EP2A70F1508I-8 vs EP2A70F1508C9 Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP2A70F1508I-8 tarafından Altera ve EP2A70F1508C9 tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | EP2A70F1508I-8 | EP2A70F1508C9 |
|---|---|---|
| Marka | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | NRND | Son Alış Zamanı |
| Series | APEX II (EP2A) | APEX II |
| Logic Elements | 70,000 (approx.) | — |
| Paket | 1508-ball FineLine BGA (FBGA-1508) | — |
| İşletim Sıcaklığı | -40C to +100C (Industrial) | 0 °C to 85 °C |
| Speed Grade | -8 | C9 |
| Configuration Memory | SRAM-based | — |
| Configuration Modes | PS, PPS, PPA, JTAG | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI | — |
| Embedded System Blocks (ESBs) | Yes (RAM/ROM/CAM) | — |
| On-chip PLLs | Yes | — |
| Besleme Gerilimi | 1.8 V core (typical APEX II) | — |
| Montaj Türü | Surface Mount (BGA) | Surface Mount |
| MSL Seviyesi | 3 | [DATA_NEEDED: MSL level] |
| Peak Reflow Temperature | 220 C | — |
| RoHS Durumu | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-free | [DATA_NEEDED: lead-free status] | — |
| MultiCore Interconnect | Yes | — |
| Design Software | Quartus II (APEX II support up to v13.0) | — |
| Family | — | APEX II FPGA |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements / Cells | — | 67,200 |
| Total RAM Bits | — | 1,146,880 |
| Number of I/O | — | 1,060 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: number of LABs] |
| Number of PLLs | — | 4 |
| Number of Gates | — | [DATA_NEEDED: typical gate count] |
| Voltage - Supply (Core) | — | 1.425 V to 1.575 V |
| Paket / Kas | — | 1508-BBGA, FCBGA |
| Supplier Device Package | — | 1508-FBGA (40 × 40 mm) |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | — | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport |
| Embedded Multiplier Blocks | — | Yes |
| Embedded Memory Type | — | Dual-port RAM (ESB) / ROM / FIFO |