PIC32MX775F256LT-80V/BG - 80MHz 32-bit MCU with ETH/USB/CAN | Microchip
MPN: PIC32MX775F256LT-80V/BG ✓ פעילPIC32MX775F256LT-80V/BG סקירה
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals such as timers, communication interfaces, and analog blocks. The PIC32MX family belongs to the broader 32-bit MCU taxonomy: 32-bit microcontroller -> MIPS32 M4K core -> Microchip PIC32 -> Microchip Connectivity Line, sitting under the wider category of microcontrollers (semiconductor -> IC -> microcontroller). The '5/6/7' series specifically targets connected-embedded applications with on-chip Ethernet, USB, and CAN.
Key features of the PIC32MX775F256LT-80V/BG include: 256 KB Flash (256K x 8) for code storage, 64 KB SRAM for runtime data, 80 MHz maximum operating frequency delivering 105 DMIPS, integrated 10/100 Ethernet MAC with MII/RMII interface, USB 2.0 Full-Speed OTG controller, two independent CAN 2.0B modules, sixteen 10-bit ADC inputs, five 16-bit timers/counters, and a wide operating voltage of 2.3 V to 3.6 V. The 'T' suffix indicates tape-and-reel packaging, 'V' denotes the -40C to +105C industrial-grade temperature range, and 'BG' identifies the 121-pin TFBGA package.
Architecturally, the device uses a 5-stage pipelined MIPS32 M4K core with hardware multiply/divide, separate program Flash bus and SRAM bus (Harvard architecture), and a peripheral bus that supports DMA for high-throughput Ethernet and USB transfers. Code execution is in-place from Flash via an instruction cache, allowing zero-wait-state performance at 80 MHz.
Typical applications include industrial Ethernet gateways, USB-OTG device controllers, CAN-based automotive body controllers, point-of-sale terminals, and connected medical devices. The integrated triple-connectivity (Ethernet + USB + CAN) makes the part especially well suited for protocol-bridging nodes that must translate between factory, automotive, and IT networks.
When designing with this part, pay attention to the 121-ball TFBGA layout (0.8 mm pitch): it requires via-in-pad PCB fabrication and 4-layer routing for clean Ethernet signal integrity. Also confirm the 'V' temperature grade matches your end-environment, and use MPLAB Harmony or MPLAB XC32 for firmware development with the integrated peripheral libraries.
This page synthesizes distributor pricing across DigiKey/Mouser/Octopart, Microchip-recommended drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing engineering decision support beyond the basic parametric page.
חלופות תחליף ישיר עבור PIC32MX775F256LT-80V/BG — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם PIC32MX775F256LT-80V/BG (אותו גורם צורה וטביעת רגל) — שונים ב Package, Timers, USB, ADC, CAN.
PIC32MX775F256L-80V/BG
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX775F256LT-80I/BG
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX775F256L-80V/PF
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX764F128LT-I/BG
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX764F128L-I/BG
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX575F512LT-80I/BG
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX775F256LT-80V/BG דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | MIPS32 M4K (32-bit RISC, 5-stage pipeline) |
| Maximum Operating Frequency | 80 MHz |
| Performance | 105 DMIPS |
| Flash Program Memory | 256 KB (256K x 8) |
| SRAM Data Memory | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Ethernet | 10/100 Mbit MAC with MII/RMII interface |
| USB | USB 2.0 Full-Speed OTG controller |
| CAN | 2x CAN 2.0B modules |
| ADC | 16-channel 10-bit ADC |
