10M04DAU324C8G vs 10M02DCU324A7G तुलना
विस्तृत दोनों ओर की तुलना 10M04DAU324C8G द्वारा Intel और 10M02DCU324A7G द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | 10M04DAU324C8G | 10M02DCU324A7G |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 4,000 | — |
| Embedded Memory | 193,536 bits | 110,592 bits |
| User I/O | 246 | — |
| पैकेज | 324-LFBGA | — |
| Package Code | U324 | — |
| Technology | 55 nm | — |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Ordering Part Number | 10M04DAU324C8G | — |
| Speed Grade | C8G | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| ऑपरेटिंग तापमान | [DATA_NEEDED: operating temperature range] | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| I/O Standard Support | [DATA_NEEDED: I/O standard support] | — |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | — |
| Timing Performance | [DATA_NEEDED: timing performance] | — |
| Embedded Multiplier Count | [DATA_NEEDED: embedded multiplier count] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Maximum User I/O | 246 | — |
| Ball Grid Package | 324 balls | — |
| Device Manufacturer | Intel / Altera | — |
| Logic Elements (LE) | — | 2,000 |
| User I/O Count | — | 160 |
| Embedded 18x18 Multipliers | — | 16 |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| User Flash Memory | — | Integrated (on-chip flash configuration) |
| Integrated ADC | — | 12-bit, 1 Msps+, successive approximation |
| Supply Voltage (VCCIO) | — | [DATA_NEEDED: VCCIO range] |
| ऑपरेटिंग जंक्शन तापमान | — | -40 C to +125 C (TJ) |
| Package Type | — | 324-UBGA (Ultra FineLine BGA) |
| Package Dimensions | — | 15 x 15 mm |
| Process Technology | — | 55 nm embedded flash (TSMC) |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: lead-free status] |