EP2C8F256I8N vs EP2C8F256I6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2C8F256I8N disebabkan oleh Intel dan EP2C8F256I6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2C8F256I8N | EP2C8F256I6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Cyclone II | — |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | — |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | — |
| PLLs | 2 | — |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | 1.2 V (1.15 V min, 1.25 V max) |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm CMOS |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Suhu Operasi | -40C to +85C (industrial) | — |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| Status RoHS | Compliant (Pb-free, lead-free reflow compatible) | Lead-free / RoHS compliant (N suffix) |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Family | — | Cyclone II |
| Logic Elements | — | 8,256 |
| Logic Array Blocks (LABs) | — | 540 |
| Embedded Memory (M4K blocks) | — | 165,888 bits |
| Embedded 18 x 18 Multipliers | — | 36 |
| Maximum User I/O Pins | — | 182 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Maximum Internal Clock Frequency | — | 402.58 MHz |
| Speed Grade | — | 6 |
| Operating Temperature (Industrial) | — | -40 C to +100 C (Tj) |
| Kemasan | — | 256-ball FineLine BGA (FBGA-256), 1.00 mm pitch |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS) |