| Timers | 5x 16-bit timers/counters |
| טווח טמפרטורת פעולה | -40C to +105C (industrial, V grade) |
| מארז | 121-pin TFBGA (10x10 mm) |
| Package Code | BG (JESD-30 code S-PBGA-B121) |
| Ball Pitch | 0.8 mm |
| סוג הרכבה | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Instruction Cache | Yes (Flash in-place execution) |
| DMA Channels | Yes (peripheral bus DMA) |
| סטטוס RoHS | Compliant |
תצורת פינים של PIC32MX775F256LT-80V/BG
| פין A1 | VSS — Ground |
| פין A2 | OSC1/CLKI/RC13 — Crystal oscillator input or external clock |
| פין A3 | RC14/SOSCO — I/O port / secondary oscillator output |
| פין A4 | VSS — Ground |
| פין A5 | PMD0/RE0 — Parallel master data / I/O port |
| פין A6 | PMD2/RE2 — Parallel master data / I/O port |
| פין A7 | PMD5/RE5 — Parallel master data / I/O port |
| פין A8 | PMD7/RE7 — Parallel master data / I/O port |
| פין A9 | PMA0/RF0 — Parallel master address / I/O port |
| פין A10 | PMA2/RF2 — Parallel master address / I/O port |
| פין A11 | PMA5/RF5 — Parallel master address / I/O port |
| פין B1 | VDD — Power supply (2.3 V to 3.6 V) |
| פין B2 | OSC2/CLKO/RC15 — Crystal oscillator output or system clock out |
| פין B3 | VDD — Power supply |
| פין B4 | SOSCI/CN1/RC13 — Secondary oscillator / change notification |
| פין B5 | PMD1/RE1 — Parallel master data / I/O port |
| פין B6 | PMD3/RE3 — Parallel master data / I/O port |
| פין B7 | PMD6/RE6 — Parallel master data / I/O port |
| פין B8 | PMA10/RF10 — Parallel master address / I/O port |
| פין B9 | PMA1/RF1 — Parallel master address / I/O port |
| פין B10 | PMA3/RF3 — Parallel master address / I/O port |
| פין B11 | PMA8/RF8 — Parallel master address / I/O port |
| פין C1 | AVDD — Analog power supply |
| פין C2 | CVREF-/AN1/C1IN-/RA1 — Comparator reference / analog input |
| פין C3 | VREF+/AN3/C1IN+/RA3 — Voltage reference + / analog input |
| פין C4 | AN5/RB5 — Analog input / I/O port |
| פין C5 | AN8/RB8 — Analog input / I/O port |
| פין C6 | AN12/RB12 — Analog input / I/O port |
| פין C7 | AN15/RB15 — Analog input / I/O port |
| פין C8 | PMA11/RG0 — Parallel master address / I/O port |
| פין C9 | PMA6/RF6 — Parallel master address / I/O port |
| פין C10 | PMA4/RF4 — Parallel master address / I/O port |
| פין C11 | PMA9/RF9 — Parallel master address / I/O port |
| פין D1 | AVSS — Analog ground |
| פין D2 | CVREF+/AN0/C1IN+/RA0 — Comparator reference + / analog input |
| פין D3 | AN2/C2IN-/RA2 — Analog input / comparator input |
| פין D4 | AN4/C1OUT/RB4 — Analog input / comparator output |
| פין D5 | AN7/RB7 — Analog input / I/O port |
| פין D6 | AN11/RB11 — Analog input / I/O port |
| פין D7 | AN14/RB14 — Analog input / I/O port |
| פין D8 | PMA12/RG1 — Parallel master address / I/O port |
| פין D9 | PMA13/SDA2/RG2 — Parallel master address / I2C SDA |
| פין D10 | PMA7/RF7 — Parallel master address / I/O port |
| פין D11 | PMCS1/RG12 — Parallel master chip select |
| פין E1 | TCK/RA8 — JTAG test clock / I/O port |
| פין E2 | CVREF/AN6/RB6 — Comparator voltage reference / analog input |
| פין E3 | AVSS — Analog ground |
| פין E4 | AN9/RB9 — Analog input / I/O port |
| פין E5 | AN10/RB10 — Analog input / I/O port |
| פין E6 | AN13/RB13 — Analog input / I/O port |
| פין E7 | PMA14/SCL2/RG3 — Parallel master address / I2C SCL |
| פין E8 | PMA15/CVREF2/RG4 — Parallel master address / comparator reference |
| פין E9 | TRCLK/RG6 — Trace clock / I/O port |
| פין E10 | TRD0/RG7 — Trace data 0 / I/O port |
| פין E11 | TRD1/RG8 — Trace data 1 / I/O port |
| פין F1 | TDI/RA9 — JTAG test data in / I/O port |
| פין F2 | TDO/RA10 — JTAG test data out / I/O port |
