EP2A70F1508I-8 vs EP2A70F1508C9 तुलना
विस्तृत दोनों ओर की तुलना EP2A70F1508I-8 द्वारा Altera और EP2A70F1508C9 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ अंतिम खरीदविशेषता तुलना
| पैरामीटर | EP2A70F1508I-8 | EP2A70F1508C9 |
|---|---|---|
| ब्रांड | Altera | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | अंतिम बार खरीदें |
| Series | APEX II (EP2A) | APEX II |
| Logic Elements | 70,000 (approx.) | — |
| पैकेज | 1508-ball FineLine BGA (FBGA-1508) | — |
| ऑपरेटिंग तापमान | -40C to +100C (Industrial) | 0 °C to 85 °C |
| Speed Grade | -8 | C9 |
| Configuration Memory | SRAM-based | — |
| Configuration Modes | PS, PPS, PPA, JTAG | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI | — |
| Embedded System Blocks (ESBs) | Yes (RAM/ROM/CAM) | — |
| On-chip PLLs | Yes | — |
| सप्लाई वोल्टेज | 1.8 V core (typical APEX II) | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| MSL स्तर | 3 | [DATA_NEEDED: MSL level] |
| Peak Reflow Temperature | 220 C | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-free | [DATA_NEEDED: lead-free status] | — |
| MultiCore Interconnect | Yes | — |
| Design Software | Quartus II (APEX II support up to v13.0) | — |
| Family | — | APEX II FPGA |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements / Cells | — | 67,200 |
| Total RAM Bits | — | 1,146,880 |
| Number of I/O | — | 1,060 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: number of LABs] |
| Number of PLLs | — | 4 |
| Number of Gates | — | [DATA_NEEDED: typical gate count] |
| Voltage - Supply (Core) | — | 1.425 V to 1.575 V |
| पैकेज / केस | — | 1508-BBGA, FCBGA |
| Supplier Device Package | — | 1508-FBGA (40 × 40 mm) |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | — | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport |
| Embedded Multiplier Blocks | — | Yes |
| Embedded Memory Type | — | Dual-port RAM (ESB) / ROM / FIFO |