MCIMX257DJM4A - i.MX25 ARM9 400MHz 400-LFBGA MPU | NXP
MPN: MCIMX257DJM4A ✓ פעילMCIMX257DJM4A סקירה
A microprocessor (MPU) is an integrated circuit that contains the CPU, memory control, and peripheral interfaces on a single silicon die, serving as the central processing unit of an embedded system. Within the broader taxonomy, the MCIMX257DJM4A is an ARM9-based applications processor, a sub-class of microprocessors specialized for low-power multimedia and human-machine interface (HMI) workloads in industrial and consumer products. It sits within the i.MX family hierarchy: i.MX25 -> i.MX application processors -> microprocessors -> integrated circuits.
Key specifications include an ARM926EJ-S core with 16 KB instruction cache and 16 KB data cache, a 400 MHz maximum clock rate, integrated 10/100 Ethernet MAC, two USB 2.0 PHYs (HS OTG + HS Host), three 12-bit ADCs, a touchscreen controller, and an LCD controller supporting resolutions up to WVGA. The device operates across a 1.38 V to 1.52 V core supply and 3.0 V to 3.6 V I/O supply, with industrial temperature range of -40 °C to +85 °C.
Architecturally, the i.MX25 uses an ARM926EJ-S core with a vector floating-point (VFP) coprocessor option and a multi-layer AHB bus matrix for high-throughput peripheral access. The silicon version 1.2 designation reflects hardware revision fixes applied to the original i.MX25 die, including USB PHY errata improvements and power-management refinements.
Typical applications include industrial human-machine interface (HMI) panels, point-of-sale terminals, portable medical monitoring devices, building automation controllers, and consumer multimedia appliances. The wide peripheral set (Ethernet, USB, CAN, I2S, SPI, UART, LCD) allows a single MPU to replace a multi-chip solution in cost-sensitive designs.
When designing with this part, ensure the PCB provides the four-layer BGA breakout needed for the 400-ball MAPBGA footprint and that the boot configuration pins are properly pulled to select the desired boot source (NOR, NAND, SD/MMC, or serial). Adequate thermal vias under the package improve heat extraction for continuous 400 MHz operation.
This page synthesizes NXP official documentation, cross-reference data, distributor pricing, and practical design guidance not consolidated in a single manufacturer datasheet.
חלופות תחליף ישיר עבור MCIMX257DJM4A — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם MCIMX257DJM4A (אותו גורם צורה וטביעת רגל) — שונים ב Package, LCD Controller, Core Architecture, Operating Temperature, ADC.
MCIMX253DJM4A
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MCIMX255DJM4A
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MCIMX258CJM4A
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MCIMX250DJM4A
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MCIMX257CJM4A
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MCIMX251DJM4A
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MCIMX257DJM4A דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | ARM926EJ-S |
| Core Count | 1 |
| רוחב אפיק נתונים | 32-bit |
| תדר שעון מקסימלי | 400 MHz |
| Internal SRAM | 128 KB |
| Number of I/O | 128 |
| מארז / Case | 400-LFBGA (17x17 mm) |
| Supply Voltage - Core | 1.38 V to 1.52 V |
| Supply Voltage - I/O | 3.0 V to 3.6 V |
| טמפרטורת פעולה | -40 °C to +85 °C |
| Oscillator Type | External |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| USB PHYs | 2 (HS OTG + HS Host) |
| Ethernet MAC | 10/100 Mbps |
| ADC Channels | 3 x 12-bit |
| Touchscreen Controller | Yes (integrated) |
| LCD Controller | Yes (up to WVGA) |
| Packaging | Tray |
| Silicon Version | 1.2 |
| Series | i.MX25 |
| סטטוס RoHS | Compliant |
מדריך תצורת פינים של MCIMX257DJM4A 400-lfbga (17x17 mm)
תצורת פינים עבור MCIMX257DJM4A (מארזת 400-lfbga (17x17 mm)). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור MCIMX257DJM4A.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
MCIMX257DJM4A מתאים עבור 6 יישוםs: Industrial Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) Terminals, Portable Medical Monitoring Devices, Building Automation Controllers, Consumer Multimedia Appliances, Automotive Aftermarket Telematics.
Industrial Human-Machine Interface (HMI) Panels
The MCIMX257DJM4A is purpose-built for industrial HMI panels that drive WVGA TFT LCDs while simultaneously managing touch input, Ethernet fieldbus traffic, and USB peripherals. Its ARM926EJ-S core at 400 MHz delivers enough throughput to render 24-bit color graphics at 60 fps while leaving CPU headroom for Modbus/TCP or EtherNet/IP stack execution. The integrated 12-bit ADC and 4-wire touchscreen controller eliminate the need for external touch ASICs, reducing BOM cost by typically $1-2 per board. At industrial temperature grade (-40 °C to +85 °C) and 1.38 V to 1.52 V core supply, it operates reliably in factory cabinets, outdoor kiosks, and process-control enclosures.
מומלץ
Point-of-Sale (POS) Terminals
POS terminals require a processor that can drive a touch display, manage USB peripherals (barcode scanner, receipt printer, cash drawer), encrypt transactions, and connect over Ethernet or Wi-Fi — all within a tight BOM. The MCIMX257DJM4A's integrated 10/100 Ethernet MAC, two USB 2.0 PHYs (OTG + Host), and LCD controller supporting WVGA let a single chip run the entire terminal without external PHY ICs. Its ARM926EJ-S core executes AES-128/256 encryption at speeds sufficient for contactless card transaction pipelines, while DDR2 memory support keeps BOM cost low versus LPDDR-only designs.