| פין F3 | TMS/RA0 — JTAG test mode select / I/O port (shared) |
| פין F4 | TRST/RA4 — JTAG test reset / I/O port |
| פין F5 | INT0/RE8 — External interrupt 0 / I/O port |
| פין F6 | PMD8/RG9 — Parallel master data / I/O port |
| פין F7 | PMD9/RG10 — Parallel master data / I/O port |
| פין F8 | PMD10/RG11 — Parallel master data / I/O port |
| פין F9 | PMD11/RG13 — Parallel master data / I/O port |
| פין F10 | PMD12/RG14 — Parallel master data / I/O port |
| פין F11 | PMD13/RG15 — Parallel master data / I/O port |
| פין G1 | RTCC/RC1 — Real-time clock calendar / I/O port |
| פין G2 | U1TX/RC4 — UART1 transmit / I/O port |
| פין G3 | U1RX/RC5 — UART1 receive / I/O port |
| פין G4 | U2TX/RC6 — UART2 transmit / I/O port |
| פין G5 | U2RX/RC7 — UART2 receive / I/O port |
| פין G6 | PMD14/RH0 — Parallel master data / I/O port |
| פין G7 | PMD15/RH1 — Parallel master data / I/O port |
| פין G8 | PMWR/RH2 — Parallel master write / I/O port |
| פין G9 | PMRD/RH3 — Parallel master read / I/O port |
| פין G10 | SDA1/RC9 — I2C1 SDA / I/O port |
| פין G11 | SCL1/RC10 — I2C1 SCL / I/O port |
| פין H1 | C1RX/RC2 — CAN1 RX / I/O port |
| פין H2 | C1TX/RC3 — CAN1 TX / I/O port |
| פין H3 | C2RX/RC8 — CAN2 RX / I/O port |
| פין H4 | C2TX/RC11 — CAN2 TX / I/O port |
| פין H5 | PMCS2/RH4 — Parallel master chip select 2 / I/O port |
| פין H6 | PMCS1/RH5 — Parallel master chip select 1 (alt) / I/O port |
| פין H7 | PMALH/RH6 — Parallel master address latch high |
| פין H8 | PMALL/RH7 — Parallel master address latch low |
| פין H9 | OC1/RD0 — Output compare 1 / I/O port |
| פין H10 | OC2/RD1 — Output compare 2 / I/O port |
| פין H11 | OC3/RD2 — Output compare 3 / I/O port |
| פין J1 | ERXD1/AERXD1/RJ8 — Ethernet RX data 1 / I/O port |
| פין J2 | ERXD0/AERXD0/RJ9 — Ethernet RX data 0 / I/O port |
| פין J3 | ETXD1/RJ11 — Ethernet TX data 1 / I/O port |
| פין J4 | ETXD0/RJ12 — Ethernet TX data 0 / I/O port |
| פין J5 | ERXERR/RJ10 — Ethernet RX error / I/O port |
| פין J6 | ETXEN/RJ13 — Ethernet TX enable / I/O port |
| פין J7 | EMDC/RJ14 — Ethernet management data clock |
| פין J8 | EMDIO/RJ15 — Ethernet management data I/O |
| פין J9 | OC4/RD3 — Output compare 4 / I/O port |
| פין J10 | IC1/RD8 — Input capture 1 / I/O port |
| פין J11 | IC2/RD9 — Input capture 2 / I/O port |
| פין K1 | AERXDV/RH8 — Alternate Ethernet RX data valid / I/O port |
| פין K2 | AECRS/RH9 — Alternate Ethernet carrier sense / I/O port |
| פין K3 | REFCLK/RH10 — Ethernet reference clock / I/O port |
| פין K4 | AECOL/RH11 — Alternate Ethernet collision / I/O port |
| פין K5 | AETXDV/RH12 — Alternate Ethernet TX data valid / I/O port |
| פין K6 | AETXERR/RH13 — Alternate Ethernet TX error / I/O port |
| פין K7 | IC3/RD10 — Input capture 3 / I/O port |
| פין K8 | IC4/RD11 — Input capture 4 / I/O port |
| פין K9 | IC5/RD12 — Input capture 5 / I/O port |
| פין K10 | OC5/RD13 — Output compare 5 / I/O port |
| פין K11 | VBUS — USB VBUS detect (USB-OTG) |
| פין L1 | D+/RG3 (alt) — USB D+ data line / I/O port (shared) |
| פין L2 | D-/RG2 (alt) — USB D- data line / I/O port (shared) |
| פין L3 | VUSB3V3 — USB 3.3 V supply |
| פין L4 | VDD — Power supply |
| פין L5 | VSS — Ground |
| פין L6 | VDD — Power supply |
| פין L7 | VSS — Ground |
| פין L8 | RD4 — I/O port |
| פין L9 | RD5 — I/O port |
| פין L10 | RD6 — I/O port |
| פין L11 | RD7 — I/O port |
יישומים טיפוסיים
PIC32MX775F256LT-80V/BG מתאים עבור 6 יישוםs: Industrial Ethernet Gateway, USB-OTG Device/Host Controller, CAN-based Automotive Body Controller, Point-of-Sale (POS) Terminal, Connected Medical Device, Industrial Protocol Bridge (CAN-USB-Ethernet).
Industrial Ethernet Gateway
The PIC32MX775F256LT-80V/BG is well suited for industrial Ethernet gateways because its integrated 10/100 Mbit MAC with MII/RMII interfaces allows direct connection to a PHY (such as Microchip KSZ8041) without an external MAC bridge. The 80 MHz MIPS32 M4K core delivers 105 DMIPS, sufficient to run an embedded TCP/IP stack (e.g., Microchip Harmony TCP/IP) while maintaining wire-speed packet forwarding. The 256 KB Flash holds the full TCP/IP + application stack, and 64 KB SRAM buffers Ethernet frames during peak load. The dual CAN modules allow the gateway to bridge industrial CANopen or DeviceNet segments to an Ethernet SCADA network. Operating voltage of 2.3 V to 3.6 V supports 3.3 V industrial rails, and the -40C to +105C industrial grade handles factory-floor environments.
מומלץ
USB-OTG Device/Host Controller
The PIC32MX775F256LT-80V/BG is ideal for USB-OTG device/host controllers because it integrates a USB 2.0 Full-Speed OTG controller with on-chip transceiver, eliminating the need for an external PHY. At 80 MHz, the M4K core runs the USB stack plus composite-device class drivers (CDC, HID, MSD) with DMA on the peripheral bus minimizing interrupt overhead. The 256 KB Flash accommodates dual-role USB stacks and vendor class firmware, while 64 KB SRAM handles USB endpoint buffers and protocol state. USB-OTG Session Request Protocol (SRP) and Host Negotiation Protocol (HNP) are supported in hardware, enabling portable USB devices that can act as either host or peripheral. Industrial temperature grade -40C to +105C allows use in factory diagnostic tools and outdoor instrumentation.
מומלץ
CAN-based Automotive Body Controller
The PIC32MX775F256LT-80V/BG fits CAN-based automotive body controllers because it integrates two independent CAN 2.0B controllers with hardware acceptance filters, supporting body-electronics networks (window, mirror, lighting, HVAC actuators) that often require multiple CAN channels. The 80 MHz core provides the processing headroom for CANopen, J1939, or OBD-II stack parsing at full bus load (1 Mbit/s). The 256 KB Flash and 64 KB SRAM are sized for typical body-controller firmware plus a CAN bootloader for field updates. The 121-ball TFBGA package, while not automotive-Q100 qualified, is acceptable for non-safety automotive body ECUs in non-AEC-Q100 applications; for safety-critical ECUs, choose a Q100-qualified variant. Operating voltage 2.3 V to 3.6 V tolerates automotive cranking transients when paired with a proper voltage regulator.
מומלץ
Point-of-Sale (POS) Terminal
The PIC32MX775F256LT-80V/BG suits point-of-sale terminals because its triple connectivity (Ethernet + USB + dual CAN) allows a single chip to drive a 10/100 LAN uplink, USB barcode scanner/PIN pad/thermal printer peripherals, and CAN-based fiscal cash-drawer or scale interfaces. The 80 MHz MIPS32 M4K core delivers sufficient processing for transaction processing, encryption helpers, and display refresh, while the 256 KB Flash holds the secure payment firmware and TLS library. The 64 KB SRAM supports transaction buffer storage and TLS session state. Operating voltage 2.3 V to 3.6 V and industrial temperature range -40C to +105C cover retail environments. The 121-ball TFBGA package (10x10 mm) keeps the BOM small for compact countertop terminals.
מומלץ
Connected Medical Device
The PIC32MX775F256LT-80V/BG is a strong fit for connected medical devices such as patient monitors, infusion pumps, and diagnostic instruments that require Ethernet for EMR connectivity, USB for service/charging ports, and CAN for internal sensor networks. The 80 MHz MIPS32 M4K core delivers 105 DMIPS, supporting real-time signal processing for vital-sign algorithms and TCP/IP TLS connections for HIPAA-compliant data upload. The 256 KB Flash and 64 KB SRAM hold a real-time OS kernel, drivers, and application firmware. The industrial temperature range -40C to +105C supports clinical environments including operating rooms and cold-storage supply areas. The integrated 10-bit ADC with 16 channels handles direct sensor interfaces (temperature, pressure, SpO2 analog front-ends) without an external ADC.
