EP3SL200H780I4LN vs EP3SL200H780C3N तुलना
विस्तृत दोनों ओर की तुलना EP3SL200H780I4LN द्वारा Altera और EP3SL200H780C3N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3SL200H780I4LN | EP3SL200H780C3N |
|---|---|---|
| ब्रांड | Altera | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | NRND |
| Series | Stratix III L | — |
| Family | Stratix III L (Low-Power) | Stratix III L (low-power) |
| Manufacturer | Intel / Altera (now Intel PSG) | — |
| Number of Logic Elements / Cells | 200,000 | — |
| Number of LABs / CLBs | 8,000 | — |
| Total RAM Bits | 10,901,504 (approximately 10.9 Mbit) | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 0.9 V core (selectable Vcore) | — |
| ऑपरेटिंग तापमान | -40C to +100C (industrial) | 0C to +85C (commercial) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| पैकेज / केस | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Process Technology | 65 nm CMOS | — |
| Speed Grade | I4 (Industrial, mid-speed grade) | C3 (commercial, -3 speed) |
| RoHS स्थिति | RoHS Compliant (lead-free) | — |
| MSL स्तर | MSL 3 (168 Hours, per JEDEC J-STD-020) | 3 |
| Roaming Pin Name Suffix | LN = lead-free, industrial temp, H780 780-ball package | — |
| Process Node | — | 40 nm |
| Logic Elements | — | 200,000 |
| Embedded Memory Bits | — | 10,901,504 bits |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| पैकेज | — | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Maximum Internal Clock Frequency | — | 800 MHz |
| Transceivers | — | 24 channels, up to 3.75 Gbps |
| DSP Blocks | — | 384 |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| Lead-Free / RoHS | — | Yes |
| Mounting Pitch | — | 1.0 mm ball pitch |
| PLLs | — | 12 (Stratix III PLL array) |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |