A3P600-FG484 vs A3P600L-FG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600-FG484 sa pamamagitan ng Microchip Technology at A3P600L-FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P600-FG484 - ProASIC3 600K-Gate Flash FPGA, 484-BGA | Microchip
A3P600-FG484 ✓ NakahandaMicrochip Technology
A3P600L-FG484 - ProASIC3L Low Power FPGA 600K Gates | Microchip
A3P600L-FG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P600-FG484 | A3P600L-FG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 (Flash FPGAs) | ProASIC3L (Flash FPGAs) |
| Total Gates | 600000 gates | — |
| Number of Registers | 13824 | — |
| VersaTiles (Logic Elements) | 13824 | — |
| Maximum User I/O | 235 I/O | — |
| System Performance | 231 MHz | — |
| Process Technology | 130 nm, 7-layer metal flash | — |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.14 V to 1.575 V |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Embedded Memory | Embedded block SRAM (18 kbit blocks) | — |
| Soft Processor Support | ARM Cortex-M1 (optional soft core) | — |
| Packhaging | 484-pin FBGA, 23x23 mm | 484-FBGA (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0C to +85C (TJ) | 0C to +85C (TJ) |
| Tindminan RoHS | RoHS3 Compliant (lead-free per FGG variant) | Non-compliant (per Microchip USA listing) |
| Packaging | Tray | Tray |
| Programming | In-system programmable via JTAG, no external boot device | — |
| System Gates | — | 600000 |
| Logic Cells / CLBs | — | 13824 |
| Total RAM Bits | — | 110592 |
| User I/Os | — | 235 |
| Max Operating Frequency | — | 350 MHz (family rating) |
| Technology | — | CMOS, non-volatile flash based |
| Special Features | — | Flash*Freeze low-power standby technology |
| Configuration | — | Single-chip, on-chip flash (no external boot device) |
| Manufacturer Lead Time | — | 8 weeks |
| Product Status | — | Active |