EP3C55F484I7 vs EP3C80F484I7 तुलना
विस्तृत दोनों ओर की तुलना EP3C55F484I7 द्वारा Intel और EP3C80F484I7 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3C55F484I7 | EP3C80F484I7 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Series | Cyclone III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Logic Elements / Cells | 55,856 | — |
| Adaptive Logic Modules (ALMs) | 3,491 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of I/O | 327 | — |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) | — |
| Number of Logic Blocks / CLBs | 55856 | — |
| Embedded Multipliers (18 × 18) | 156 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Internal Maximum Frequency | 472.5 MHz | — |
| Core Voltage | 1.2 V | 1.2 V |
| ऑपरेटिंग तापमान | -40 °C to +100 °C (Industrial grade, I-suffix) | -40C to +100C (Industrial grade, "I7" suffix) |
| पैकेज | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS स्थिति | Lead-Free, RoHS Compliant | Compliant |
| MSL स्तर | [DATA_NEEDED: MSL moisture sensitivity level] | 3 (per JEDEC J-STD-020) |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) | 65 nm low-power CMOS |
| Logic Elements | — | 81,264 |
| Logic Array Blocks (LABs) | — | 5,079 |
| Total RAM Bits | — | 2,810,880 |
| M9K Memory Blocks | — | 244 |
| Embedded Multipliers (18x18) | — | 305 |
| Phase-Locked Loops (PLLs) | — | 4 |
| User I/Os | — | 295 |
| Internal Operating Frequency | — | Up to 472 MHz |
| Lead-Free | — | Yes |