MPX2102DP vs MPX2100D Perbandingan
Perbandingan bersamaan detil MPX2102DP dari NXP Semiconductors dan MPX2100D dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPX2102DP - 100kPa Differential Pressure Sensor, 4-SIP | NXP
MPX2102DP ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MPX2102DP | MPX2100D |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Aktif |
| Tipe Pengukur | Piezoresistive Pressure Sensor | — |
| Pressure Type | Differential (Dual Port) | Differential |
| Operating Pressure Range | 0 kPa to 100 kPa (0 PSI to 14.5 PSI) | 0 kPa to 100 kPa (0 to 14.5 psi) |
| Full-Scale Output | 0 mV to 40 mV at 10 V excitation | — |
| Supply Voltage (Excitation) | 10 V typical (max specified separately) | — |
| Port Size | Male, 0.19" (4.93 mm) tube, Dual | — |
| Rentang Suhu Kerja | -40 °C to +125 °C | -40C to +125C [DATA_NEEDED: confirm exact range from datasheet] |
| Compensated Temperature Range | 0 °C to +85 °C | — |
| Paket / Case | 4-SIP Module (Unibody) | — |
| Termination Style | Through-Hole PCB | — |
| Tipe Output | Analog Wheatstone Bridge (ratiometric mV) | Analog ratiometric Wheatstone bridge (millivolts) |
| Technology | On-chip Temperature Compensated Silicon | Silicon piezoresistive MEMS strain-gauge bridge |
| Linearity | [DATA_NEEDED: typical linearity %FS] | 0.1% to 0.3% typical [DATA_NEEDED: confirm] |
| Sensitivity | [DATA_NEEDED: mV/V typical] | — |
| Tipe Mounting | Through-Hole, Dual Vertical Port | Through-hole SIP module |
| Series | MPX2102 | — |
| Full-Scale Span (Typical) | — | 40 mV at 10 V excitation |
| Sensitivity (Nominal) | — | 0.4 mV/kPa |
| Supply Voltage (Recommended) | — | 10 V DC |
| Supply Voltage (Maximum) | — | 16 V DC |
| Pressure Port Configuration | — | Dual axial ports (differential) |
| Paket | — | 4-SIP Unibody (UNIBODY4F), 2.54 mm pitch |
| Package Body Dimensions | — | 15.56 mm x 15.56 mm x 5.33 mm |
| On-Chip Temperature Compensation | — | Yes (factory laser-trimmed) |
| Status RoHS | — | Compliant [DATA_NEEDED: confirm from NXP product page] |
| Diaphragm Material | — | Silicon [DATA_NEEDED: confirm] |