EP2AGZ350HF40C3N vs EP2AGZ350HF40C4G Perbandingan
Perbandingan bersamaan detil EP2AGZ350HF40C3N dari Intel dan EP2AGZ350HF40C4G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ350HF40C3N | EP2AGZ350HF40C4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 534 (18x18 multipliers) |
| Transceivers | Up to 24 (per family datasheet) | [DATA_NEEDED: transceiver channel count for HF40 package] |
| Transceiver Data Rate | Up to 6.553 Gbps | up to 3.125 Gbps |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | — |
| Paket | 1517-ball FCBGA (HF40) | FBGA-1517 (HF40) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Tipe Mounting | Surface Mount (flip-chip BGA) | — |
| Logic Elements (LE) | — | 350,000 |
| Embedded Memory (bits) | — | 20,480 Kbits |
| User Accessible RAM (bits) | — | 4.7 Mbits |
| PLLs | — | 8 (fractional) |
| Maximum User I/O | — | 606 |
| Hard Memory Controllers | — | Yes (DDR3, DDR2, QDR) |
| Hard PCIe Gen2 Endpoint | — | Yes |
| Process Node | — | 40 nm |
| Pitch | — | 1.0 mm |
| Speed Grade | — | 4 |
| Suhu Kerja | — | 0C to +85C (Commercial) |
| Lead-Free / RoHS | — | Lead-Free / RoHS Compliant |
| Configuration Modes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |