10M04DAU324C8G vs 10M02DCU324A7G Perbandingan
Perbandingan bersamaan detil 10M04DAU324C8G dari Intel dan 10M02DCU324A7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M04DAU324C8G | 10M02DCU324A7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 4,000 | — |
| Embedded Memory | 193,536 bits | 110,592 bits |
| User I/O | 246 | — |
| Paket | 324-LFBGA | — |
| Package Code | U324 | — |
| Technology | 55 nm | — |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Ordering Part Number | 10M04DAU324C8G | — |
| Speed Grade | C8G | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| I/O Standard Support | [DATA_NEEDED: I/O standard support] | — |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | — |
| Timing Performance | [DATA_NEEDED: timing performance] | — |
| Embedded Multiplier Count | [DATA_NEEDED: embedded multiplier count] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Maximum User I/O | 246 | — |
| Ball Grid Package | 324 balls | — |
| Device Manufacturer | Intel / Altera | — |
| Logic Elements (LE) | — | 2,000 |
| User I/O Count | — | 160 |
| Embedded 18x18 Multipliers | — | 16 |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| User Flash Memory | — | Integrated (on-chip flash configuration) |
| Integrated ADC | — | 12-bit, 1 Msps+, successive approximation |
| Supply Voltage (VCCIO) | — | [DATA_NEEDED: VCCIO range] |
| Suhu Hubung Kerja | — | -40 C to +125 C (TJ) |
| Package Type | — | 324-UBGA (Ultra FineLine BGA) |
| Package Dimensions | — | 15 x 15 mm |
| Process Technology | — | 55 nm embedded flash (TSMC) |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: lead-free status] |