EP2SGX60DF780C3 vs EP2SGX60DF780C4 Perbandingan
Perbandingan bersamaan detil EP2SGX60DF780C3 dari Intel dan EP2SGX60DF780C4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX60DF780C3 | EP2SGX60DF780C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | Stratix II GX | — |
| Series | Stratix II | — |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | — |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Internal Frequency (max) | ~717 MHz | — |
| Paket | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | 4 (C4) |
| Status RoHS | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | Compliant |
| Device Family | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 |
| User I/O Count | — | 364 |
| Maximum Internal Frequency | — | 717 MHz |
| Transceiver Channels | — | [DATA_NEEDED: exact transceiver count and data rate] |
| Number of CLBs | — | 60,440 |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | 780-ball FC-FBGA |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Commercial (C) |