MPC860PCZQ50D4 vs MPC860TCVR50D4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC860PCZQ50D4 disebabkan oleh NXP Semiconductors dan MPC860TCVR50D4 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP
MPC860PCZQ50D4 ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | MPC860PCZQ50D4 | MPC860TCVR50D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Akhir Hidup |
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU | MPC8xx PowerQUICC 32-bit microprocessor |
| Core Architecture | PowerPC 603 (32-bit, no FPU) | — |
| Core Frequency | 50 MHz | — |
| Number of Cores | 1 (CPU + CPM RISC engine) | — |
| Operating Voltage - I/O | 3.3 V | — |
| Internal Core Voltage | 2.2 V or 1.8 V (selection required) | — |
| Process Technology | 0.32 micron CMOS | 0.32 micrometer |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| MMU | Yes (32-bit virtual addressing) | — |
| On-chip Ethernet MAC | 2x 10/100 Mbps (MII interface) | — |
| Kemasan | 357-PBGA (25x25 mm) | 357-pin PBGA, 25 x 25 mm |
| Gambaran Suhu Operasi | -40C to +85C (industrial, 'PC' suffix) | — |
| Lead Status | Contains Lead | — |
| Status RoHS | Non-Compliant (contains lead) | RoHS compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface mount |
| Status Lingkungan Hidup | End of Life | — |
| Core Count | — | 1 core |
| Processor Architecture | — | RISC, 32-bit |
| Operating Speed | — | 50 MHz |
| Tegangan Pemberi Arus | — | 3.3 V |
| Package Type | — | 357-BBGA |
| Packaging | — | Tray |
| Lead-Free Status | — | Lead free |
| Application Category | — | Communications and networking controllers |
| Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |
| Memory Configuration | — | [DATA_NEEDED: internal and external memory configuration] |
| I/O Interfaces | — | [DATA_NEEDED: communications and peripheral interfaces] |
| Power Consumption | — | [DATA_NEEDED: power consumption conditions] |
| Clocking and Reset | — | [DATA_NEEDED: clock and reset requirements] |
| Pinout | — | [DATA_NEEDED: complete 357-ball assignment] |