EP2SGX60DF780C3 vs EP2SGX60DF780C4 तुलना
विस्तृत दोनों ओर की तुलना EP2SGX60DF780C3 द्वारा Intel और EP2SGX60DF780C4 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2SGX60DF780C3 | EP2SGX60DF780C4 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | NRND |
| Family | Stratix II GX | — |
| Series | Stratix II | — |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | — |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Internal Frequency (max) | ~717 MHz | — |
| पैकेज | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | 4 (C4) |
| RoHS स्थिति | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | Compliant |
| Device Family | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 |
| User I/O Count | — | 364 |
| Maximum Internal Frequency | — | 717 MHz |
| Transceiver Channels | — | [DATA_NEEDED: exact transceiver count and data rate] |
| Number of CLBs | — | 60,440 |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | 780-ball FC-FBGA |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Commercial (C) |