EP2SGX30CF780C6 vs EP2SGX30CF780C7 तुलना
विस्तृत दोनों ओर की तुलना EP2SGX30CF780C6 द्वारा Intel और EP2SGX30CF780C7 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2SGX30CF780C6 | EP2SGX30CF780C7 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | NRND |
| Family | Stratix II GX | — |
| Series | EP2SGX | Stratix II GX |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | — |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | 600 Mbps to 3.125 Gbps |
| पैकेज | 780-ball FineLine BGA (F780) | 780-ball FineLine BGA (CF780) |
| Speed Grade | C6 (commercial, mid-speed) | C7 (fastest commercial) |
| ऑपरेटिंग तापमान | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | 90 nm |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | Compliant (lead-free Fineline BGA) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements | — | 33,000 |
| Embedded Memory | — | 1.9 Mbits |
| DSP Blocks (18x18 multipliers) | — | 256 |
| Maximum User I/O | — | 361 |
| Multi-Gigabit Transceivers | — | 4 channels |
| PLLs | — | 4 |
| Ball Pitch | — | 1.0 mm |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG |