MPC8321CVRAFDCA557 vs MPC8321CVRADDC तुलना
विस्तृत दोनों ओर की तुलना MPC8321CVRAFDCA557 द्वारा NXP Semiconductors और MPC8321CVRADDC द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MPC8321CVRAFDCA557 - 333MHz PowerQUICC II Pro MPU | NXP | 516-PBGA
MPC8321CVRAFDCA557 ✓ सक्रियNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ सक्रियविशेषता तुलना
| पैरामीटर | MPC8321CVRAFDCA557 | MPC8321CVRADDC |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II Pro, MPC83xx | — |
| Core | e300c2 (MPC603e-based) PowerPC | PowerPC e300c2 |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Core Frequency | 333 MHz | — |
| Number of Cores | 1 | 1 |
| Core Voltage | 950 mV to 1.05 V | — |
| I/O Voltage | 3.0 V to 3.6 V | — |
| ऑपरेटिंग तापमान | -40 °C to +105 °C | — |
| पैकेज | 516-PBGA (27x27 mm) | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Memory Controller | DDR1 / DDR2 (16-bit ECC supported) | — |
| Integrated Peripheral Set | PCI 2.3, USB 2.0 (Host/Device), 8x UART, QUICC Engine, Security Engine | — |
| Ethernet | QUICC Engine (multi-protocol: Ethernet, HDLC, ATM) | — |
| Family Prefix (suffix decoding) | CVR = standard; AFD = 333 MHz / 0F lead-free; CA = 516-PBGA; 557 = specific die/firmware mask | — |
| Compliance | RoHS - check suffix code | — |
| Lead-Free / Pb-Free | Suffix-dependent (557/AFD variants lead-free) | — |
| MSL / Reflow | BGA-specific, per JEDEC J-STD-020 | — |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core Clock Speed | — | 266 MHz |
| Process Technology | — | 90 nm CMOS |
| सप्लाई वोल्टेज | — | 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 mm x 27 mm |
| ऑपरेटिंग तापमान रेंज | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Integrated Peripherals | — | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| RoHS स्थिति | — | [DATA_NEEDED: RoHS compliance status] |
| Encryption / SEC Block | — | Not included (non-E variant) |