EP2SGX30CF780C6 vs EP2SGX30CF780C7 比較
詳細並排比較 EP2SGX30CF780C6 由 Intel 與 EP2SGX30CF780C7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2SGX30CF780C6 | EP2SGX30CF780C7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Family | Stratix II GX | — |
| Series | EP2SGX | Stratix II GX |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | — |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | 600 Mbps to 3.125 Gbps |
| 封裝 | 780-ball FineLine BGA (F780) | 780-ball FineLine BGA (CF780) |
| Speed Grade | C6 (commercial, mid-speed) | C7 (fastest commercial) |
| 工作溫度 | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | 90 nm |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant (lead-free Fineline BGA) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements | — | 33,000 |
| Embedded Memory | — | 1.9 Mbits |
| DSP Blocks (18x18 multipliers) | — | 256 |
| Maximum User I/O | — | 361 |
| Multi-Gigabit Transceivers | — | 4 channels |
| PLLs | — | 4 |
| Ball Pitch | — | 1.0 mm |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG |