EP2C8F256I8N vs EP2C8F256I6N तुलना
विस्तृत दोनों ओर की तुलना EP2C8F256I8N द्वारा Intel और EP2C8F256I6N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2C8F256I8N | EP2C8F256I6N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | NRND |
| Series | Cyclone II | — |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | — |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | — |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | 1.2 V (1.15 V min, 1.25 V max) |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm CMOS |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| ऑपरेटिंग तापमान | -40C to +85C (industrial) | — |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| RoHS स्थिति | Compliant (Pb-free, lead-free reflow compatible) | Lead-free / RoHS compliant (N suffix) |
| माउंटिंग प्रकार | Surface Mount (BGA) | — |
| Family | — | Cyclone II |
| Logic Elements | — | 8,256 |
| Logic Array Blocks (LABs) | — | 540 |
| Embedded Memory (M4K blocks) | — | 165,888 bits |
| Embedded 18 x 18 Multipliers | — | 36 |
| Maximum User I/O Pins | — | 182 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Maximum Internal Clock Frequency | — | 402.58 MHz |
| Speed Grade | — | 6 |
| Operating Temperature (Industrial) | — | -40 C to +100 C (Tj) |
| पैकेज | — | 256-ball FineLine BGA (FBGA-256), 1.00 mm pitch |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS) |