10M04DAU324C8G vs 10M02DCU324A7G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10M04DAU324C8G sa pamamagitan ng Intel at 10M02DCU324A7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
10M04DAU324C8G 10M04DAU324C8G - 4K-LUT MAX 10 FPGA, 324-LFBGA | Intel

10M04DAU324C8G - 4K-LUT MAX 10 FPGA, 324-LFBGA | Intel

10M04DAU324C8G ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro 10M04DAU324C8G 10M02DCU324A7G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Type Field Programmable Gate Array (FPGA) —
Family MAX 10 MAX 10
Logic Elements 4,000 —
Embedded Memory 193,536 bits 110,592 bits
User I/O 246 —
Packhaging 324-LFBGA —
Package Code U324 —
Technology 55 nm —
Core Voltage 1.2 V 1.15 V to 1.25 V
Ordering Part Number 10M04DAU324C8G —
Speed Grade C8G —
Uri ng Pagpapasok Surface Mount Surface Mount
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] —
Temperature na Operasyon [DATA_NEEDED: operating temperature range] —
Configuration Method [DATA_NEEDED: configuration method] —
I/O Standard Support [DATA_NEEDED: I/O standard support] —
Supply Voltage Range [DATA_NEEDED: supply voltage range] —
Timing Performance [DATA_NEEDED: timing performance] —
Embedded Multiplier Count [DATA_NEEDED: embedded multiplier count] —
Transceiver Count [DATA_NEEDED: transceiver count] —
Maximum User I/O 246 —
Ball Grid Package 324 balls —
Device Manufacturer Intel / Altera —
Logic Elements (LE) — 2,000
User I/O Count — 160
Embedded 18x18 Multipliers — 16
PLLs — [DATA_NEEDED: PLL count]
Global Clock Networks — [DATA_NEEDED: global clock count]
User Flash Memory — Integrated (on-chip flash configuration)
Integrated ADC — 12-bit, 1 Msps+, successive approximation
Supply Voltage (VCCIO) — [DATA_NEEDED: VCCIO range]
Temperature ng Junction na Operasyon — -40 C to +125 C (TJ)
Package Type — 324-UBGA (Ultra FineLine BGA)
Package Dimensions — 15 x 15 mm
Process Technology — 55 nm embedded flash (TSMC)
Lead-Free / Halogen-Free — [DATA_NEEDED: lead-free status]

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