EP2A70F1508I-8 vs EP2A70F1508C9 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A70F1508I-8 sa pamamagitan ng Altera at EP2A70F1508C9 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2A70F1508I-8 | EP2A70F1508C9 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Series | APEX II (EP2A) | APEX II |
| Logic Elements | 70,000 (approx.) | — |
| Packhaging | 1508-ball FineLine BGA (FBGA-1508) | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0 °C to 85 °C |
| Speed Grade | -8 | C9 |
| Configuration Memory | SRAM-based | — |
| Configuration Modes | PS, PPS, PPA, JTAG | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI | — |
| Embedded System Blocks (ESBs) | Yes (RAM/ROM/CAM) | — |
| On-chip PLLs | Yes | — |
| Volte ng Pagbibigay | 1.8 V core (typical APEX II) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | 3 | [DATA_NEEDED: MSL level] |
| Peak Reflow Temperature | 220 C | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-free | [DATA_NEEDED: lead-free status] | — |
| MultiCore Interconnect | Yes | — |
| Design Software | Quartus II (APEX II support up to v13.0) | — |
| Family | — | APEX II FPGA |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements / Cells | — | 67,200 |
| Total RAM Bits | — | 1,146,880 |
| Number of I/O | — | 1,060 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: number of LABs] |
| Number of PLLs | — | 4 |
| Number of Gates | — | [DATA_NEEDED: typical gate count] |
| Voltage - Supply (Core) | — | 1.425 V to 1.575 V |
| Packhaging / Kaso | — | 1508-BBGA, FCBGA |
| Supplier Device Package | — | 1508-FBGA (40 × 40 mm) |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | — | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport |
| Embedded Multiplier Blocks | — | Yes |
| Embedded Memory Type | — | Dual-port RAM (ESB) / ROM / FIFO |