EP3SE260F1152I3G vs EP3SE260F1152C3 Perbandingan

Perbandingan bersamaan detil EP3SE260F1152I3G dari Intel dan EP3SE260F1152C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE260F1152C3 EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152I3G EP3SE260F1152C3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Waktu Pembelian Terakhir
Series Stratix III E Stratix III E
Family Stratix III —
Logic Elements (LE) 255,000 —
Embedded Memory Bits 16,672,640 bits —
Embedded Memory Bits (alternate) 20,880 Kb (16,672,640 / 1024) —
User I/O Count 744 —
Paket 1152-BBGA, FCBGA (FineLine BGA) 1152-ball FCBGA (Flip-Chip BGA)
Rentang Suhu Kerja -40C to +100C (Industrial) —
Speed Grade I3 (Industrial, balanced) C3
Process Technology 40 nm TSMC low-power 40 nm
Supply Voltage Core 0.9 V (typical, see handbook) —
Configuration Bitstream Encryption AES-256 (Stratix III feature) —
I/O Standards Supported LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X —
Tipe Mounting Surface Mount (BGA) Surface Mount
Status RoHS [DATA_NEEDED: RoHS compliance not stated in scraped data] Compliant
Tingkat Sensitivitas Kekeringan (MSL) [DATA_NEEDED: MSL rating per JEDEC J-STD-020] —
Lead-Free Reflow [DATA_NEEDED: peak reflow temperature] —
Design Toolchain Quartus II / Quartus Prime —
Country of Origin / Distribution Multiple authorized distributors (DigiKey, Mouser) —
Logic Elements — 255,000
Embedded Memory (bits) — 16,672,768
Logic Array Blocks (LABs) — 10,200
User I/Os — 744
Embedded 18x18 Multipliers — 384
Core Voltage — 0.9 V to 1.1 V
Suhu Kerja — 0C to +85C (Commercial)
Configuration Method — Passive Serial / Fast Passive Parallel / JTAG
PLLs — 12

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