MPX2102DP vs MPX2100D तुलना
विस्तृत दोनों ओर की तुलना MPX2102DP द्वारा NXP Semiconductors और MPX2100D द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MPX2102DP - 100kPa Differential Pressure Sensor, 4-SIP | NXP
MPX2102DP ⚠ अंतिम खरीदविशेषता तुलना
| पैरामीटर | MPX2102DP | MPX2100D |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Pressure Sensors | Pressure Sensors |
| लाइफसाइकिल स्थिति | अंतिम बार खरीदें | सक्रिय |
| सेंसर प्रकार | Piezoresistive Pressure Sensor | — |
| Pressure Type | Differential (Dual Port) | Differential |
| Operating Pressure Range | 0 kPa to 100 kPa (0 PSI to 14.5 PSI) | 0 kPa to 100 kPa (0 to 14.5 psi) |
| Full-Scale Output | 0 mV to 40 mV at 10 V excitation | — |
| Supply Voltage (Excitation) | 10 V typical (max specified separately) | — |
| Port Size | Male, 0.19" (4.93 mm) tube, Dual | — |
| ऑपरेटिंग तापमान रेंज | -40 °C to +125 °C | -40C to +125C [DATA_NEEDED: confirm exact range from datasheet] |
| Compensated Temperature Range | 0 °C to +85 °C | — |
| पैकेज / केस | 4-SIP Module (Unibody) | — |
| Termination Style | Through-Hole PCB | — |
| आउटपुट प्रकार | Analog Wheatstone Bridge (ratiometric mV) | Analog ratiometric Wheatstone bridge (millivolts) |
| Technology | On-chip Temperature Compensated Silicon | Silicon piezoresistive MEMS strain-gauge bridge |
| Linearity | [DATA_NEEDED: typical linearity %FS] | 0.1% to 0.3% typical [DATA_NEEDED: confirm] |
| Sensitivity | [DATA_NEEDED: mV/V typical] | — |
| माउंटिंग प्रकार | Through-Hole, Dual Vertical Port | Through-hole SIP module |
| Series | MPX2102 | — |
| Full-Scale Span (Typical) | — | 40 mV at 10 V excitation |
| Sensitivity (Nominal) | — | 0.4 mV/kPa |
| Supply Voltage (Recommended) | — | 10 V DC |
| Supply Voltage (Maximum) | — | 16 V DC |
| Pressure Port Configuration | — | Dual axial ports (differential) |
| पैकेज | — | 4-SIP Unibody (UNIBODY4F), 2.54 mm pitch |
| Package Body Dimensions | — | 15.56 mm x 15.56 mm x 5.33 mm |
| On-Chip Temperature Compensation | — | Yes (factory laser-trimmed) |
| RoHS स्थिति | — | Compliant [DATA_NEEDED: confirm from NXP product page] |
| Diaphragm Material | — | Silicon [DATA_NEEDED: confirm] |