EP3SE260F1152I3G vs EP3SE260F1152C3 तुलना
विस्तृत दोनों ओर की तुलना EP3SE260F1152I3G द्वारा Intel और EP3SE260F1152C3 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3SE260F1152I3G | EP3SE260F1152C3 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | अंतिम बार खरीदें |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory Bits | 16,672,640 bits | — |
| Embedded Memory Bits (alternate) | 20,880 Kb (16,672,640 / 1024) | — |
| User I/O Count | 744 | — |
| पैकेज | 1152-BBGA, FCBGA (FineLine BGA) | 1152-ball FCBGA (Flip-Chip BGA) |
| ऑपरेटिंग तापमान रेंज | -40C to +100C (Industrial) | — |
| Speed Grade | I3 (Industrial, balanced) | C3 |
| Process Technology | 40 nm TSMC low-power | 40 nm |
| Supply Voltage Core | 0.9 V (typical, see handbook) | — |
| Configuration Bitstream Encryption | AES-256 (Stratix III feature) | — |
| I/O Standards Supported | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| RoHS स्थिति | [DATA_NEEDED: RoHS compliance not stated in scraped data] | Compliant |
| नमी संवेदनशीलता स्तर (MSL) | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Lead-Free Reflow | [DATA_NEEDED: peak reflow temperature] | — |
| Design Toolchain | Quartus II / Quartus Prime | — |
| Country of Origin / Distribution | Multiple authorized distributors (DigiKey, Mouser) | — |
| Logic Elements | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/Os | — | 744 |
| Embedded 18x18 Multipliers | — | 384 |
| Core Voltage | — | 0.9 V to 1.1 V |
| ऑपरेटिंग तापमान | — | 0C to +85C (Commercial) |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | 12 |