one solid ground plane directly under the FPGA. Matched-length routing (within 150 mil) is required for high-speed LVDS pairs used in display bridges, and all JTAG/SPI programming pins should be brought out to test points to enable post-assembly firmware loading.
Estimated: when using the FPGA as an I2C/SPI/UART aggregator, enable the internal weak pull-ups only when no external pull-ups exist; mixing internal and external pull-ups can stretch rise times and break protocol compliance. Series-terminate clock lines running faster than 50 MHz with 33 Ω resistors placed close to the driver.
Estimated: never leave dual-boot SPI flash chip-select (SPID[7:0]) floating; the configuration controller requires deterministic logic levels at boot. During JTAG programming, ensure MSEL pins are in the JTAG mode (01) before powering up, or the part may attempt SPI boot and ignore the JTAG chain.
合規資訊
RoHS/REACH compliant per Lattice materials declaration. Commercial temperature grade only - this part is not AEC-Q100. Pick the MachXO3D-9400HC automotive-grade equivalent for vehicle designs.
