EP2AGZ350HF40C3N vs EP2AGZ350HF40C4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350HF40C3N sa pamamagitan ng Intel at EP2AGZ350HF40C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350HF40C3N | EP2AGZ350HF40C4G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 534 (18x18 multipliers) |
| Transceivers | Up to 24 (per family datasheet) | [DATA_NEEDED: transceiver channel count for HF40 package] |
| Transceiver Data Rate | Up to 6.553 Gbps | up to 3.125 Gbps |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | — |
| Packhaging | 1517-ball FCBGA (HF40) | FBGA-1517 (HF40) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | — |
| Logic Elements (LE) | — | 350,000 |
| Embedded Memory (bits) | — | 20,480 Kbits |
| User Accessible RAM (bits) | — | 4.7 Mbits |
| PLLs | — | 8 (fractional) |
| Maximum User I/O | — | 606 |
| Hard Memory Controllers | — | Yes (DDR3, DDR2, QDR) |
| Hard PCIe Gen2 Endpoint | — | Yes |
| Process Node | — | 40 nm |
| Pitch | — | 1.0 mm |
| Speed Grade | — | 4 |
| Temperature na Operasyon | — | 0C to +85C (Commercial) |
| Lead-Free / RoHS | — | Lead-Free / RoHS Compliant |
| Configuration Modes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |