MPC8321CVRAFDCA557 vs MPC8321CVRADDC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8321CVRAFDCA557 disebabkan oleh NXP Semiconductors dan MPC8321CVRADDC disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8321CVRAFDCA557 - 333MHz PowerQUICC II Pro MPU | NXP | 516-PBGA
MPC8321CVRAFDCA557 ✓ AktifNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ AktifPengandingan Spesifikasi
| Parametr | MPC8321CVRAFDCA557 | MPC8321CVRADDC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II Pro, MPC83xx | — |
| Core | e300c2 (MPC603e-based) PowerPC | PowerPC e300c2 |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Core Frequency | 333 MHz | — |
| Number of Cores | 1 | 1 |
| Core Voltage | 950 mV to 1.05 V | — |
| I/O Voltage | 3.0 V to 3.6 V | — |
| Suhu Operasi | -40 °C to +105 °C | — |
| Kemasan | 516-PBGA (27x27 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Memory Controller | DDR1 / DDR2 (16-bit ECC supported) | — |
| Integrated Peripheral Set | PCI 2.3, USB 2.0 (Host/Device), 8x UART, QUICC Engine, Security Engine | — |
| Ethernet | QUICC Engine (multi-protocol: Ethernet, HDLC, ATM) | — |
| Family Prefix (suffix decoding) | CVR = standard; AFD = 333 MHz / 0F lead-free; CA = 516-PBGA; 557 = specific die/firmware mask | — |
| Compliance | RoHS - check suffix code | — |
| Lead-Free / Pb-Free | Suffix-dependent (557/AFD variants lead-free) | — |
| MSL / Reflow | BGA-specific, per JEDEC J-STD-020 | — |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core Clock Speed | — | 266 MHz |
| Process Technology | — | 90 nm CMOS |
| Tegangan Pemberi Arus | — | 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 mm x 27 mm |
| Gambaran Suhu Operasi | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Integrated Peripherals | — | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance status] |
| Encryption / SEC Block | — | Not included (non-E variant) |