A3P600-FG484 vs A3P600L-FG484 तुलना
विस्तृत दोनों ओर की तुलना A3P600-FG484 द्वारा Microchip Technology और A3P600L-FG484 द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
A3P600-FG484 - ProASIC3 600K-Gate Flash FPGA, 484-BGA | Microchip
A3P600-FG484 ✓ सक्रियMicrochip Technology
A3P600L-FG484 - ProASIC3L Low Power FPGA 600K Gates | Microchip
A3P600L-FG484 ✓ सक्रियविशेषता तुलना
| पैरामीटर | A3P600-FG484 | A3P600L-FG484 |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | ProASIC3 (Flash FPGAs) | ProASIC3L (Flash FPGAs) |
| Total Gates | 600000 gates | — |
| Number of Registers | 13824 | — |
| VersaTiles (Logic Elements) | 13824 | — |
| Maximum User I/O | 235 I/O | — |
| System Performance | 231 MHz | — |
| Process Technology | 130 nm, 7-layer metal flash | — |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.14 V to 1.575 V |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Embedded Memory | Embedded block SRAM (18 kbit blocks) | — |
| Soft Processor Support | ARM Cortex-M1 (optional soft core) | — |
| पैकेज | 484-pin FBGA, 23x23 mm | 484-FBGA (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| ऑपरेटिंग तापमान | 0C to +85C (TJ) | 0C to +85C (TJ) |
| RoHS स्थिति | RoHS3 Compliant (lead-free per FGG variant) | Non-compliant (per Microchip USA listing) |
| Packaging | Tray | Tray |
| Programming | In-system programmable via JTAG, no external boot device | — |
| System Gates | — | 600000 |
| Logic Cells / CLBs | — | 13824 |
| Total RAM Bits | — | 110592 |
| User I/Os | — | 235 |
| Max Operating Frequency | — | 350 MHz (family rating) |
| Technology | — | CMOS, non-volatile flash based |
| Special Features | — | Flash*Freeze low-power standby technology |
| Configuration | — | Single-chip, on-chip flash (no external boot device) |
| Manufacturer Lead Time | — | 8 weeks |
| Product Status | — | Active |