מומלץ
Industrial Protocol Bridge (CAN-USB-Ethernet)
The PIC32MX775F256LT-80V/BG is purpose-built for industrial protocol-bridge nodes that translate between CAN fieldbus, USB service ports, and Ethernet plant networks. The two CAN controllers accept incoming CAN 2.0B frames, the 80 MHz core parses and reformats them, and either the Ethernet MAC streams them as Modbus-TCP packets or the USB-OTG port exposes them to a service technician's laptop. The 256 KB Flash holds the protocol-conversion firmware plus web-based management UI; 64 KB SRAM handles concurrent CAN, USB, and Ethernet packet buffers. The wide operating voltage 2.3 V to 3.6 V and -40C to +105C industrial temperature range cover factory cabinet environments. The integrated 10-bit ADC supports bridge diagnostics (rail voltage, board temperature) without extra silicon.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור PIC32MX775F256LT-80V/BG — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | PIC32MX775F256L-80V/BG | PIC32MX775F256LT-80I/BG | PIC32MX764F128LT-I/BG | PIC32MX575F512LT-80I/BG |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10) | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 512 KB (+100%) |
| SRAM | 64 KB | 64 KB | 64 KB | 32 KB (-50%) | 64 KB |
| Max CPU Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Ethernet | 10/100 Mbit MAC | 10/100 Mbit MAC | 10/100 Mbit MAC | 10/100 Mbit MAC | None |
| CAN Modules | 2x CAN 2.0B | 2x CAN 2.0B | 2x CAN 2.0B | 0 (none) | 0 (none) |
| USB | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG |
| Operating Temperature | -40C to +105C (V) | -40C to +105C (V) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Packaging Format | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
מבדילים עיקריים
- Triple-connectivity on a single chip (לעומתPIC32MX575F512LT-80I/BG)
- Industrial temperature grade V (-40C to +105C) (לעומתPIC32MX775F256LT-80I/BG)
- 105 DMIPS performance at 80 MHz (לעומתPIC32MX764F128LT-I/BG)
- Dual independent CAN 2.0B modules (לעומתPIC32MX764F128LT-I/BG)
הערות תכנון
The 121-ball TFBGA package has 0.8 mm ball pitch, which requires via-in-pad PCB fabrication to route inner balls out without dog-bone traces. Use a 4-layer minimum stackup with a dedicated ground plane directly under the BGA to control impedance for the 50 MHz RMII Ethernet signals. Decoupling: place 100 nF X7R 0402 capacitors on every VDD ball pair (B1/B2 and adjacent), plus a 4.7 uF bulk cap within 5 mm of the package. Route USB D+/D- as a 90 ohm differential pair with length matching within 150 mil, and route Ethernet MII/RMII pairs with 50 ohm single-ended impedance.
Estimate: at 80 MHz with full Ethernet+USB+CAN activity, the core draws approximately 70 mA from VDD at 3.3 V, yielding ~230 mW of digital power dissipation. The MCU also draws ~25 mA from AVDD for the ADC and PHY biasing. Total supply current is ~95 mA. Use a low-noise LDO (e.g., MCP1700) for the analog AVDD rail to avoid coupling switching noise into ADC measurements; the digital VDD can use a switching regulator for efficiency. Add a 10 uF + 100 nF decoupling pair at every supply ball grouping.
The 121-ball TFBGA has a thermal resistance of approximately 32 C/W (theta_JA) on a 4-layer JEDEC test board. At the estimated 230 mW worst-case dissipation, the junction rises ~7C above ambient - well within the -40C to +105C industrial temperature range. No external heatsink is required for normal operation. For designs with the chip located near other heat sources (e.g., power regulators), provide adequate copper pours on top and inner layers tied to ground for additional heat spreading.
Do not leave the JTAG/TRACE pins floating - tie TRST low through a 10 kohm resistor to ground for normal operation, or to VDD only when JTAG is in use. The two CAN modules share clocking infrastructure - if you use only one CAN, tie the unused TX pin to ground via 10 kohm and leave RX unconnected per Microchip errata. For USB-OTG operation, the VBUS ball must be connected through a voltage divider (100k/20k) to sense USB host voltage; do not tie directly to VDD.
The 10/100 Ethernet MAC requires an external PHY (e.g., KSZ8041 for MII/RMII). For 100 Mbit operation, the REFCLK signal is 50 MHz and must be routed with controlled impedance; place a 33 ohm series termination resistor at the MAC TX pins if trace length exceeds 25 mm. The CAN bus signals (C1TX, C1RX) should be routed as a differential pair with 120 ohm characteristic impedance, with the bus termination resistor (120 ohm) placed only at the physical ends of the bus, not at intermediate nodes.
מידע על תאימות
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - the PIC32MX family is positioned for industrial, not automotive safety-critical ECUs. For AEC-Q100 variants, refer to the dsPIC33 or PIC32MX automotive product lines.
