EP3C55F484I7 vs EP3C80F484I7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C55F484I7 disebabkan oleh Intel dan EP3C80F484I7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C55F484I7 | EP3C80F484I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Logic Elements / Cells | 55,856 | — |
| Adaptive Logic Modules (ALMs) | 3,491 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of I/O | 327 | — |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) | — |
| Number of Logic Blocks / CLBs | 55856 | — |
| Embedded Multipliers (18 × 18) | 156 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Internal Maximum Frequency | 472.5 MHz | — |
| Core Voltage | 1.2 V | 1.2 V |
| Suhu Operasi | -40 °C to +100 °C (Industrial grade, I-suffix) | -40C to +100C (Industrial grade, "I7" suffix) |
| Kemasan | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Lead-Free, RoHS Compliant | Compliant |
| Aras MSL | [DATA_NEEDED: MSL moisture sensitivity level] | 3 (per JEDEC J-STD-020) |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) | 65 nm low-power CMOS |
| Logic Elements | — | 81,264 |
| Logic Array Blocks (LABs) | — | 5,079 |
| Total RAM Bits | — | 2,810,880 |
| M9K Memory Blocks | — | 244 |
| Embedded Multipliers (18x18) | — | 305 |
| Phase-Locked Loops (PLLs) | — | 4 |
| User I/Os | — | 295 |
| Internal Operating Frequency | — | Up to 472 MHz |
| Lead-Free | — | Yes |