EP2SGX30CF780C6 vs EP2SGX30CF780C7 Perbandingan
Perbandingan bersamaan detil EP2SGX30CF780C6 dari Intel dan EP2SGX30CF780C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX30CF780C6 | EP2SGX30CF780C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix II GX | — |
| Series | EP2SGX | Stratix II GX |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | — |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | 600 Mbps to 3.125 Gbps |
| Paket | 780-ball FineLine BGA (F780) | 780-ball FineLine BGA (CF780) |
| Speed Grade | C6 (commercial, mid-speed) | C7 (fastest commercial) |
| Suhu Kerja | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | 90 nm |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free Fineline BGA) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements | — | 33,000 |
| Embedded Memory | — | 1.9 Mbits |
| DSP Blocks (18x18 multipliers) | — | 256 |
| Maximum User I/O | — | 361 |
| Multi-Gigabit Transceivers | — | 4 channels |
| PLLs | — | 4 |
| Ball Pitch | — | 1.0 mm |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG |