EP2AGZ350HF40C3N vs EP2AGZ350HF40C4G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ350HF40C3N disebabkan oleh Intel dan EP2AGZ350HF40C4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ350HF40C3N | EP2AGZ350HF40C4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 534 (18x18 multipliers) |
| Transceivers | Up to 24 (per family datasheet) | [DATA_NEEDED: transceiver channel count for HF40 package] |
| Transceiver Data Rate | Up to 6.553 Gbps | up to 3.125 Gbps |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | — |
| Kemasan | 1517-ball FCBGA (HF40) | FBGA-1517 (HF40) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | — |
| Logic Elements (LE) | — | 350,000 |
| Embedded Memory (bits) | — | 20,480 Kbits |
| User Accessible RAM (bits) | — | 4.7 Mbits |
| PLLs | — | 8 (fractional) |
| Maximum User I/O | — | 606 |
| Hard Memory Controllers | — | Yes (DDR3, DDR2, QDR) |
| Hard PCIe Gen2 Endpoint | — | Yes |
| Process Node | — | 40 nm |
| Pitch | — | 1.0 mm |
| Speed Grade | — | 4 |
| Suhu Operasi | — | 0C to +85C (Commercial) |
| Lead-Free / RoHS | — | Lead-Free / RoHS Compliant |
| Configuration Modes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |