EP3C55F484I7 vs EP3C80F484I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F484I7 sa pamamagitan ng Intel at EP3C80F484I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F484I7 | EP3C80F484I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Logic Elements / Cells | 55,856 | — |
| Adaptive Logic Modules (ALMs) | 3,491 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of I/O | 327 | — |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) | — |
| Number of Logic Blocks / CLBs | 55856 | — |
| Embedded Multipliers (18 × 18) | 156 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Internal Maximum Frequency | 472.5 MHz | — |
| Core Voltage | 1.2 V | 1.2 V |
| Temperature na Operasyon | -40 °C to +100 °C (Industrial grade, I-suffix) | -40C to +100C (Industrial grade, "I7" suffix) |
| Packhaging | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Lead-Free, RoHS Compliant | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL moisture sensitivity level] | 3 (per JEDEC J-STD-020) |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) | 65 nm low-power CMOS |
| Logic Elements | — | 81,264 |
| Logic Array Blocks (LABs) | — | 5,079 |
| Total RAM Bits | — | 2,810,880 |
| M9K Memory Blocks | — | 244 |
| Embedded Multipliers (18x18) | — | 305 |
| Phase-Locked Loops (PLLs) | — | 4 |
| User I/Os | — | 295 |
| Internal Operating Frequency | — | Up to 472 MHz |
| Lead-Free | — | Yes |