מומלץ
Portable Medical Monitoring Devices
Portable medical monitors (pulse oximeters, glucometers, ambulatory ECG) need a low-power ARM-class processor with deterministic real-time response, accurate ADC inputs, and reliable USB/serial connectivity to a host PC or gateway. The MCIMX257DJM4A's three 12-bit ADCs at up to 1 MSPS support multi-channel vital-sign acquisition, and its integrated touchscreen controller simplifies patient-facing UI without extra chips. Operating from a single 3.3 V I/O rail with a 1.38 V to 1.52 V core, it pairs well with single-cell Li-ion or 4xAA battery stacks, while its industrial temperature rating suits field-deployment scenarios.
מומלץ
Building Automation Controllers
Building automation controllers (HVAC, lighting, access) often need to run multiple fieldbus protocols (BACnet, Modbus, KNX, LonWorks) concurrently while presenting a local touch UI. The MCIMX257DJM4A's rich peripheral set — including multiple UART, SPI, I2C, CAN, and Ethernet — allows a single processor to bridge these protocols without external bridge ICs. Its 128 KB of internal SRAM supports modest protocol stacks directly, while external DDR2 handles larger web-server or graphical-interface payloads. The 400 MHz ARM9 core has ample headroom for BACnet/IP routing at typical building-network packet rates.
מומלץ
Consumer Multimedia Appliances
Consumer multimedia devices — smart-home hubs, networked audio players, kitchen appliances with displays — need an MPU that combines decent CPU throughput with integrated LCD, touch, USB, and Ethernet. The MCIMX257DJM4A delivers all of this in a single 17x17 mm BGA, allowing appliance OEMs to ship Wi-Fi-enabled, app-controlled products with rich graphical UIs at a competitive BOM. Running a lightweight Linux distribution on the i.MX25 enables OTA firmware updates and remote diagnostics, while the integrated LCD controller drives WVGA panels directly without a discrete graphics controller.
מומלץ
Automotive Aftermarket Telematics
Aftermarket telematics devices (fleet trackers, OBD-II dongles, dash cameras with connectivity) require a processor that can handle GPS parsing, CAN bus sniffing, cellular modem interfacing, and local storage — all at industrial temperature. The MCIMX257DJM4A's integrated CAN controller, USB OTG for cellular modems, SD/MMC for local storage, and -40 °C to +85 °C operation make it a strong fit. Note: this is the standard industrial-grade silicon, not AEC-Q100 qualified; for OEM automotive designs, NXP offers separately qualified i.MX25 variants.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור MCIMX257DJM4A — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | MCIMX253DJM4A | MCIMX255DJM4A | MCIMX258CJM4A | MCIMX250DJM4A | MCIMX257CJM4A |
|---|---|---|---|---|---|---|
| Package | 400-LFBGA (17x17 mm) | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ARM926EJ-S 32-bit | ARM926EJ-S 32-bit | ARM926EJ-S 32-bit | ARM926EJ-S 32-bit | ARM926EJ-S 32-bit | ARM926EJ-S 32-bit |
| Number of I/O | 128 | 128 | 128 | 128 | 128 | 128 |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
מבדילים עיקריים
- Integrated touchscreen + 12-bit ADC + LCD controller in one chip (לעומתMCIMX253DJM4A)
- Mature Linux and U-Boot BSP ecosystem (לעומתMCIMX258CJM4A)
- Active NXP lifecycle with 39-week lead time (לעומתGeneric ARM9 BGA from other vendors)
הערות תכנון
Estimated: the 400-ball MAPBGA on a 0.8 mm pitch requires a 4-layer PCB minimum with microvia-in-pad or dogbone fanout. Place a continuous ground plane on Layer 2 and a power plane on Layer 3 to provide low-impedance return paths for the 400 MHz ARM9 core and DDR2 signals. Thermal vias (0.3 mm drill, 1.0 mm pitch) under the center power balls reduce theta-JA by an estimated 25-35 %.
Estimated: at 400 MHz core voltage 1.4 V and typical Dhrystone activity, core current is approximately 200 mA (0.28 W); peak multimedia activity can pull 350 mA. Provide a switching regulator with at least 1 A of headroom on the core rail to absorb transient spikes. The DDR2 memory controller and I/O banks together may add another 200-400 mA; budget a 1.5 A 3.3 V LDO for the I/O supply.
Common design pitfalls include: forgetting to strap BOOT_MODE pins (the part will fail to boot if left floating); mis-ordering DDR2 address/control traces (the i.MX25 reference manual requires matched-length traces within 50 ps for proper DDR2-400 operation); omitting the external 32.768 kHz RTC crystal (required for low-power modes and RTC); and using non-qualified NAND/NOR flash (the i.MX25 boot ROM has a specific ONFI timing profile). Always validate boot from at least two boot sources before mass-production.
מידע על תאימות
RoHS compliant and lead-free per NXP product page. Industrial temperature grade only - not AEC-Q100 qualified; NXP offers separate automotive-qualified i.MX25 variants. REACH and conflict-minerals compliance per NXP environmental declarations.
