MPC860PCZQ50D4 vs MPC860TCVR50D4 तुलना
विस्तृत दोनों ओर की तुलना MPC860PCZQ50D4 द्वारा NXP Semiconductors और MPC860TCVR50D4 द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP
MPC860PCZQ50D4 ✗ जीवन की समाप्तिNXP Semiconductors
MPC860TCVR50D4 - 50MHz 32-Bit PowerQUICC MPU | NXP
MPC860TCVR50D4 ✗ जीवन की समाप्तिविशेषता तुलना
| पैरामीटर | MPC860PCZQ50D4 | MPC860TCVR50D4 |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | उत्पादन बंद | उत्पादन बंद |
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU | MPC8xx PowerQUICC 32-bit microprocessor |
| Core Architecture | PowerPC 603 (32-bit, no FPU) | — |
| Core Frequency | 50 MHz | — |
| Number of Cores | 1 (CPU + CPM RISC engine) | — |
| Operating Voltage - I/O | 3.3 V | — |
| Internal Core Voltage | 2.2 V or 1.8 V (selection required) | — |
| Process Technology | 0.32 micron CMOS | 0.32 micrometer |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| MMU | Yes (32-bit virtual addressing) | — |
| On-chip Ethernet MAC | 2x 10/100 Mbps (MII interface) | — |
| पैकेज | 357-PBGA (25x25 mm) | 357-pin PBGA, 25 x 25 mm |
| ऑपरेटिंग तापमान रेंज | -40C to +85C (industrial, 'PC' suffix) | — |
| Lead Status | Contains Lead | — |
| RoHS स्थिति | Non-Compliant (contains lead) | RoHS compliant |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface mount |
| लाइफसाइकिल स्थिति | End of Life | — |
| Core Count | — | 1 core |
| Processor Architecture | — | RISC, 32-bit |
| Operating Speed | — | 50 MHz |
| सप्लाई वोल्टेज | — | 3.3 V |
| Package Type | — | 357-BBGA |
| Packaging | — | Tray |
| Lead-Free Status | — | Lead free |
| Application Category | — | Communications and networking controllers |
| ऑपरेटिंग तापमान | — | [DATA_NEEDED: operating temperature range] |
| Memory Configuration | — | [DATA_NEEDED: internal and external memory configuration] |
| I/O Interfaces | — | [DATA_NEEDED: communications and peripheral interfaces] |
| Power Consumption | — | [DATA_NEEDED: power consumption conditions] |
| Clocking and Reset | — | [DATA_NEEDED: clock and reset requirements] |
| Pinout | — | [DATA_NEEDED: complete 357-ball assignment] |