EP2A25F672I6 vs EP2A25F672C9 比較
詳細並排比較 EP2A25F672I6 由 Intel 與 EP2A25F672C9 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2A25F672I6 | EP2A25F672C9 |
|---|---|---|
| 品牌 | Intel | Altera |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Family | APEX II | APEX II |
| Logic Elements (typical gates) | 25,000 | — |
| Fabric Architecture | SRAM-based LUT | — |
| Process Technology | 0.18 µm CMOS | 0.15 µm all-layer copper, up to 8 metal layers |
| 封裝 | 672-ball FineLine BGA (FBGA-672) | 672-ball FCBGA (FineLine BGA) |
| Core Voltage | 1.5 V | — |
| Configuration Method | External SRAM configuration device (EPC series) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) | — |
| Speed Grade | 6 | — |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM | ESBs for dual-port RAM, ROM, FIFO |
| DSP Blocks | MultiCore dedicated multipliers | — |
| Boundary Scan | JTAG (IEEE 1149.1) compliant | — |
| Clock Management | Dedicated PLL / clock tree circuitry | — |
| I/O Bank Count | [DATA_NEEDED: number of user I/O banks] | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| MSL 等級 | [DATA_NEEDED: moisture sensitivity level] | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LE) | — | Approximately 25,000 |
| Macro Cells | — | 2432 |
| User I/O | — | 492 |
| Package Dimensions | — | 27 mm x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Logic Family | — | CMOS |
| Propagation Delay | — | 1.69 ns |
| 工作溫度 | — | 0°C to 85°C (Commercial) |
| 供應電壓 | — | [DATA_NEEDED: core VCC voltage] |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) |
| Configuration | — | Passive Serial, Passive Parallel Synchronous, JTAG |