EP3C55F484I7 vs EP3C80F484I7 Perbandingan
Perbandingan bersamaan detil EP3C55F484I7 dari Intel dan EP3C80F484I7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55F484I7 | EP3C80F484I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Logic Elements / Cells | 55,856 | — |
| Adaptive Logic Modules (ALMs) | 3,491 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of I/O | 327 | — |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) | — |
| Number of Logic Blocks / CLBs | 55856 | — |
| Embedded Multipliers (18 × 18) | 156 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Internal Maximum Frequency | 472.5 MHz | — |
| Core Voltage | 1.2 V | 1.2 V |
| Suhu Kerja | -40 °C to +100 °C (Industrial grade, I-suffix) | -40C to +100C (Industrial grade, "I7" suffix) |
| Paket | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Lead-Free, RoHS Compliant | Compliant |
| Level MSL | [DATA_NEEDED: MSL moisture sensitivity level] | 3 (per JEDEC J-STD-020) |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) | 65 nm low-power CMOS |
| Logic Elements | — | 81,264 |
| Logic Array Blocks (LABs) | — | 5,079 |
| Total RAM Bits | — | 2,810,880 |
| M9K Memory Blocks | — | 244 |
| Embedded Multipliers (18x18) | — | 305 |
| Phase-Locked Loops (PLLs) | — | 4 |
| User I/Os | — | 295 |
| Internal Operating Frequency | — | Up to 472 MHz |
| Lead-Free | — | Yes |