EP2AGZ350HF40C3N vs EP2AGZ350HF40C4G तुलना
विस्तृत दोनों ओर की तुलना EP2AGZ350HF40C3N द्वारा Intel और EP2AGZ350HF40C4G द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2AGZ350HF40C3N | EP2AGZ350HF40C4G |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 534 (18x18 multipliers) |
| Transceivers | Up to 24 (per family datasheet) | [DATA_NEEDED: transceiver channel count for HF40 package] |
| Transceiver Data Rate | Up to 6.553 Gbps | up to 3.125 Gbps |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | — |
| पैकेज | 1517-ball FCBGA (HF40) | FBGA-1517 (HF40) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| माउंटिंग प्रकार | Surface Mount (flip-chip BGA) | — |
| Logic Elements (LE) | — | 350,000 |
| Embedded Memory (bits) | — | 20,480 Kbits |
| User Accessible RAM (bits) | — | 4.7 Mbits |
| PLLs | — | 8 (fractional) |
| Maximum User I/O | — | 606 |
| Hard Memory Controllers | — | Yes (DDR3, DDR2, QDR) |
| Hard PCIe Gen2 Endpoint | — | Yes |
| Process Node | — | 40 nm |
| Pitch | — | 1.0 mm |
| Speed Grade | — | 4 |
| ऑपरेटिंग तापमान | — | 0C to +85C (Commercial) |
| Lead-Free / RoHS | — | Lead-Free / RoHS Compliant |
| Configuration Modes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |