EP3SL200H780I4LN vs EP3SL200H780C3N Perbandingan
Perbandingan bersamaan detil EP3SL200H780I4LN dari Altera dan EP3SL200H780C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780I4LN | EP3SL200H780C3N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III L | — |
| Family | Stratix III L (Low-Power) | Stratix III L (low-power) |
| Manufacturer | Intel / Altera (now Intel PSG) | — |
| Number of Logic Elements / Cells | 200,000 | — |
| Number of LABs / CLBs | 8,000 | — |
| Total RAM Bits | 10,901,504 (approximately 10.9 Mbit) | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 0.9 V core (selectable Vcore) | — |
| Suhu Kerja | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Paket / Case | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Process Technology | 65 nm CMOS | — |
| Speed Grade | I4 (Industrial, mid-speed grade) | C3 (commercial, -3 speed) |
| Status RoHS | RoHS Compliant (lead-free) | — |
| Level MSL | MSL 3 (168 Hours, per JEDEC J-STD-020) | 3 |
| Roaming Pin Name Suffix | LN = lead-free, industrial temp, H780 780-ball package | — |
| Process Node | — | 40 nm |
| Logic Elements | — | 200,000 |
| Embedded Memory Bits | — | 10,901,504 bits |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| Paket | — | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Maximum Internal Clock Frequency | — | 800 MHz |
| Transceivers | — | 24 channels, up to 3.75 Gbps |
| DSP Blocks | — | 384 |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| Lead-Free / RoHS | — | Yes |
| Mounting Pitch | — | 1.0 mm ball pitch |
| PLLs | — | 12 (Stratix III PLL array) |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |