EP2A25F672I6 vs EP2A25F672C9 तुलना
विस्तृत दोनों ओर की तुलना EP2A25F672I6 द्वारा Intel और EP2A25F672C9 द्वारा Altera. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2A25F672I6 | EP2A25F672C9 |
|---|---|---|
| ब्रांड | Intel | Altera |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | NRND |
| Family | APEX II | APEX II |
| Logic Elements (typical gates) | 25,000 | — |
| Fabric Architecture | SRAM-based LUT | — |
| Process Technology | 0.18 µm CMOS | 0.15 µm all-layer copper, up to 8 metal layers |
| पैकेज | 672-ball FineLine BGA (FBGA-672) | 672-ball FCBGA (FineLine BGA) |
| Core Voltage | 1.5 V | — |
| Configuration Method | External SRAM configuration device (EPC series) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) | — |
| Speed Grade | 6 | — |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM | ESBs for dual-port RAM, ROM, FIFO |
| DSP Blocks | MultiCore dedicated multipliers | — |
| Boundary Scan | JTAG (IEEE 1149.1) compliant | — |
| Clock Management | Dedicated PLL / clock tree circuitry | — |
| I/O Bank Count | [DATA_NEEDED: number of user I/O banks] | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| MSL स्तर | [DATA_NEEDED: moisture sensitivity level] | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LE) | — | Approximately 25,000 |
| Macro Cells | — | 2432 |
| User I/O | — | 492 |
| Package Dimensions | — | 27 mm x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Logic Family | — | CMOS |
| Propagation Delay | — | 1.69 ns |
| ऑपरेटिंग तापमान | — | 0°C to 85°C (Commercial) |
| सप्लाई वोल्टेज | — | [DATA_NEEDED: core VCC voltage] |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) |
| Configuration | — | Passive Serial, Passive Parallel Synchronous, JTAG |